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TEC MODULES
============

$$  This includes all the volumes that make up the TEC modules

Input file for mixture.f
Start new mixtures with a '#' in the first column
Start the components with a '*' in the first column
You can type any kind of comment in as long as you don't start it
with '#' or '*' !
.....................................................................
For mixture declaration: Name of Mixture, Name of GMIX for title file, 
                         Monte Carlo Volume, MC Area
For items in a compound: Item number, Comment, Material (has to be 
                 written exactly as in material.input file), 
                 Volume, Multiplicity, Type
      Type is one of the following:  SUP for support
                                     SEN for sensitive volumes
                                     CAB for cables
                                     COL for cooling
                                     ELE for electronics
..................................................................... 

o  Hybrid for TEC rings 3,4,6,7 
   --------------------------
Hybrids have 4 APVs
Dimensions 65.2 x 30 mm^2 = 19.56 cm^2

MCVolume: 65.2 x 25.26 x 0.68 = 1119.93 mm^3

 Composition of the Hybrids taken from TOB layers 1-2

(1) Hybrid reviewed November 2006 - Central Hybrid (no kapton tail, which is in ICC* material definition, see below)
	see http://www.fynu.ucl.ac.be/he/cms/activities/tracker/FHITfiles/CCTPHybrides.pdf
	- Kapton: (25+25) um = 50 um = 0.0050 cm --> 0.075 cm^3
	- Copper: (18+12+18+18+18+12) um = 96 um = 0.0096 cm --> 0.144 cm^3
	- Solder Mask: 20 um = 0.0020 cm --> 0.030 cm^3
	- Glue: (50+50) um = 100 um thickness = 0.0100 cm --> 0.150 cm^3 
		[WAS (1) new FR4 hybrid
		Estimate: 300 mu FR4,
	          3 x 25 mu Cu
	          ~300 mu Kapton 
		-Pt-Au layer: tbd  ]
(2) Hybrid components
    R: (14 + n_APV)   0402 size  material: carbon   -> 18 
    C: 2 x 1206 large ones
       (5 + 2*n_APV)  0402 size    -> 13
                 0402: (1 x 0.5 x 0.5) mm^3 = 0.25 mm^3 = 0.25 x 10^-3 cm^3
                 1206: (3 x 1.5 x 1.5) mm^3 = 6.75 mm^3 = 6.75 x 10^-3 cm^3
    APV25:     (7.1 x 8.1 x 0.3) mm^3 = 17.253 mm^3 = 0.017253 cm^3     4 per hybrid REVIEWED November 2006 OK
    PLL:       (4.0 x 4.0 x 0.3) mm^3 = 4.8 mm^3 = 0.0048 cm^3          1 per hybrid REVIEWED November 2006 OK
			(see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/PauloMoreira/PLL25%20User%20Manua2.1.pdf)
    MUX:       (5.0 x 5.0 x 0.3) mm^3 = 7.5 mm^3 = 0.0075 cm^3          1 per hybrid REVIEWED November 2006 OK
			(see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/LVDSMUX3_datasheet.pdf)
    		[WAS PLL+MUX  : 2.0 x 7.1 x 0.3 mm^3     1 per hybrid ]
http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/manuals.htm
    DCU  :     (2.0 x 2.0 x 0.3) mm^3 = 1.2 mm^3 = 0.0012 cm^3          1 per hybrid REVIEWED November 2006 OK
			(see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/Magazzu/DCUF_User_Manual_v3.0.pdf)
(3) Wire bonds
	http://cms.ct.infn.it/bonding/bondspec.htm
		Al, 1% Si, 25 um diameter, medium hardness
		tail length visible but short < 50 um
	1 wire bond: average of 4 mm length diameter 25 um + 1 tail =
			= { [ pi x (0.025/2)^2 ] mm^2 x 4 mm } + { [ pi x (0.025/2)^2 ] mm^2 x 0.050 mm } =
			= [1.963x10^-3 mm^3] + [0.0245x10^-3 mm^3] = 2.0x10^-3 mm^3 = 2.0x10^-6 cm^3 [99% Aluminium + 1% Silicon]
		PA bias line to sensor bias ring: 5 bonds
		PA to hybrid: nAPV x 128 bonds
		PA to sensor: nAPV x 128 bonds
	TOTAL: 2x128xnAPV+5 bonds = 1029 bonds

In the TEC we mix the ceramic support into the hybrid.
(4) Ceramic support
	Area from the technical drawings: 19.55 cm^2
	Volume: 19.55 x 0.0387 = 0.7566 cm^3

MC volume has been rescaled to give proper density: rho = 4.853 g/cm^3
......................................................................
# "TEC Hybrid Rings 3/4/5/7"        "TEC_Hybrid4APV"  0.9767     19.56
Central Hybrid (no tail)
* 1  "Central Hybrid Kapton"      "T_Kapton"        0.075       1 ELE
* 2  "Central Hybrid Copper"      "Copper"          0.144       1 ELE
* 3  "Central Hybrid Solder Mask" "T_Kapton"        0.030       1 ELE
* 4  "Central Hybrid Glue"        "Epoxy"           0.150       1 ELE
Components:  Resistors
* 5  "Resistors"                  "Carbon"          0.25E-3    18 ELE
* 6  "R metal"                    "SMD_metal"       1.E-4      18 ELE
Capacitors
* 7  "Small caps"                 "Alumina"         0.25E-3    13 ELE
* 8  "C metal"                    "SMD_metal"       1.E-4      13 ELE
* 9  "Large caps"                 "Alumina"         6.75E-3     2 ELE
* 10 "C metal large"              "SMD_metal"       1.E-3       2 ELE
* 11 "APV25"                      "Silicon"         0.017253    4 ELE
* 12 "PLL"                        "Silicon"         4.8E-3      1 ELE
* 13 "MUX"                        "Silicon"         7.5E-3      1 ELE
* 14 "DCU"                        "Silicon"         1.2E-3      1 ELE
Wire bonds
* 15 "Wire bonds"                 "Aluminium"       1.98E-6  1029 ELE
* 16 "Wire bonds"                 "Silicon"         0.02E-6  1029 ELE
Support
* 17 "Ceramic Support"			  "Ceramic"         0.7033 		1 SUP
..................................................................
==================================================================

o  Hybrid for TEC rings 1,2,5
   ----------------------------
Taken from TOB Layers 5-6

Hybrids have 6 APVs

as above, except: 
(2) Hybrid components
    R: (14 + n_APV)   0402 size  material: carbon   -> 20 
    C: 2 x 1206 large ones
       (5 + 2xn_APV)  0402 size    -> 17
(3) Wire bonds
	see above for details
	TOTAL: 2x128xnAPV+5 bonds = 1541 bonds

MC volume has been rescaled to give proper density: rho = 4.853 g/cm^3
......................................................................
# "TEC Hybrid Rings 1/2/5"        "TEC_Hybrid6APV"  0.9961     19.56
Central Hybrid (no tail)
* 1  "Central Hybrid Kapton"      "T_Kapton"        0.075       1 ELE
* 2  "Central Hybrid Copper"      "Copper"          0.144       1 ELE
* 3  "Central Hybrid Solder Mask" "T_Kapton"        0.030       1 ELE
* 4  "Central Hybrid Glue"        "Epoxy"           0.150       1 ELE
Components:  Resistors
* 5  "Resistors"                  "Carbon"          0.25E-3    20 ELE
* 6  "R metal"                    "SMD_metal"       1.E-4      20 ELE
Capacitors
* 7  "Small caps"                 "Alumina"         0.25E-3    17 ELE
* 8  "C metal"                    "SMD_metal"       1.E-4      17 ELE
* 9  "Large caps"                 "Alumina"         6.75E-3     2 ELE
* 10 "C metal large"              "SMD_metal"       1.E-3       2 ELE
* 11 "APV25"                      "Silicon"         0.017253    6 ELE
* 12 "PLL"                        "Silicon"         4.8E-3      1 ELE
* 13 "MUX"                        "Silicon"         7.5E-3      1 ELE
* 14 "DCU"                        "Silicon"         1.2E-3      1 ELE
Wire bonds
* 15 "Wire bonds"                 "Aluminium"       1.98E-6  1541 ELE
* 16 "Wire bonds"                 "Silicon"         0.02E-6  1541 ELE
Support
* 17 "Ceramic Support"			  "Ceramic"         0.7033 		1 SUP

......................................................................
==================================================================

 Pitch adapter
  -------------
  -> Using Volume/Area of the Ring5N PA!

(1) PA:
  Material Description from SCHOTT
  MC Area 16.01 cm^2 (from technical drawings)
  MC Volume 16.01 x 0.0665 = 1.0647 cm^3
(2)Spacer:
  Mixed into the PA
  correct Volume: 3.63 cm^2 x 0.0209 cm = 0.07588 cm^3

...................................................................
# "TEC pitch adapter"    "TEC_PitchAdapter"       1.0647      16.01
* 1 "Silicon"			 "Silicon"        2.802E-1    1  ELE
* 2 "Sodium" 			 "Sodium"	  1.001E-1    1  ELE
* 3 "Potassium" 		 "Potassium"	  1.391E-1    1  ELE
* 4 "Zinc" 		 	 "Zinc"	          1.360E-2    1  ELE
* 5 "Aluminium" 		 "Aluminium"	  1.770E-2    1  ELE
* 6 "Titanium" 			 "Titanium"	  1.138E-2    1  ELE
* 7 "Antimony" 			 "Antimony"	  1.476E-3    1  ELE
* 8 "Chromium" 			 "Chromium"	  2.826E-6    1  ELE
* 9 "Oxygen" 			 "Oxygen"         7.147E+2    1  ELE
* 10 "Boron" 			 "Bor 11"         2.255E-2    1  ELE
* 11 "Spacer" 			 "Ceramic"        0.0714      1  SUP

....................................................................
====================================================================

o Module frame legs Rings 1 to 4
  -------------------------------
  Using Data from R3N

  Note:
  The Side Frames are constructed after the iso-side. Additional material on the bias side isa
  added via the supportboxes and the tail (in petals)
  
  MC Area: 18.22*0.96 cm^2
  MC Volume: 1.3056 cm^3
  	
  (1) Carbon frame (graphite)
	  Volume 18.22 x 0.0764 = 1.392 cm^3
   
  ISO-Kapton
  Volume 18.22 x 0.0258 = 0.470 cm^3
  This devides into:
  (2)  Copper traces 2.3925 x 0.0035 = 0.00837 cm^3
  (3)  Gold  1.99414 x 0.00001 = 0.00002 cm^3
  (4)  Nickel 1.9941 x 0.0004 = 0.0008 cm^3
  (5) rest -> kapton : 0.4608 cm^3
      
  silver glue and components are neglected due to missing measurements

...................................................................
# "TEC frame legs 1 to 4" "TEC_frame_side_1_4"    1.3056    18.22
* 1 "Carbon frame"	  "Carbon"     		  1.402    1    SUP
* 2 "Copper traces"       "Copper"                0.0084   1    ELE
* 3 "Gold"		  "Gold"		  0.00002  1    ELE
* 4 "Nickel"		  "Nickel"		  0.0008   1    ELE
* 5 "LV Kapton"           "T_Kapton"              0.4608   1    ELE

...................................................................
====================================================================  
o Module frame legs Rings 5 to 7
  -------------------------------
  Using Data from R7N

  Note:
  The Side Frames are constructed after the iso-side. Additional material on the bias side is
  added via the supportboxes and the tail (in petals)
  
  MC Area: 32.25*0.96 cm^2
  MC Volume: 2.3688 cm^3
  	
  (1) Carbon fibre frame 
	  Volume (32.25+5.33) x 0.0764 = 2.871 cm^3
    -> but adjusted carbon fibre volume to reproduce measured mass of 3.095 g
	  per leg
   
  ISO-Kapton
  Volume 32.25 x 0.0258 = 0.832 cm^3
  This devides into:
  (2)  Copper 3.03469 x 0.0035  = 0.01062 cm^3
  (3)  Gold   1.70505 x 0.00001 = 0.00002 cm^3
  (4)  Nickel 1.7051  x 0.0004  = 0.00068 cm^3
  (5) rest -> kapton : 0.82068  cm^3
      
  silver glue and components are neglected due to missing measurements

...................................................................
# "TEC frame legs 5 to 7" "TEC_frame_side_5_7"    2.3688     32.25
* 1 "Carbon fiber frame"  "Carbon fibre str."     1.8314   1    SUP
* 2 "Copper traces"       "Copper"                0.01062  1    ELE
* 3 "Gold"		  "Gold"		  0.00002  1    ELE
* 4 "Nickel"		  "Nickel"		  0.00068  1    ELE
* 5 "LV Kapton"           "T_Kapton"              0.82068  1    ELE

...................................................................
 ===================================================================  


o Supplies Boxes
  -------------------------------
  Usind data from R3N
  MC Area:   4.78 cm^2
  MC Volume: 4.78 x 0.0258 = 0.123 cm^3
  
  (1 to 3) from kaptonaufteilung.ods  by minimizing the standarad diviation which is still 18.8%
  (4) rest 
  (5) from silver glue 12.5 mg / 1049 mg/cm^3 = 0.01191

MC volume has been rescaled to give proper density: rho = 1.42g/cm^3
...................................................................
# "TEC Sideframe Supplies Box"	"TEC_SideFrSupBox"	0.2467	4.78
* 1 "Copper traces"       "Copper"                0.00639  1    ELE
* 2 "Gold"		  "Gold"		  0.00002  1    ELE
* 3 "Nickel"		  "Nickel"		  0.00061  1    ELE
* 4 "LV Kapton"           "T_Kapton"              0.11598  1    ELE
* 5 "Silver"		  "Silver"		  0.01192  1    ELE
...................................................................
===================================================================  

o Si-Reinforcement
 -------------------------------
  using Data from R1N
  MC Area: 3.35 cm^2
  MC Volume: 3.35 x 0.387 = 1.296 cm^3

  Is made out of ceramic

MC volume has been rescaled to give proper density: rho = 3.731 g/cm^3
...................................................................
# "SiReenforcment"		"TEC_SiReenforcment"	1.3773	3.35
* 1 "Ceramic"			"Ceramic"		1.296 	1 SUP

...................................................................
 ===================================================================  


o TEC frame at the module top
  ---------------------------

  MC Volume: Width of the module x 3.72 x 0.1 cm
  Actual volume is about that minus 10 %

  (1)  Carbon
   Top frame always consists of graphite.

MC volume has been rescaled to give proper density: rho = 1.931 g/cm^3
....................................................................
# "TEC module frame top"        "TEC_frame_top"    0.3928      3.72
* 1 "TEC frame top"             "Carbon"           0.3348   1  SUP
....................................................................
=====================================================================  

# "END"  "END"  0.  0.   
this has to be the last line !