|
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
209
210
211
212
213
214
215
216
217
218
219
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
235
236
237
238
239
240
241
242
243
244
245
246
247
248
249
250
251
252
253
254
255
256
257
258
259
260
|
TIB TID COMMON COMPONENTS
=========================
$$ This includes all the volumes that make up the TIB modules
$$ as well as the electronics on the module string !
Input file for mixture.f
Start new mixtures with a '#' in the first column
Start the components with a '*' in the first column
You can type any kind of comment in as long as you don't start it
with '#' or '*' !
.....................................................................
For mixture declaration: Name of Mixture, Name of GMIX for title file,
Monte Carlo Volume, MC Area
For items in a compound: Item number, Comment, Material (has to be
written exactly as in material.input file),
Volume, Multiplicity, type
Type is one of the following: SUP for support
SEN for sensitive volumes
CAB for cables
COL for cooling
ELE for electronics
.....................................................................
... EM 18Jun07
... This file should include materials common to TIB and TID
... By now only CCUM is actually commonly defined
... as MCvolume of TIB hybrids are twice those of TID hybrids
o TIB/TID CCUM
------------
20071014 GSguazzoni
MCVolume: 3.2cm*2.3cm*0.8cm = 5.89cm^3 ~ 6.0cm^3
Composition mostly inferred from TOB
SMD passive components neglected
......................................................................
# "CCUM" "TIBTID_CCUM" 6.00000 -1.
* 1 "PCB Copper" "Copper" 1.17760 0.090 ELE
* 2 "PCB FR4" "T_FR4" 1.17760 0.910 ELE
* 3 "ASIC CCU Si" "Silicon" 0.01512 1 ELE
* 4 "ASIC CCU SnPbAg" "SMD_metal" 0.01331 1 ELE
* 5 "ASIC CCU EMC" "Epoxy" 0.31905 1 ELE
* 6 "ASIC DCU Si" "Silicon" 0.00140 1 ELE
* 7 "ASIC DCU Cu" "Copper" 0.00255 1 ELE
* 8 "ASIC DCU EMC" "Epoxy" 0.01206 1 ELE
* 9 "ASIC LVDSMux Si" "Silicon" 0.00140 1 ELE
* 10 "ASIC LVDSMux Cu" "Copper" 0.00439 1 ELE
* 11 "ASIC LVDSMux EMC" "Epoxy" 0.02084 1 ELE
* 12 "Connectors case" "Polyethylene" 0.84211 1 ELE
* 13 "Connectors pins" "T_Bronze" 0.06749 1 ELE
......................................................................
======================================================================
o TIB/TID DOH
-----------
20071014 GSguazzoni
MCVolume: 0.5*2.2*3.5 cm^3
......................................................................
# "DOH" "TIBTID_DOH" 3.85000 -1.
* 1 "PCB FR4" "T_FR4" 0.41059 1 ELE
* 2 "PCB Copper traces" "Copper" 0.06384 1 ELE
* 3 "NAIS Conn case" "Polyethylene" 0.14105 1 ELE
* 4 "NAIS Conn pins" "T_Bronze" 0.00940 1 ELE
* 5 "Resistors" "Ceramic" 0.00111 1 ELE
* 6 "Capacitors" "Barium_Titanate" 0.00565 1 ELE
* 7 "ASICs EMC" "Epoxy" 0.04154 1 ELE
* 8 "ASICs Copper" "Copper" 0.00882 1 ELE
* 9 "Laser" "Silicon" 0.02106 2 ELE
* 10 "Optodiodes" "Ceramic" 0.03000 2 ELE
* 11 "Optodiodes" "Brass" 0.01414 2 ELE
* 12 "Fiber holder" "T_FR4" 0.38800 1 ELE
* 13 "Plastic stuff" "Polyethylene" 0.15789 1 ELE
......................................................................
======================================================================
o TIB/TID Pitch Adapter and ceramic
---------------------------------
20071013 GSguazzoni
MCVolume: 1cm*1cm*1.13mm = 0.1130 cm^3
(1) Glass thickness: 550 micron
(2) Ceramic thickness: 380 micron
(3) Glue thickness: 170 micron
Volumes per square centimeter (1130 micron thickness)
......................................................................
# "PA per cm2" "TIBTID_PA" 0.11300 -1.
* 1 "Glass" "Borosilicate_Glass" 0.05500 1 ELE
* 2 "Ceramic" "Ceramic" 0.03800 1 ELE
* 3 "Glue" "Epoxy" 0.01692 1 ELE
......................................................................
======================================================================
o TIB/TID AOH
-----------
20071013 GSguazzoni
MCVolume: 0.5cm*2.3cm*3cm = 3.45 cm^3
(9) Number of laser transmitters is the TIB/TID weighted average
between 2-fibers AOHs and 3-fiber AOHs
......................................................................
# "AOH" "TIBTID_AOH" 3.45000 -1.
* 1 "PCB FR4" "T_FR4" 0.38224 1 ELE
* 2 "PCB Copper traces" "Copper" 0.05500 1 ELE
* 3 "NAIS Conn case" "Polyethylene" 0.31474 1 ELE
* 4 "NAIS Conn pins" "T_Bronze" 0.02016 1 ELE
* 5 "Resistors" "Ceramic" 0.00320 1 ELE
* 6 "Capacitors" "Barium_Titanate" 0.01528 1 ELE
* 7 "ASICs EMC" "Epoxy" 0.02080 1 ELE
* 8 "ASICs Copper" "Copper" 0.00480 1 ELE
* 9 "Laser" "Silicon" 0.02106 2.6 ELE
* 10 "Plastic stuff" "Polyethylene" 0.15789 1 ELE
......................................................................
======================================================================
o TIB/TID Amphenol flat cable (26cond) DOHM<=>MC (CCUM)
-----------------------------------------------------
20071014 GSguazzoni
MCVolume: 0.12 cm^3 ~ 0.1 cm^3
Volumes per cm
......................................................................
# "Amphenol cable 26cond per cm" "TIBTID_AmphCable" 0.10000 -1.
* 1 "Conductors" "Copper" 0.00050 26 CAB
* 2 "Insulation" "Polyethylene" 0.00191 26 CAB
* 3 "Sheath" "Polyethylene" 0.04368 1 CAB
......................................................................
======================================================================
o Hybrid Board
------------
Total weight from measurement.
Assume that for the TIB/TID most of the hybrids are the the type w/o the 25 um Kapton
stiffner midplane
For the thickness assume the nominal values described in
http://www.fynu.ucl.ac.be/he/cms/activities/tracker/FHITfiles/CCTPHybrides.pdf
and tune the thickness of the top layer (Cu-traces) to match the measured weight
Thickness of the layers given from top to bottom
(1) Cu 2+18+18+30 um
For the top layer: 2 um/30 um -> 7% occupancy
(2) Kapton 25+25 um
(3) Glue 75+50 um
(4) Ceramic 380 um
Values for 1 cm2 area
MCVolume: (1*.0623) = 0.0623 cm^3
.................................................................
# "TIB TID Hybrid Board" "TIBTID_HybridBoard" 0.0623 -1.
* 1 "Hybrid Copper traces" "Copper" 0.0068 1 ELE
* 2 "Hybrid Kapton layers" "T_Kapton" 0.0050 1 ELE
* 3 "Glue" "Silicone_Gel" 0.0125 1 ELE
* 4 "Ceramic" "Ceramic" 0.0380 1 ELE
.......................................................................
=======================================================================
o Hybrid Tails
------------
Total weight from measurement.
Thickness of the layers from top to bottom
For the thickness assume the nominal values described in
http://www.fynu.ucl.ac.be/he/cms/activities/tracker/FHITfiles/CCTPHybrides.pdf
(1) Cu 2+9 um
Top layer: same thickness as in the hybrid board
2nd layer: assume 50% of surface occupancy
(2) Kapton 25+25+25 um
Assume Kapton as Coverlay
(3) Glue 25+75 um
Values for 1 cm2 area
MCVolume: (1*.0186) = 0.0186 cm^3
.................................................................
# "TIB TID Hybrid Tails" "TIBTID_HybridTails" 0.0186 -1.
* 1 "Hybrid Copper traces" "Copper" 0.0011 1 CAB
* 2 "Hybrid Kapton layers" "T_Kapton" 0.0075 1 CAB
* 3 "Glue" "Silicone_Gel" 0.0100 1 CAB
.......................................................................
=======================================================================
o Hybrid
------
MCVolume: 47 (width) * 25.3 (height) * 1.130 (thickness) = 1343.7 mm^3
Same PV for TIB and TID
We use avearge values for 4/6 APV modules in the TIB+TID
4APVs modules: 1188 (TIB) + 240 (TID)
6APVs modules: 1536 (TIB) + 576 (TID)
Average number of APVs: n_APV = 5.2 per module
(1) Hybrid board
Wedge shaped piece. Surface = 11.02 cm^2 (rounded to 11 cm^2 below)
The ceramic extension in rPhi modules is accounted in the PitchAdapter material
(2-11) Hybrid components (from tec_module.in and tob_module.in)
APV25: 7.1 x 8.1 x 0.3 mm^3 n_APV per hybrid
PLL: 4.0 x 4.0 x 0.3 mm^3 = 4.8 mm^3 = 0.0048 cm^3 1 per hybrid REVIEWED November 2006 OK
(see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/PauloMoreira/PLL25%20User%20Manua2.1.pdf)
MUX: 5.0 x 5.0 x 0.3 mm^3 = 7.5 mm^3 = 0.0075 cm^3 1 per hybrid REVIEWED November 2006 OK
(see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/LVDSMUX3_datasheet.pdf)
DCU : 2.0 x 2.0 x 0.3 mm^3 = 1.2 mm^3 = 0.0012 cm^3 1 per hybrid REVIEWED November 2006 OK
(see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/Magazzu/DCUF_User_Manual_v3.0.pdf)
R: 0402 size material: carbon 14 + n_APV -> 19.2 per hybrid
C: 1206 size 2 2 per hybrid
0402 size 5 + 2*n_APV -> 15.4 per hybrid
0402: 1 x 0.5 x 0.5 mm^3
1206: 3 x 1.5 x 1.5 mm^3
.................................................................
# "TIB TID Hybrid" "TIBTID_Hybrid" 1.3437 -1.
* 1 "Hybrid Board" "TIBTID_HybridBoard" 0.0623 11 ELE
* 2 "APV25" "Silicon" 17.253E-3 5.2 ELE
* 3 "PLL" "Silicon" 4.8E-3 1 ELE
* 4 "MUX" "Silicon" 7.5E-3 1 ELE
* 5 "DCU" "Silicon" 1.2E-3 1 ELE
* 6 "Resistors" "Carbon" 2.5E-4 19.2 ELE
* 7 "R metal" "SMD_metal" 1.E-4 19.2 ELE
* 8 "Small caps" "Alumina" 2.5E-4 15.4 ELE
* 9 "C metal" "SMD_metal" 1.E-4 15.4 ELE
* 10 "Large caps" "Alumina" 0.00675 2 ELE
* 11 "C metal large" "SMD_metal" 1.E-3 2 ELE
.......................................................................
=======================================================================
# "END" "END" 0. 0.
this has to be the last line !
|