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TID Structure (anything but modules)
====================================
Input file for mixture.f
Start new mixtures with a '#' in the first column
Start the components with a '*' in the first column
You can type any kind of comment in as long as you don't start it
with '#' or '*' !
.....................................................................
For mixture declaration: Name of Mixture, Name of GMIX for title file,
Monte Carlo Volume, MC Area
For items in a compound: Item number, Comment, Material (has to be
written exactly as in material.input file),
Volume, Multiplicity, Type
Type is one of the following: SUP for support
SEN for sensitive volumes
CAB for cables
COL for cooling
ELE for electronics
.....................................................................
o TID support disks
-----------------
These are the disks that hold the sensor rings. They are 8 mm thick,
Nomex core of 7 mm and 0.5 mm CF skin each side
20071019 EM
[WAS: "TID_Nomex" -> "Nomex" ]
20080125 EM
Add fixation inserts.
Values for 1 ring:
- Inserts for "distanziali": inner 4+4
outer 5+5
Each insert: Al 0.92 g (measured)
Epoxy 1.07 g (from drawings and assuming a 0.15 mm clearance on the hole diameter)
- Inserts for DOHMs : 4x2 (from drawings)
Inserts for Mother Cables : 8x8 (guess...)
Each insert: Al 0.16 g values obtained scaling those for "module inserts" times the ratio of the volumes (about 1/3)
Epoxy 0.16 g
Total per ring: Al 0.92 x 18 + 0.16 x (8+64) = 28 g -> volume per ring V_al = 10.37 cm^3
Epoxy 1.07 x 18 + 0.16 x (8+64) = 31 g -> volume per ring V_epoxy = 23.85 cm^3
MCVolume: 1.0x1.0x0.8 cm^3
XML surface of 1 ring: pi*(50.9**2-22.5**2)= 6549 cm^2
Al 10.37/6549 * 1/0.8 = 1.98E-3 cm^3 per MCVolume
Epoxy 23.85/6549 * 1/0.8 = 4.55E-3 cm^3 per MCVolume
MCVolume w/o the inserts: 0.800-(0.0020+0.0045)=0.7935 cm^3
Nomex and CF skins rescaled according to their thickness (0.7 cm and 0.1 cm)
Nomex = 7/8 * 0.7395 = 0.6943 cm^3 per MCVolume
CF = 1/8 * 0.7395 = 0.0992 cm^3 per MCVolume
Numbers per unit area
.....................................................................
# "TID support disk" "TID_Mech" 0.8 -1.
* 1 "Nomex core" "Nomex" 694.3E-3 1 SUP
* 2 "CF skins" "Carbon fibre str." 99.2E-3 1 SUP
* 3 "Inserts (Al)" "Aluminium" 2.0E-3 1 SUP
* 4 "Inserts (Glue)" "Epoxy" 4.5E-3 1 SUP
....................................................................
=====================================================================
o Cooling pipes per cm (circular section)
--------------------
20070919 EM
[WAS: mixture name="TID_Cool_ring"]
MC Volume: OD = 0.35 cm, dz = 1 cm => 0.0962 cm^3
(1) Cooling pipes: material Al 3.5 mm OD, 2.8 mm ID [WAS: 3mm OD, 2.7 mm ID]
(2) Coolant: C6F14_F2_-30C
Volumes per cm
.....................................................................
# "TID Cooling Pipe per cm" "TID_CoolPipe" 0.0962 -1.
* 1 "Al pipe" "Aluminium" 0.0346 1 COL
* 2 "Coolant" "C6F14_F2_-30C" 0.0616 1 COL
.....................................................................
=====================================================================
o Cooling manifolds
-----------------
There are two of these per ring.
20070924 EM
MC Volume: Value per 1 cm length
1.0 x 0.8 x 1.0 cm^3 = 0.80 cm^3
[WAS: r = 46-49 cm, dz = 0.7 cm, dphi = 18.5 deg ==> 32.2 cm^3]
(2) Coolant : 0.6 x 0.8 x 1.0 = 0.48 cm^3
[WAS: 14 x 3 x 1.5 cm ==> 63 cm^3]
(1) Aluminium walls: 0.2 cm thick -> V_Al = 0.80 - 0.48 = 0.32 cm^3
[WAS: (0.05 cm thick): (16 x 1.6 x 0.05) x 2.5
+ 15 x 3 x 0.05 ==> 5.45 cm^3]
......................................................................
# "TID cooling manifolds per cm" "TID_CoolManifold" 0.80 -1.
* 1 "Aluminium walls" "Aluminium" 0.32 1 COL
* 2 "Coolant" "C6F14_F2_-30C" 0.48 1 COL
......................................................................
======================================================================
o TID support disk fixation
-------------------------
20070926 EM
The central disk/wheel (carrying ring 1) is fixed with Aluminium
fixations to the service cylinder in 3 points
MC Volume: 10.46 cm^3
[WAS: r = 46.2 - 51.2 cm, dz = 0.7 cm, dphi = 6.25 ==> 18.6 cm^3]
Material: "L" shaped CF piece with inserts in Aluminium.
Values estimated from sketch from M.Massa
(1) Carbon fiber structure: 22 g (V=13 cm^3)
(2) Aluminium inserts: 30 g (V=11 cm^3)
[WAS: Aluminium, approx. volume: 5*4*0.4 (in wheel) +
5*4*0.4 + 3.6*4*0.4 (on cyl.)
==> 21.76 cm^3]
.......................................................................
# "TID wheel fixations" "TID_WheelFixation" 10.46 -1
* 1 "CF L-shaped piece" "Carbon fibre str." 13.1 1 SUP
* 2 "Aluminium inserts" "Aluminium" 11.0 1 SUP
.......................................................................
=======================================================================
o TID ICB1
--------
1) Kapton:
2) Copper:
3) LVDSBUFF: 7 (r1a) + 6 (r1b) I.C. 8 pin SOIC 4x5x1.5 mm3
4) Connectors:
... but it is better to calculate the fraction of plastic/bronze per connector
Module HV 6 x SAMTEC CLP-105 10 pin 0.041 g Plastic, 0.046 g Bronze = 0.246 g Plastic + 0.276 g Bronze
Module LV 6 x SAMTEC CLP-110 20 pin 0.081 g Plastic, 0.092 g Bronze = 0.486 g Plastic + 0.552 g Bronze
CCU socket 2 x SAMTEC 20 pin [0.56 g, 65% Plastic + 35% Bronze] 0.364 g Plastic, 0.196 g Bronze = 0.728 g Plastic + 0.392 g Bronze
To DOHM 1 x ERNI 054595-26 26 pin [missing info on material] 0.273 g Plastic, 0.100 g Bronze = 0.273 g Plastic + 0.100 g Bronze
MC LV 1 x MOLEX 87438-0432 3 pin missing info 0.105 g Bronze ??
MC HV 1 x MOLEX 87438-1532 15 pin missing info 0.524 g Bronze ??
TOTAL Plastic: 1.733 g => 1.240 cm3 Kapton x2 (r1a+r1b)
TOTAL Bronze: 1.320 g => 0.149 cm3 Bronze x2 (r1a+r1b)
6) Resistors: 13 (r1a) + 11 (r1b) x size 0805 [2x1.25x0.45 mm3, 4.8 mg] Volume=1.125E-3 cm3
7-8) Capacitors: 13 (r1a) + 12 (r1b) x size 0805 [2x1.25x0.94 mm3, 16.8 mg] Volume=2.35E-3 cm3
Use values from Magazzu's page: Ni 0.7mg / BaTiO3 15.8 mg
9-10) Capacitors: 2 (r1a)0 + 2 (r1b) x size 1812 [4.5x3.2x2.5 mm3, 257 mg] Volume=36E-3 cm3
Use values from Magazzu's page: Ni 89.5mg / BaTiO3 166.4 mg
Values for R1A+R1B (180 deg sector)
......................................................................
# "TID MotherCable R1" "TID_ICB1" 45.250 -1
* 1 "Kapton" "T_Kapton" 17.131 2 ELE
* 2 "Cu traces" "Copper" 2.455 2 ELE
* 3 "IC Chips" "T_Kapton" 0.030 13 ELE
* 4 "Connector" "T_Kapton" 1.240 2 ELE
* 5 "Connector pins" "T_Bronze" 0.149 2 ELE
* 6 "Resistors (0805)" "Ceramic" 1.125E-3 24 ELE
* 7 "Capacitors (0805)" "Barium_Titanate" 1.86E-3 25 ELE
* 8 "Capacitors (0805)" "Nickel" 0.54E-3 25 ELE
* 9 "Capacitors (1812)" "Barium_Titanate" 27.6E-3 4 ELE
* 10 "Capacitors (1812)" "Nickel" 10.1E-3 4 ELE
......................................................................
======================================================================
o TID ICB2
--------
1) Kapton:
2) Copper:
3) LVDSBUFF: 7 (r2) + 7 (r2) I.C. 8 pin SOIC 4x5x1.5 mm3
4) Connectors:
... but it is better to calculate the fraction of plastic/bronze per connector
Module HV 6 x SAMTEC CLP-105 10 pin 0.041 g Plastic, 0.046 g Bronze = 0.246 g Plastic + 0.276 g Bronze
Module LV 6 x SAMTEC CLP-110 20 pin 0.081 g Plastic, 0.092 g Bronze = 0.486 g Plastic + 0.552 g Bronze
CCU socket 2 x SAMTEC 20 pin [0.56 g, 65% Plastic + 35% Bronze] 0.364 g Plastic, 0.196 g Bronze = 0.728 g Plastic + 0.392 g Bronze
To DOHM 1 x ERNI 054595-26 26 pin [missing info on material] 0.273 g Plastic, 0.100 g Bronze = 0.273 g Plastic + 0.100 g Bronze
MC LV 1 x MOLEX 87438-0432 3 pin missing info 0.105 g Bronze ??
MC HV 1 x MOLEX 87438-1532 15 pin missing info 0.524 g Bronze ??
TOTAL Plastic: 1.733 g => 1.240 cm3 Kapton x2 (r2+r2)
TOTAL Bronze: 1.320 g => 0.149 cm3 Bronze x2 (r2+r2)
6) Resistors: 13 (r2) + 13 (r2) x size 0805 [2x1.25x0.45 mm3, 4.8 mg] Volume=1.125E-3 cm3
7-8) Capacitors: 13 (r2) + 13 (r2) x size 0805 [2x1.25x0.94 mm3, 16.8 mg] Volume=2.35E-3 cm3
Use values from Magazzu's page: Ni 0.7mg / BaTiO3 15.8 mg
9-10) Capacitors: 2 (r2)0 + 2 (r2) x size 1812 [4.5x3.2x2.5 mm3, 257 mg] Volume=36E-3 cm3
Use values from Magazzu's page: Ni 89.5mg / BaTiO3 166.4 mg
Values for R2+R2 (180 deg sector)
......................................................................
# "TID MotherCable R2" "TID_ICB2" 49.073 -1
* 1 "Kapton" "T_Kapton" 18.391 2 ELE
* 2 "Cu traces" "Copper" 2.636 2 ELE
* 3 "IC Chips" "T_Kapton" 0.030 14 ELE
* 4 "Connector" "T_Kapton" 1.240 2 ELE
* 5 "Connector pins" "T_Bronze" 0.149 2 ELE
* 6 "Resistors (0805)" "Ceramic" 1.125E-3 26 ELE
* 7 "Capacitors (0805)" "Barium_Titanate" 1.86E-3 26 ELE
* 8 "Capacitors (0805)" "Nickel" 0.54E-3 26 ELE
* 9 "Capacitors (1812)" "Barium_Titanate" 27.6E-3 4 ELE
* 10 "Capacitors (1812)" "Nickel" 10.1E-3 4 ELE
......................................................................
======================================================================
o TID ICB3
--------
1) Kapton:
2) Copper:
3) LVDSBUFF: 5 (r3a) + 6 (r3b) I.C. 8 pin SOIC 4x5x1.5 mm3
4) Connectors:
... but it is better to calculate the fraction of plastic/bronze per connector
Module HV 5 x SAMTEC CLP-105 10 pin 0.041 g Plastic, 0.046 g Bronze = 0.205 g Plastic + 0.230 g Bronze
Module LV 5 x SAMTEC CLP-110 20 pin 0.081 g Plastic, 0.092 g Bronze = 0.405 g Plastic + 0.460 g Bronze
CCU socket 2 x SAMTEC 20 pin [0.56 g, 65% Plastic + 35% Bronze] 0.364 g Plastic, 0.196 g Bronze = 0.728 g Plastic + 0.392 g Bronze
To DOHM 1 x ERNI 054595-26 26 pin [missing info on material] 0.273 g Plastic, 0.100 g Bronze = 0.273 g Plastic + 0.100 g Bronze
MC LV 1 x MOLEX 87438-0432 3 pin missing info 0.105 g Bronze ??
MC HV 1 x MOLEX 87438-1532 15 pin missing info 0.524 g Bronze ??
TOTAL Plastic: 1.611 g => 1.153 cm3 Kapton
TOTAL Bronze: 1.182 g => 0.133 cm3 Bronze
6) Resistors: 10 (r3a) + 11 (r3b) x size 0805 [2x1.25x0.45 mm3, 4.8 mg] Volume=1.125E-3 cm3
7-8) Capacitors: 15 (r3a) + 16 (r3b) x size 0805 [2x1.25x0.94 mm3, 16.8 mg] Volume=2.35E-3 cm3
Use values from Magazzu's page: Ni 0.7mg / BaTiO3 15.8 mg
9-10) Capacitors: 1 (r3a) + 1 (r3b) x size 1812 [4.5x3.2x2.5 mm3, 257 mg] Volume=36E-3 cm3
Use values from Magazzu's page: Ni 89.5mg / BaTiO3 166.4 mg
Values for R3A+R3B (180 deg sector)
......................................................................
# "TID MotherCable R3" "TID_ICB3" 44.146 -1
* 1 "Kapton" "T_Kapton" 21.998 2 ELE
* 2 "Cu traces" "Copper" 3.152 2 ELE
* 3 "IC Chips" "T_Kapton" 0.030 11 ELE
* 4 "Connector" "T_Kapton" 1.153 2 ELE
* 5 "Connector pins" "T_Bronze" 0.133 2 ELE
* 6 "Resistors (0805)" "Ceramic" 1.125E-3 21 ELE
* 7 "Capacitors (0805)" "Barium_Titanate" 1.86E-3 31 ELE
* 8 "Capacitors (0805)" "Nickel" 0.54E-3 31 ELE
* 9 "Capacitors (1812)" "Barium_Titanate" 27.6E-3 2 ELE
* 10 "Capacitors (1812)" "Nickel" 10.1E-3 2 ELE
......................................................................
======================================================================
o TID DOHM (Ring1/Ring2)
----------------------
MC Volume (18 deg wedge): 1/2 x (18*deg2rad) x (50.5**2-44.5**2) x 0.22 cm (19.698 cm3)
Contains:
1) DOHM PRIM Board: MC Volume - V_traces
2) traces: Cu Area Thickness Volume [mm3]
Top sq.in = 958.0 mm2 35 um 33.53
GND sq.in = 8953.6 mm2 35 um 313.38
SIG1 sq.in = 385.0 mm2 35 um 13.48
SIG2 sq.in = 993.8 mm2 35 um 34.78
PWR sq.in = 8953.6 mm2 35 um 313.38
Bot sq.in = 698.4 mm2 35 um 24.44
TOTAL VOLUME = 732.99 mm3
Missing infos:
- for GND and PWR layers assume 100% filled area
- for the remaining layers assume the same fraction of surface coverd by traces as in the TIB DOHMs
3) LVDSBUFF: 6 I.C. 8 pin SOIC 4x5x1.5 mm3
4-5) Connectors:
... but it is better to calculate the fraction of plastic/bronze per connector
To MC 4 x ERNI 26 pin [missing info on material] 0.273 g Plastic, 0.1001 g Bronze = 1.092 g Plastic + 0.4004 g Bronze (actually 2 par + 2 perp)
PTC 1 x ERNI 12 pin [missing info on material] 0.126 g Plastic, 0.0462 g Bronze = 0.126 g Plastic + 0.0462 g Bronze
CCU socket 2 x SAMTEC 20 pin [0.56 g, 65% Plastic + 35% Bronze] 0.364 g Plastic, 0.196 g Bronze = 0.728 g Plastic + 0.392 g Bronze
DOH 2 x NAIS 26 PIN 0.129 g Plastic, 0.075 g Bronze = 0.258 g Plastic + 0.150 g Bronze (actually Cu)
PWR 1 x MOLEX 20 pin [measured] 1.72 g Plastic, 1.24 g Bronze = 1.72 g Plastic + 1.24 g Bronze
[WAS: missing info on material 0.210 g Plastic, 0.077 g Bronze = 0.210 g Plastic + 0.077 g Bronze]
TOTAL Plastic: 4.134 g => 2.953 cm3 Kapton [20080118 EM WAS: Plastic: 3.924 g => 2.807 cm3 Kapton]
[WAS: Plastic: 2.414 g => 1.727 cm3 Kapton]
TOTAL Bronze: 2.306 g => 0.259 cm3 Bronze [20080118 EM WAS: Bronze: 2.229 g => 0.251 cm3 Bronze]
[WAS: Bronze: 1.066 g => 0.120 cm3 Bronze]
6) Resistors: 14 x size 0805 [2x1.25x0.45 mm3, 4.8 mg] Volume=1.125E-3 cm3
7-8) Capacitors: 18 x size 0805 [2x1.25x0.94 mm3, 16.8 mg] Volume=2.35E-3 cm3
Use values from Magazzu's page: Ni 0.7mg / BaTiO3 15.8 mg
9-10) Capacitors: 1 x size 1210 [3.2x2.5x1.5 mm3, 93.6 mg] Volume=12E-3 cm3
Use values from Magazzu's page: Ni 4.6mg / BaTiO3 88.1 mg
11) CCU from tibtid_common.in: volume = 6.0 cm3, material = "TIBTID_CCUM"
[WAS: from tibtid_common.in: volume = 4.949 cm3, material = "TIBTID_CCUM"]
12-18) Optohybrid (two copies per primary DOHM, taken from tib_module.in TIB_ICC1 and TIB_ICC2)
FR4 22 x 30 mm, 400 um
Cu: 35 um, 2 layer with 50 % occ, 2 layers with 30 % occ
Capacitors (0603) 1.6 x .8 x .9 mm
Resistors (0603) 1.6 x .8 x .9 mm
Laser diode: 0.02 cm^3 Si (1 for 2 APVs)
Laser driver: 0.0025 cm^3 Si (1 for 3 APVs ??)
Fiber clamps: 1.4 x 0.3 x 0.15 cm Kapton
.......................................................................
# "TID DOHM Ring0/1 Board" "TID_DOHM1" 19.698 -1.
* 1 "DOHM PRIM Board" "T_FR4" 18.965 1 ELE
* 2 "Copper traces" "Copper" 0.733 1 ELE
* 3 "IC Chips" "T_Kapton" 0.030 6 ELE
* 4 "Connector cases" "T_Kapton" 2.953 1 ELE
* 5 "Connector pins" "T_Bronze" 0.259 1 ELE
* 6 "Resistors (0805)" "Ceramic" 1.125E-3 14 ELE
* 7 "Capacitors (0805)" "Barium_Titanate" 1.86E-3 18 ELE
* 8 "Capacitors (0805)" "Nickel" 0.54E-3 18 ELE
* 9 "Capacitors (1210)" "Barium_Titanate" 7.2E-3 1 ELE
* 10 "Capacitors (1210)" "Nickel" 4.8E-3 1 ELE
* 11 "CCU" "TIBTID_CCUM" 6.000 1 ELE
* 12 "Optohybrid Substrate" "T_FR4" 0.264 2 ELE
* 13 "Optohybrid copper" "Copper" 0.037 2 ELE
* 14 "OH capacitors (0603)" "Alumina" 1.15E-3 34 ELE
* 15 "OH resistors (0603)" "Carbon" 1.15E-3 16 ELE
* 16 "OH C/R solder" "SMD_metal" 2.E-4 50 ELE
* 17 "OH Laser diode" "Silicon" 0.02 6 ELE
* 18 "OH Laser driver" "Silicon" 0.0025 4 ELE
* 19 "OH fiber clamp" "T_Kapton" 0.063 2 ELE
.......................................................................
=======================================================================
o TID DOHM (Ring3)
----------------
MC Volume (55 deg wedge ext+37 deg wedge int): 1/2 x (55*deg2rad) x (29.5**2-26.5**2) x 0.22 cm 80.6342 cm2 )
1/2 x (37*deg2rad) x (26.5**2-22.8**2) x 0.22 cm 58.8976 cm2 )
Contains (same component as DOHM Ring1/Ring2):
1) DOHM PRIM Board: FR4 (27.508x5.207+1.003x3.607) cm2 Area=22.2 sq.in. ==> 28.5 cm x 5.0 cm thickness=0.22 cm
2) traces: Cu Area Thickness Volume [mm3]
Top sq.in = 1493.0 mm2 35 um
GND sq.in = 13953.2 mm2 35 um
SIG1 sq.in = 600.0 mm2 35 um
SIG2 sq.in = 1534.9 mm2 35 um
PWR sq.in = 13953.2 mm2 35 um
Bot sq.in = 1088.3 mm2 35 um
TOTAL VOLUME = 1141.79 mm3
Missing infos:
- for GND and PWR layers assume 100% filled area
- for the remaining layers assume the same fraction of surface coverd by traces as in the TIB DOHMs
3) LVDSBUFF: 6 I.C. 8 pin SOIC 4x5x1.5 mm3
4-5) Connectors:
... but it is better to calculate the fraction of plastic/bronze per connector
To MC 4 x ERNI 26 pin [missing info on material] 0.273 g Plastic, 0.1001 g Bronze = 1.092 g Plastic + 0.4004 g Bronze (actually 2 par + 2 perp)
PTC 1 x ERNI 12 pin [missing info on material] 0.126 g Plastic, 0.0462 g Bronze = 0.126 g Plastic + 0.0462 g Bronze
CCU 2 x SAMTEC 20 pin [0.56 g, 65% Plastic + 35% Bronze] 0.364 g Plastic, 0.196 g Bronze = 0.728 g Plastic + 0.392 g Bronze
DOHs 2 x NAIS 26 PIN 0.129 g Plastic, 0.075 g Bronze = 0.258 g Plastic + 0.150 g Bronze (actually Cu)
PWR 1 x MOLEX 20 pin [measured] 1.72 g Plastic, 1.24 g Bronze = 1.72 g Plastic + 1.24 g Bronze
[WAS: missing info on material 0.210 g Plastic, 0.077 g Bronze = 0.210 g Plastic + 0.077 g Bronze]
TOTAL Plastic: 4.134 g => 2.953 cm3 Kapton [20080118 EM WAS: Plastic: 3.924 g => 2.807 cm3 Kapton]
[WAS: Plastic: 2.414 g => 1.727 cm3 Kapton]
TOTAL Bronze: 2.306 g => 0.259 cm3 Bronze [20080118 EM WAS: Bronze: 2.229 g => 0.251 cm3 Bronze]
[WAS: Bronze: 1.066 g => 0.120 cm3 Bronze]
6) Resistors: 14 x size 0805 [2x1.25x0.45 mm3, 4.8 mg] Volume=1.125E-3 cm3
7-8) Capacitors: 18 x size 0805 [2x1.25x0.94 mm3, 16.8 mg] Volume=2.35E-3 cm3
Use values from Magazzu's page: Ni 0.7mg / BaTiO3 15.8 mg
9-10) Capacitors: 1 x size 1210 [3.2x2.5x1.5 mm3, 93.6 mg] Volume=12E-3 cm3
Use values from Magazzu's page: Ni 4.6mg / BaTiO3 88.1 mg
11) CCU from tibtid_common.in: volume = 6.0 cm3, material = "TIBTID_CCUM"]
[WAS: from tibtid_common.in: volume = 4.949 cm3, material = "TIBTID_CCUM"]
12-17) Optohybrid (two copies per primary DOHM, taken from tib_module.in TIB_ICC1 and TIB_ICC2)
FR4 22 x 30 mm, 400 um
Cu: 35 um, 2 layer with 50 % occ, 2 layers with 30 % occ
Capacitors (0603) 1.6 x .8 x .9 mm
Resistors (0603) 1.6 x .8 x .9 mm
Laser diode: 0.02 cm^3 Si (1 for 2 APVs)
Laser driver: 0.0025 cm^3 Si (1 for 3 APVs ??)
Fiber clamps: 1.4 x 0.3 x 0.15 cm Kapton
.......................................................................
# "TID DOHM Ring2 Board" "TID_DOHM2" 30.697 -1
* 1 "DOHM PRIM Board" "T_FR4" 29.555 1 ELE
* 2 "Copper traces" "Copper" 1.142 1 ELE
* 3 "IC Chips" "T_Kapton" 0.030 6 ELE
* 4 "Connector cases" "T_Kapton" 2.953 1 ELE
* 5 "Connector pins" "T_Bronze" 0.259 1 ELE
* 6 "Resistors (0805)" "Ceramic" 1.125E-3 14 ELE
* 7 "Capacitors (0805)" "Barium_Titanate" 1.86E-3 18 ELE
* 8 "Capacitors (0805)" "Nickel" 0.54E-3 18 ELE
* 9 "Capacitors (1210)" "Barium_Titanate" 7.2E-3 1 ELE
* 10 "Capacitors (1210)" "Nickel" 4.8E-3 1 ELE
* 11 "CCU" "TIBTID_CCUM" 6.000 1 ELE
* 12 "Optohybrid Substrate" "T_FR4" 0.264 2 ELE
* 13 "Optohybrid copper" "Copper" 0.037 2 ELE
* 14 "OH capacitors (0603)" "Alumina" 1.15E-3 34 ELE
* 15 "OH resistors (0603)" "Carbon" 1.15E-3 16 ELE
* 16 "OH C/R solder" "SMD_metal" 2.E-4 50 ELE
* 17 "OH Laser diode" "Silicon" 0.02 6 ELE
* 18 "OH Laser driver" "Silicon" 0.0025 4 ELE
* 19 "OH fiber clamp" "T_Kapton" 0.063 2 ELE
.......................................................................
=======================================================================
o TID LAYER OF FIBER PIGTAILS
---------------------------
The logical volumes for the fiber pigtails just sit on top of those
for the MotherCables arcs (ie. not the ICBTails).
(1) Fiber pigtails
Total length of MotherC on 1 disk/front = 2*pi*(40.3+47.3+33.4) = 760 cm
Total length of fiber pigtails on 1 disk/front = 0.5*(5760+6520+5000) = 8640 cm
-> 11.38 cm of pigtails per 1 cm of MC
MC width = 2.5 cm
20080118 EM
(2) Add the kapton "dime" used to hold fibers in position
Measured surface density of the kapton holders: 0.058 g/cm^2
Per 1 cm of MC: M(kapton)= 1 x 2.5 cm^2 x 0.058 g/cm^2 = 0.045 g
V(kapton)=M(kapton)/rho(kapton)=0.045/1.4=3.2E-2 cm^3
MCVolume = 1.0 x 2.5 x 0.05 cm^3 = 0.125 cm^3
.......................................................................
# "TID fiber layer" "TID_FiberLayer " 0.125 -1
* 1 "Fiber pigtails" "T_FiberPigtail" 0.7854E-2 11.38 CAB
* 2 "Dime kapton" "T_Kapton" 3.201E-2 1 CAB
.......................................................................
=======================================================================
o TID INSERTS FOR FIXATION OF THE MODULES
---------------------------------------
20080125 EM
MCVolume = 8.0*pi*(5.15**2 - 1.60**2)=602 mm^3
(1) Al insert: material Aluminium
Volumes matched those from drawings 187 mm^3
mass: computed 0.51 g
(2) Glue (Epoxy?):
Volume filling the cylindrical envelope of the inserts
from drawings : 367 mm^3
Extra volume from assuming a 0.15 mm clearance on the radius of the hole
in which the insert fits
: 12 mm^3
.......................................................................
# "TID module inserts" "TID_ModuleFix" 0.602 -1
* 1 "Al insert" "Aluminium" 0.187 1 SUP
* 2 "Glue" "Epoxy" 0.379 1 SUP
.......................................................................
=======================================================================
# "END" "END" 0. 0.
this has to be the last line !
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