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Warning, /Geometry/HGCalTBCommonData/data/TB180/hgcal.xml is written in an unsupported language. File is not indexed.

0001 <?xml version="1.0"?>
0002 <DDDefinition xmlns="http://www.cern.ch/cms/DDL" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.cern.ch/cms/DDL ../../../../DetectorDescription/Schema/DDLSchema.xsd">
0003 
0004 <ConstantsSection label="hgcal.xml" eval="true">
0005   <Constant name="rmin"       value="0.0*fm"/>
0006   <Constant name="rmax"       value="50.0*cm"/>
0007   <Constant name="zmin"       value="-1.0*cm"/>
0008   <Constant name="zmax"       value="124.511*cm"/>
0009   <Constant name="rminEE"     value="0.0*fm"/>
0010   <Constant name="rmaxEE"     value="8.0*cm"/>
0011   <Constant name="zminEE1"    value="36.647*cm"/>
0012   <Constant name="zmaxEE1"    value="36.953*cm"/>
0013   <Constant name="zminEE2"    value="122.7*cm"/>
0014   <Constant name="zmaxEE2"    value="124.2*cm"/>
0015   <Constant name="rmaxEEF"    value="9.5*cm"/>
0016   <Constant name="thPCB"      value="1.6*mm"/>
0017   <Constant name="thKapton"   value="0.01*mm"/>
0018   <Constant name="thAbsEE"    value="1.2*mm"/>
0019   <Constant name="thAbsCuEE"  value="1.15*mm"/>
0020   <Constant name="WaferW"     value="123.7*mm"/>
0021   <Constant name="tan30deg"   value="tan(30.0*deg)"/>
0022 </ConstantsSection>
0023 
0024 <MaterialSection label="hgcal.xml">
0025   <CompositeMaterial name="WCu" density="14.979*g/cm3" symbol=" " method="mixture by weight">
0026     <MaterialFraction fraction="0.75">
0027       <rMaterial name="materials:Tungsten"/>
0028     </MaterialFraction>
0029     <MaterialFraction fraction="0.25">
0030       <rMaterial name="materials:Copper"/>
0031     </MaterialFraction>
0032   </CompositeMaterial>
0033 </MaterialSection>
0034 
0035 <SolidSection label="hgcal.xml">
0036   <Polycone name="HGCal"    startPhi="0*deg" deltaPhi="360*deg">
0037     <ZSection z="[zmin]"    rMin="[rmin]" rMax="[rmax]"/>
0038     <ZSection z="[zmax]"    rMin="[rmin]" rMax="[rmax]"/>
0039   </Polycone>
0040   <Polycone name="HGCalEE1" startPhi="0*deg" deltaPhi="360*deg">
0041     <ZSection z="[zminEE1]" rMin="[rminEE]" rMax="[rmaxEE]"/>
0042     <ZSection z="[zmaxEE1]" rMin="[rminEE]" rMax="[rmaxEE]"/>
0043   </Polycone>
0044   <Polycone name="HGCalEE2" startPhi="0*deg" deltaPhi="360*deg">
0045     <ZSection z="[zminEE2]" rMin="[rminEE]" rMax="[rmaxEE]"/>
0046     <ZSection z="[zmaxEE2]" rMin="[rminEE]" rMax="[rmaxEE]"/>
0047   </Polycone>
0048   <Polyhedra name="HGCalPCB" numSide="6" startPhi="330*deg" deltaPhi="360*deg">
0049     <ZSection z="-[thPCB]/2" rMin="0*fm" rMax="[WaferW]/2"/>
0050     <ZSection z= "[thPCB]/2" rMin="0*fm" rMax="[WaferW]/2"/>
0051   </Polyhedra>
0052   <Polyhedra name="HGCalKapton" numSide="6" startPhi="330*deg" deltaPhi="360*deg">
0053     <ZSection z="-[thKapton]/2" rMin="0*fm" rMax="[WaferW]/2"/>
0054     <ZSection z= "[thKapton]/2" rMin="0*fm" rMax="[WaferW]/2"/>
0055   </Polyhedra>
0056   <Polyhedra name="HGCalEEAbs" numSide="6" startPhi="330*deg" deltaPhi="360*deg">
0057     <ZSection z="-[thAbsEE]/2" rMin="0*fm" rMax="[WaferW]/2"/>
0058     <ZSection z= "[thAbsEE]/2" rMin="0*fm" rMax="[WaferW]/2"/>
0059   </Polyhedra>
0060   <Polyhedra name="HGCalEECuAbs" numSide="6" startPhi="330*deg" deltaPhi="360*deg">
0061     <ZSection z="-[thAbsCuEE]/2" rMin="0*fm" rMax="[WaferW]/2"/>
0062     <ZSection z= "[thAbsCuEE]/2" rMin="0*fm" rMax="[WaferW]/2"/>
0063   </Polyhedra>
0064 </SolidSection>
0065 
0066 <LogicalPartSection label="hgcal.xml">
0067   <LogicalPart name="HGCal" category="unspecified">
0068     <rSolid name="HGCal"/>
0069     <rMaterial name="materials:Air"/>
0070   </LogicalPart>
0071   <LogicalPart name="HGCalEE1" category="unspecified">
0072     <rSolid name="HGCalEE1"/>
0073     <rMaterial name="materials:Air"/>
0074   </LogicalPart>
0075   <LogicalPart name="HGCalEE2" category="unspecified">
0076     <rSolid name="HGCalEE2"/>
0077     <rMaterial name="materials:Air"/>
0078   </LogicalPart>
0079   <LogicalPart name="HGCalEEPCB" category="unspecified">
0080     <rSolid name="HGCalPCB"/>
0081     <rMaterial name="materials:G10"/>
0082   </LogicalPart>
0083   <LogicalPart name="HGCalEEKapton" category="unspecified">
0084     <rSolid name="HGCalKapton"/>
0085     <rMaterial name="materials:Kapton"/>
0086   </LogicalPart>
0087   <LogicalPart name="HGCalEEAbsorber" category="unspecified">
0088     <rSolid name="HGCalEEAbs"/>
0089     <rMaterial name="hgcal:WCu"/>
0090   </LogicalPart>
0091   <LogicalPart name="HGCalCuEEAbsorber" category="unspecified">
0092     <rSolid name="HGCalEECuAbs"/>
0093     <rMaterial name="materials:Copper"/>
0094   </LogicalPart>
0095 </LogicalPartSection>
0096 
0097 <PosPartSection label="hgcal.xml">
0098   <PosPart copyNumber="1">
0099     <rParent name="cms:CMSE"/>
0100     <rChild name="hgcal:HGCal"/>
0101   </PosPart>
0102   <PosPart copyNumber="1">
0103     <rParent name="hgcal:HGCal"/>
0104     <rChild name="hgcal:HGCalEE1"/>
0105     <rRotation name="rotations:R090"/>
0106   </PosPart>
0107   <PosPart copyNumber="1">
0108     <rParent name="hgcal:HGCal"/>
0109     <rChild name="hgcal:HGCalEE2"/>
0110     <rRotation name="rotations:R090"/>
0111   </PosPart>
0112 </PosPartSection>
0113 </DDDefinition>