tob_module.in

CMSSW/Geometry/TrackerCommonData/data/Materials/tob_module.in

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1622 1623 1624 1625 1626 1627 1628 1629 1630 1631 1632 1633 1634 1635 1636 1637 1638 1639 1640 1641 1642 1643 1644 1645 1646 1647 1648 1649 1650 1651 1652 1653 1654 1655 1656 1657 1658 1659 1660 1661 1662 1663 1664 1665 1666 1667 1668 1669 1670 1671 1672 1673 1674 1675 1676 1677 1678 1679 1680 1681 1682 1683 1684 1685 1686 1687 1688 1689 1690 1691 1692 1693 1694 1695 1696 1697 1698 1699 1700 1701 1702 1703 1704 1705 1706 1707 1708 1709 1710 1711 1712 1713 1714 1715 1716 1717 1718 1719 1720 1721 1722 1723 1724 1725 1726 1727 1728 1729 1730 1731 1732 1733 1734 1735 1736 1737 1738 1739 1740 1741 1742 1743 1744 1745 1746 1747 1748 1749 1750 1751 1752 1753 1754 1755 1756 1757 1758 1759 1760 1761 1762 1763 1764 1765 1766 1767 1768 1769 1770 1771 1772 1773 1774 1775 1776 1777 1778 1779 1780 1781 1782 1783 1784 1785 1786 1787 1788 1789 1790 1791 1792 1793 1794 1795 1796 1797 1798 1799 1800 1801 1802 1803 1804 1805	`TOB MODULES` `============` `$$ This includes all the volumes that make up the TOB modules` `$$ as well as the electronics on the rods !` `Input file for mixture.f` `Start new mixtures with a '#' in the first column` `Start the components with a '' in the first column` `You can type any kind of comment in as long as you don't start it` `with '#' or '' !` `.....................................................................` `For mixture declaration: Name of Mixture, Name of GMIX for title file,` `Monte Carlo Volume, MC Area` `For items in a compound: Item number, Comment, Material (has to be` `written exactly as in material.input file),` `Volume, Multiplicity, Type` `Type is one of the following: SUP for support` `SEN for sensitive volumes` `CAB for cables` `COL for cooling` `ELE for electronics` `.....................................................................` `o Pitch adapter, r-phi` `--------------------` `MCVolume: (8.6 x 1.25 x 0.11) cm^3` `(1) Glass pitch adapter` `material is Schott D263 Borosilicate Glass, density = 2.51 g/cm^3` `properties taken from http://www.schott.com/fpd/english/products/fpd/d263t.html` `and http://www.osti.gov/bridge/servlets/purl/10117627-uo1lPX/webviewable/10117627.pdf` `(TIB: CORNING 1737F density = 2.54 g/cm^3)` `Borosilicate Glass chemical composition: http://www.qvf.com/en/Equipment_1/Borosilicate%20glass/Composition.shtml` `dimensions 9.64 x 1.25 x 0.0550 cm^3 = 0.66275 cm^3 (TIB: 300 um, TID/TOB/TEC: 550 um thickness)` `[WAS dimensions 9.64 x 1.25 x 0.03 cm^3 = 0.3615 cm^3]` `(2) Pitch adapter spacers` `dimensions 86x3x0.635 mm^3 + 60x3x0.635 mm^3 = 278.13 mm^3 = 0.27813 cm^3` `[WAS (NOMEX) 0.24 cm^3]` `[WAS (3) Carbon fibre support piece dimensions 8.6 x 1.18 x 0.06 cm^3]` `......................................................................` `# "TOB Pitch Adapter r-phi" "TOB_PA_rphi" 1.1825 10.75` `* 1 "Glass pitch adapter" "Borosilicate_Glass" 0.66275 1 ELE` `* 2 "Spacer" "Ceramic" 0.27813 1 SUP` `......................................................................` `======================================================================` `o Pitch adapter, stereo` `--------------------` `MCVolume: (0.788.60.11 + 0.5 * 0.8638.60.11) cm^3 = 1.146 cm^3` `(1) Glass pitch adapter` `material is Schott D263 Borosilicate Glass, density = 2.51 g/cm^3` `properties taken from http://www.schott.com/fpd/english/products/fpd/d263t.html` `and http://www.osti.gov/bridge/servlets/purl/10117627-uo1lPX/webviewable/10117627.pdf` `(TIB: CORNING 1737F density = 2.54 g/cm^3)` `Borosilicate Glass chemical composition: http://www.qvf.com/en/Equipment_1/Borosilicate%20glass/Composition.shtml` `dimensions: [ ( 0.9 x 9.6 x 0.0550 ) + 0.5 x ( 0.9 x 9.6 x 0.0550 ) ] cm^3 = 0.7128 cm^3 (TIB: 300 um, TID/TOB/TEC: 550 um thickness)` `[WAS dimensions 0.99.60.03 + 0.5 * 0.99.60.03 = 0.389 cm^3]` `(2) Pitch adapter spacers` `dimensions 86x3x0.635 mm^3 + 60x3x0.635 mm^3 = 278.13 mm^3 = 0.27813 cm^3` `[WAS (NOMEX) 0.24 cm^3]` `[WAS (3) Carbon fibre support piece dimensions 8.6 x 1.18 x 0.06 cm^3]` `[WAS (3) Carbon fibre frame piece` `0.88.01.50.06 = 0.576 cm^3 ]` `........................................................................` `# "TOB Pitch Adapter stereo" "TOB_PA_ster" 1.146 10.42` ` 1 "Glass pitch adapter" "Borosilicate_Glass" 0.7128 1 ELE` `* 2 "Spacer" "Ceramic" 0.27813 1 SUP` `........................................................................` `========================================================================` `o Module end plate` `----------------` `Carbon fiber endplate where electronics sits on top` `MCVolume: (12 x 4.5 x 0.0625) cm^3` `(1) CF` `dimensions from EDM file CMSTKOBM0026 version AA` `{ [ 39 x 119.7] + 2 x [ 6 x 29.9 ] - 2 x [ pi x (8.4 / 2)^2 ] - 2 x [ pi x (3.5 / 2)^2 ] - 4 x [ pi x (1.6 / 2)^2 ] } mm^2 x 0.625 mm =` `= 4888.98 mm^2 x 0.625 mm = 3055.61 mm^3` `[WAS dimensions: 12 x 4.7 x 0.06 cm = 3.384 cm^3]` `(2) 3D Label` `Plastic (kapton): m = 0.020 g` `density = 1.40 g/cm^3` `--> volume = 0.0143 cm^3` `...................................................................` `# "TOB module end plate" "TOB_frame_ele" 3.375 54.0` `* 1 "CF plate" "Carbon fibre str." 3.05561 1 SUP` `* 2 "Module 3D Label" "T_Kapton" 0.0143 1 ELE` `...................................................................` `===================================================================` `o Ceramic Hybrid Support` `[WAS CF Hybrid Support]` `--------------` `MCVolume: (8.6 x 3.71 x 0.0380) cm^3 = 1.2124 cm^3` `[WAS MCVolume: 7 x 3.33 x 0.06 = 1.3986 cm^3]` `(1) Ceramic plate` `dimensions: [ (37.1-11.8)x72 + 11.8x86] mm^2 x 0.380 mm =` `= 2836.4 mm^2 x 0.380 mm = 1077.832 mm^3` `[WAS (1) CF dimensions: 7 x 3.4 x 0.06 = 1.428 cm^3]` `....................................................................` `# "TOB hybrid support" "TOB_hybrid_supp" 1.3986 23.31` `* 1 "Hybrid support" "Ceramic" 1.077832 1 SUP` `....................................................................` `====================================================================` `o Aluminium cooling I` `-------------------` `Al piece at sensor middle` `This one includes the screw !` `MCVolume: (1.6 x 2 x 0.03) cm^3` `(1) Al heat spreader` `dimensions from EDM file CMSTKOBM0025 version 0` `{ [ 16 x 20 ] - [ pi x (2/2)^2 ] } mm^2 x 0.300 mm` `= 316.8584 mm^2 x 0.300 mm = 95.0575 mm^3` `[WAS 0.096 cm^3]` `[THIS MATERIAL HAS BEEN CREATED APART` `(2) CF compensator` `dimensions from EDM file CMSTKOBM0035 version AA` `{ [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm =` `= 337.46 mm^2 x 0.300 mm = 101.238 mm^3` `[WAS 0.15 cm^3]` `]` `(2-3) Screw: 0.009 cm^3 Stainless Steel,` `0.02 cm^3 Al washer` `.....................................................................` `# "TOB Module Cooling 1" "TOB_mod_cool1" 0.096 3.2` `* 1 "Al heat spreader" "Aluminium" 0.0950575 1 COL` `* 2 "Steel screw" "Steel-008" 0.009 1 COL` `* 3 "Al washer" "Aluminium" 0.02 1 COL` `.....................................................................` `=====================================================================` `[WAS` `o Aluminium cooling II` `--------------------` `Al piece at sensor middle` `No screw !` `MCVolume: (1.5 x 2.8 x 0.03) cm` `(1) Al heat spreader` `dimensions from EDM file CMSTKOBM0025 version 0` `{ [ 16 x 20 ] - [ pi x (2/2)^2 ] } mm^2 x 0.300 mm` `= 316.8584 mm^2 x 0.300 mm = 95.0575 mm^3` `[WAS 0.096 cm^3]` `[THIS MATERIAL HAS BEEN CREATED APART` `(2) CF compensator` `dimensions from EDM file CMSTKOBM0035 version AA` `{ [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm =` `= 337.46 mm^2 x 0.300 mm = 101.238 mm^3` `[WAS 0.15 cm^3]` `]` `....................................................................` `# "TOB Module Cooling 2" "TOB_mod_cool2" 0.126 4.2` `* 1 "Al heat spreader" "Aluminium" 0.0950575 1 COL` `....................................................................` `====================================================================` `NO MORE NEEDED, ALL THE SPREADER ARE THE SAME` `]` `o Aluminium cooling III` `[WAS o Aluminium cooling III ]` `---------------------` `Al and locator piece at hybrid sides` `This one includes the screw !` `MCVolume: (1.5 x 2.8 x 0.03) cm^3` `(1) Al heat spreader` `dimensions from EDM file CMSTKOBM0024 version 0` `{ [ 15 x 28 ] - (8 x 8 / 2) - [ pi x (2/2)^2 ] } mm^2 x 0.300 mm` `= 384.8584 mm^2 x 0.300 mm = 115.4575 mm^3` `[WAS 0.116 cm^3]` `[THIS MATERIAL HAS BEEN CREATED APART` `(2) CF compensator` `dimensions from EDM file CMSTKOBM0035 version AA` `{ [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm =` `= 337.46 mm^2 x 0.300 mm = 101.238 mm^3` `[WAS 0.15 cm^3]` `]` `(2-3) Screw: 0.009 cm^3 Stainless Steel,` `0.02 cm^3 Al washer` `(4) CuBe/brass -> take all Cu for now:` `(0.0044 * 3) cm^3` `...................................................................` `# "TOB Module Cooling 2" "TOB_mod_cool2" 0.126 4.2` `* 1 "Al heat spreader" "Aluminium" 0.1154575 1 COL` `* 2 "Steel screw" "Steel-008" 0.009 1 COL` `* 3 "Al washer" "Aluminium" 0.02 1 COL` `* 4 "Cu locator" "Copper" 0.0044 3 SUP` `...................................................................` `===================================================================` `o Carbon Fibre Compensator (cooling)` `--------------------` `MCVolume: (1.6 x 2.6 x 0.03) cm^3` `(1) CF compensator` `dimensions from EDM file CMSTKOBM0035 version AA` `{ [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm =` `= 337.46 mm^2 x 0.300 mm = 101.238 mm^3` `............................................................................` `# "TOB Module Cooling Compensator" "TOB_mod_comp" 0.1248 4.16` `* 1 "CF Compensator" "Carbon fibre str." 0.101238 1 COL` `............................................................................` `============================================================================` `o Module side rail I rphi (heavier side)` `---------------------------------------` `Volumes from single-sided modules. Also used for double-sided modules` `MCVolume: (1.7 x 21 x 0.08) cm^3` `(1) Carbon fiber leg` `dimensions from EDM file CMSTKOBM0026 version AA` `{ [ 15.1 x 210 ] + [ 4.0 x 122 ] + 2 x [ 1.5 x 22.5 ] - [ pi x (8.4 / 2)^2 ] - [ pi x ( 2.5 / 2 )^2 ] } mm^2 x 0.625 mm =` `= 3666.17 x 0.625 mm^3 = 2291.36 mm^3` `[WAS 21 x 1.7 x 0.06 cm = 2.14 cm^3]` `Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm` `EDMS Code EP 680-1174-080-A (ss) and EP 680-1174-060-D (ds)` `(2-3) DS or SS rphi Bias` `Kapton: m = 0.552 g` `density = 1.4 g/cm^3` `--> volume = 0.394 cm^3` `Copper: m = 0.088 g` `density = 8.96 g/cm^3` `--> volume = 0.010 cm^3` `(4) HV wire (115 mm)` `Copper: m = (0.14+0.10) g = 0.24 g` `density = 8.96 g/cm^3` `--> volume = 0.027 cm^3` `(5) Transparent Sleeve` `Polyethylene:` `m = 0.040 g` `density = 0.95 g/cm^3` `--> volume = 0.042 cm^3` `(6) Soldering (Sn/Pb alloy)` `BGA196 (Ball Grid Array), Sn/Pb/Ag 62/36/2:` `m = 0.030 g` `density = 8.82 g/cm^3` `--> volume = 0.0034 cm^3` `(7) Thermistor Caps` `Kapton: m = 0.010 g` `density = 1.4 g/cm^3` `--> volume = 0.0071 cm^3` `(8) Thermistor Stiffeners` `FR4: m = 0.040 g` `density (T_G10) = 1.90 g/cm^3` `--> volume = 0.021 cm^3` `(9) SMD Capacitors` `BaTiO3: m = 0.090 g` `density = 6.02 g/cm^3` `--> volume = 0.015 cm^3` `(10) SMD Resistors` `Al2O3: m = 0.050 g` `density = 3.96525 g/cm^3` `--> volume = 0.0126 cm^3` `[WAS:` `(2) Kapton` `from Bill's table: ~0.5 cm^3` `(3) Copper traces` `Robert: Cu is approx 15 um thick => 0.01 cm^3 (just a guess)` `(4) Components:` `Caps: 1 x 1206 3 x 1.5 x 1.5 mm^3` `1 x 1210 3.2 x 2.5 x 1.5 mm^3` `Rs: 2 x 1206` `3 x 0603 1.6 x 0.8 x 0.8 mm (thermistors)` `]` `..........................................................................` `# "TOB side rail active rphi" "TOB_sid_rail1" 2.856 35.7` `* 1 "CF leg" "Carbon fibre str." 2.29136 1 SUP` `* 2 "Bias Kapton" "T_Kapton" 0.394 1 ELE` `* 3 "Bias Copper" "Copper" 0.010 1 ELE` `* 4 "HV Wire" "Copper" 0.027 1 ELE` `* 5 "Transparent Sleeve" "Polyethylene" 0.042 1 ELE` `* 6 "Soldering" "BGA" 0.0034 1 ELE` `* 7 "Thermistor Caps" "T_Kapton" 0.0071 1 ELE` `* 8 "Thermistor Stiffeners" "T_G10" 0.021 1 ELE` `* 9 "Capacitors" "Barium_Titanate" 0.015 1 ELE` `* 10 "Resistors" "Ceramic" 0.0126 1 ELE` `..........................................................................` `==========================================================================` `o Module side rail II rphi (lighter side)` `----------------------------------------` `Volumes from single-sided modules. Also used for double-sided modules` `MCVolume: (1.7 x 21 x 0.08) cm^3` `(1) Carbon fiber leg` `dimensions from EDM file CMSTKOBM0026 version AA` `{ [ 15.1 x 210 ] + [ 4.0 x 122 ] + 2 x [ 1.5 x 22.5 ] - [ pi x (8.4 / 2)^2 ] - [ pi x ( 2.5 / 2 )^2 ] } mm^2 x 0.625 mm =` `= 3666.17 x 0.625 mm^3 = 2291.36 mm^3` `[WAS 21 x 1.7 x 0.06 cm = 2.14 cm^3]` `Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm` `EDMS Code EP 680-1174-090-A (ss) and EP 680-1174-050-C (ds)` `(2-3) DS or SS rphi Insulator` `Kapton: m = 0.402 g` `density = 1.4 g/cm^3` `--> volume = 0.287 cm^3` `Copper: m = 0.041 g` `density = 8.96 g/cm^3` `--> volume = 0.0046 cm^3` `[WAS:` `(2) Kapton` `from Bill's table: ~0.45 cm^3` `(3) Copper: 2 x 20x8 mm^2 x 17 um = 0.00544 cm^3` `]` `........................................................................` `# "TOB side rail passive rphi" "TOB_sid_rail2" 2.856 35.7` `* 1 "CF leg" "Carbon fibre str." 2.29136 1 SUP` `* 2 "Insulator Kapton" "T_Kapton" 0.287 1 ELE` `* 3 "Insulator Copper" "Copper" 0.0046 1 ELE` `........................................................................` `========================================================================` `o Module side rail I stereo (heavier side)` `---------------------------------------` `Volumes from single-sided modules. Also used for double-sided modules` `MCVolume: (1.7 x 21 x 0.08) cm^3` `(1) Carbon fiber leg` `dimensions from EDM file CMSTKOBM0026 version AA` `{ [ 15.1 x 210 ] + [ 4.0 x 122 ] + 2 x [ 1.5 x 22.5 ] - [ pi x (8.4 / 2)^2 ] - [ pi x ( 2.5 / 2 )^2 ] } mm^2 x 0.625 mm =` `= 3666.17 x 0.625 mm^3 = 2291.36 mm^3` `[WAS 21 x 1.7 x 0.06 cm = 2.14 cm^3]` `Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm` `EDMS Code EP 680-1174-080-A` `(2-3) DS or SS rphi Bias (different with respect to rphi)` `Kapton: m = 0.514 g` `density = 1.4 g/cm^3` `--> volume = 0.367 cm^3` `Copper: m = 0.088 g` `density = 8.96 g/cm^3` `--> volume = 0.0098 cm^3` `(4) HV wire (115 mm)` `Copper: m = (0.14+0.10) g = 0.24 g` `density = 8.96 g/cm^3` `--> volume = 0.027 cm^3` `(5) Transparent Sleeve` `Polyethylene:` `m = 0.040 g` `density = 0.95 g/cm^3` `--> volume = 0.042 cm^3` `(6) Soldering (Sn/Pb alloy)` `BGA196 (Ball Grid Array), Sn/Pb/Ag 62/36/2:` `m = 0.030 g` `density = 8.82 g/cm^3` `--> volume = 0.0034 cm^3` `(7) Thermistor Caps` `Kapton: m = 0.010 g` `density = 1.4 g/cm^3` `--> volume = 0.0071 cm^3` `(8) Thermistor Stiffeners` `FR4: m = 0.040 g` `density (T_G10) = 1.90 g/cm^3` `--> volume = 0.021 cm^3` `(9) SMD Capacitors` `BaTiO3: m = 0.090 g` `density = 6.02 g/cm^3` `--> volume = 0.015 cm^3` `(10) SMD Resistors` `Al2O3: m = 0.050 g` `density = 3.96525 g/cm^3` `--> volume = 0.0126 cm^3` `[WAS:` `(2) Kapton` `from Bill's table: ~0.5 cm^3` `(3) Copper traces` `Robert: Cu is approx 15 um thick => 0.01 cm^3 (just a guess)` `(4) Components:` `Caps: 1 x 1206 3 x 1.5 x 1.5 mm^3` `1 x 1210 3.2 x 2.5 x 1.5 mm^3` `Rs: 2 x 1206` `3 x 0603 1.6 x 0.8 x 0.8 mm (thermistors)` `]` `...........................................................................` `# "TOB side rail active stereo" "TOB_sid_rail1st" 2.856 35.7` `* 1 "CF leg" "Carbon fibre str." 2.29136 1 SUP` `* 2 "Bias Kapton" "T_Kapton" 0.367 1 ELE` `* 3 "Bias Copper" "Copper" 0.0098 1 ELE` `* 4 "HV Wire" "Copper" 0.027 1 ELE` `* 5 "Transparent Sleeve" "Polyethylene" 0.042 1 ELE` `* 6 "Soldering" "BGA" 0.0034 1 ELE` `* 7 "Thermistor Caps" "T_Kapton" 0.0071 1 ELE` `* 8 "Thermistor Stiffeners" "T_G10" 0.021 1 ELE` `* 9 "Capacitors" "Barium_Titanate" 0.015 1 ELE` `* 10 "Resistors" "Ceramic" 0.0126 1 ELE` `...........................................................................` `===========================================================================` `o Module side rail II stereo (lighter side)` `----------------------------------------` `Volumes from single-sided modules. Also used for double-sided modules` `MCVolume: (1.7 x 21 x 0.08) cm^3` `(1) Carbon fiber leg` `dimensions from EDM file CMSTKOBM0026 version AA` `{ [ 15.1 x 210 ] + [ 4.0 x 122 ] + 2 x [ 1.5 x 22.5 ] - [ pi x (8.4 / 2)^2 ] - [ pi x ( 2.5 / 2 )^2 ] } mm^2 x 0.625 mm =` `= 3666.17 x 0.625 mm^3 = 2291.36 mm^3` `[WAS 21 x 1.7 x 0.06 cm = 2.14 cm^3]` `Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm` `EDMS Code EP 680-1174-100-A` `(2-3) DS or SS rphi Insulator (different with respect to rphi)` `Kapton: m = 0.389 g` `density = 1.4 g/cm^3` `--> volume = 0.278 cm^3` `Copper: m = 0.041 g` `density = 8.96 g/cm^3` `--> volume = 0.0046 cm^3` `[WAS:` `(2) Kapton` `from Bill's table: ~0.45 cm^3` `(3) Copper: 2 x 20x8 mm^2 x 17 um = 0.00544 cm^3` `]` `........................................................................` `# "TOB side rail passive rphi" "TOB_sid_rail2st" 2.856 35.7` `* 1 "CF leg" "Carbon fibre str." 2.29136 1 SUP` `* 2 "Insulator Kapton" "T_Kapton" 0.278 1 ELE` `* 3 "Insulator Copper" "Copper" 0.0046 1 ELE` `........................................................................` `========================================================================` `o Hybrid for TOB layers 1/2` `-------------------------` `[WAS o Hybrid for TOB layers 5/6` `------------------------- ]` `These are the hybrids of the double sided layers.` `Each of the hybrids carries 4 APVs (changed 15/03/02)` `Hybrids have 4 APVs` `MCVolume: (6 x 2.5 x 0.05) cm^3 = 0.75 cm^3` `Dimensions (60 x 25) mm^2 = 15 cm^2` `(1) Hybrid reviewed November 2006 - Central Hybrid (no kapton tail, which is in ICC* material definition, see below)` `see http://www.fynu.ucl.ac.be/he/cms/activities/tracker/FHITfiles/CCTPHybrides.pdf` `- Kapton: (25+25) um = 50 um = 0.0050 cm --> 0.075 cm^3` `- Copper: (18+12+18+18+18+12) um = 96 um = 0.0096 cm --> 0.144 cm^3` `- Solder Mask: 20 um = 0.0020 cm --> 0.030 cm^3` `- Glue: (50+50) um = 100 um thickness = 0.0100 cm --> 0.150 cm^3` `[WAS (1) new FR4 hybrid` `Estimate: 300 mu FR4,` `3 x 25 mu Cu` `~300 mu Kapton` `-Pt-Au layer: tbd ]` `(2) Hybrid components` `R: (14 + n_APV) 0402 size material: carbon -> 18` `C: 2 x 1206 large ones` `(5 + 2n_APV) 0402 size -> 13` `0402: (1 x 0.5 x 0.5) mm^3 = 0.25 mm^3 = 0.25 x 10^-3 cm^3` `1206: (3 x 1.5 x 1.5) mm^3 = 6.75 mm^3 = 6.75 x 10^-3 cm^3` `APV25: (7.1 x 8.1 x 0.3) mm^3 = 17.253 mm^3 = 0.017253 cm^3 4 per hybrid REVIEWED November 2006 OK` `PLL: (4.0 x 4.0 x 0.3) mm^3 = 4.8 mm^3 = 0.0048 cm^3 1 per hybrid REVIEWED November 2006 OK` `(see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/PauloMoreira/PLL25%20User%20Manua2.1.pdf)` `MUX: (5.0 x 5.0 x 0.3) mm^3 = 7.5 mm^3 = 0.0075 cm^3 1 per hybrid REVIEWED November 2006 OK` `(see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/LVDSMUX3_datasheet.pdf)` `[WAS PLL+MUX : 2.0 x 7.1 x 0.3 mm^3 1 per hybrid ]` `http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/manuals.htm` `DCU : (2.0 x 2.0 x 0.3) mm^3 = 1.2 mm^3 = 0.0012 cm^3 1 per hybrid REVIEWED November 2006 OK` `(see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/Magazzu/DCUF_User_Manual_v3.0.pdf)` `(3) Wire bonds` `http://cms.ct.infn.it/bonding/bondspec.htm` `Al, 1% Si, 25 um diameter, medium hardness` `tail length visible but short < 50 um` `1 wire bond: average of 4 mm length diameter 25 um + 1 tail =` `= { [ pi x (0.025/2)^2 ] mm^2 x 4 mm } + { [ pi x (0.025/2)^2 ] mm^2 x 0.050 mm } =` `= [1.963x10^-3 mm^3] + [0.0245x10^-3 mm^3] = 2.0x10^-3 mm^3 = 2.0x10^-6 cm^3 [99% Aluminium + 1% Silicon]` `PA bias line to sensor bias ring: 5 bonds` `PA to hybrid: nAPV x 128 bonds` `PA to sensor: nAPV x 128 bonds` `TOTAL: 2x128xnAPV+5 bonds = 1029 bonds` `......................................................................` `# "TOB Hybrid Layer 1/2" "TOB_ele12" 0.75 15.0` `Central Hybrid (no tail)` ` 1 "Central Hybrid Kapton" "T_Kapton" 0.075 1 ELE` `* 2 "Central Hybrid Copper" "Copper" 0.144 1 ELE` `* 3 "Central Hybrid Solder Mask" "T_Kapton" 0.030 1 ELE` `* 4 "Central Hybrid Glue" "Epoxy" 0.150 1 ELE` `Components: Resistors` `* 5 "Resistors" "Carbon" 0.25E-3 18 ELE` `* 6 "R metal" "SMD_metal" 1.E-4 18 ELE` `Capacitors` `* 7 "Small caps" "Alumina" 0.25E-3 13 ELE` `* 8 "C metal" "SMD_metal" 1.E-4 13 ELE` `* 9 "Large caps" "Alumina" 6.75E-3 2 ELE` `* 10 "C metal large" "SMD_metal" 1.E-3 2 ELE` `* 11 "APV25" "Silicon" 0.017253 4 ELE` `* 12 "PLL" "Silicon" 4.8E-3 1 ELE` `* 13 "MUX" "Silicon" 7.5E-3 1 ELE` `* 14 "DCU" "Silicon" 1.2E-3 1 ELE` `Wire bonds` `* 15 "Wire bonds" "Aluminium" 1.98E-6 1029 ELE` `* 16 "Wire bonds" "Silicon" 0.02E-6 1029 ELE` `......................................................................` `======================================================================` `o Hybrid for TOB layers 3/4` `-------------------------` `[WAS o Hybrid for TOB layers 7/8` `------------------------- ]` `Hybrids have 4 APVs` `as above, except:` `(2) Hybrid components` `R: (14 + n_APV) 0402 size material: carbon -> 18` `C: 2 x 1206 large ones` `(5 + 2n_APV) 0402 size -> 13` `(3) Wire bonds` `see above for details` `TOTAL: 2x128xnAPV+5 bonds = 1029 bonds` `......................................................................` `# "TOB Hybrid Layer 3/4" "TOB_ele34" 0.75 15.0` `Central Hybrid (no tail)` ` 1 "Central Hybrid Kapton" "T_Kapton" 0.075 1 ELE` `* 2 "Central Hybrid Copper" "Copper" 0.144 1 ELE` `* 3 "Central Hybrid Solder Mask" "T_Kapton" 0.030 1 ELE` `* 4 "Central Hybrid Glue" "Epoxy" 0.150 1 ELE` `Components: Resistors` `* 5 "Resistors" "Carbon" 0.25E-3 18 ELE` `* 6 "R metal" "SMD_metal" 1.E-4 18 ELE` `Capacitors` `* 7 "Small caps" "Alumina" 0.25E-3 13 ELE` `* 8 "C metal" "SMD_metal" 1.E-4 13 ELE` `* 9 "Large caps" "Alumina" 6.75E-3 2 ELE` `* 10 "C metal large" "SMD_metal" 1.E-3 2 ELE` `* 11 "APV25" "Silicon" 0.017253 4 ELE` `* 12 "PLL" "Silicon" 4.8E-3 1 ELE` `* 13 "MUX" "Silicon" 7.5E-3 1 ELE` `* 14 "DCU" "Silicon" 1.2E-3 1 ELE` `Wire bonds` `* 15 "Wire bonds" "Aluminium" 1.98E-6 1029 ELE` `* 16 "Wire bonds" "Silicon" 0.02E-6 1029 ELE` `......................................................................` `======================================================================` `o Hybrid for TOB layers 5/6` `--------------------------` `[WAS Hybrid for TOB layers 9/10` `-------------------------- ]` `Hybrids have 6 APVs` `as above, except:` `(2) Hybrid components` `R: (14 + n_APV) 0402 size material: carbon -> 20` `C: 2 x 1206 large ones` `(5 + 2n_APV) 0402 size -> 17` `(3) Wire bonds` `see above for details` `TOTAL: 2x128xnAPV+5 bonds = 1541 bonds` `......................................................................` `# "TOB Hybrid Layer 5/6" "TOB_ele56" 0.75 15.0` `Central Hybrid (no tail)` ` 1 "Central Hybrid Kapton" "T_Kapton" 0.075 1 ELE` `* 2 "Central Hybrid Copper" "Copper" 0.144 1 ELE` `* 3 "Central Hybrid Solder Mask" "T_Kapton" 0.030 1 ELE` `* 4 "Central Hybrid Glue" "Epoxy" 0.150 1 ELE` `Components: Resistors` `* 5 "Resistors" "Carbon" 0.25E-3 20 ELE` `* 6 "R metal" "SMD_metal" 1.E-4 20 ELE` `Capacitors` `* 7 "Small caps" "Alumina" 0.25E-3 17 ELE` `* 8 "C metal" "SMD_metal" 1.E-4 17 ELE` `* 9 "Large caps" "Alumina" 6.75E-3 2 ELE` `* 10 "C metal large" "SMD_metal" 1.E-3 2 ELE` `* 11 "APV25" "Silicon" 0.017253 6 ELE` `* 12 "PLL" "Silicon" 4.8E-3 1 ELE` `* 13 "MUX" "Silicon" 7.5E-3 1 ELE` `* 14 "DCU" "Silicon" 1.2E-3 1 ELE` `Wire bonds` `* 15 "Wire bonds" "Aluminium" 1.98E-6 1541 ELE` `* 16 "Wire bonds" "Silicon" 0.02E-6 1541 ELE` `......................................................................` `======================================================================` `o TOB Interface between two sensors and sensor-Pitch Adapter` `-----------------------------------------------------------` `The inactive part between the two sensors and between PA-sensor:` `Sylgard encapsulant (Silicone) + wire bonds` `MCVolume: (9.3696 x 0.55 x 0.2) cm^3 = 1.030656 cm^3` `(1) Silicone encapsulant` `http://www.vestaweb.com/silicone/silicone_properties.htm` `http://www.answers.com/topic/silicone` `http://www.answers.com/topic/dimethyl-polysiloxane` `Must weight 0.83 g and dens=0.965 g/cm^3 --> volume = 0.80095 cm^3` `(2) Wire bonds` `see above for details` `sen-sen bias bonds: 5 bonds` `TOTAL: 2x128xnAPV+5 bonds = 1029-1541 bonds (average: 1285)` `................................................................................` `# "TOB Two-Sensor Interface" "TOB_Sens_Interface" 1.030656 7.49568` `* 1 "Glue" "Silicone_Gel" 0.80095 1 SUP` `Wire bonds` `* 2 "Wire bonds" "Aluminium" 1.98E-6 1285 ELE` `* 3 "Wire bonds" "Silicon" 0.02E-6 1285 ELE` `................................................................................` `================================================================================` `o TOB Electronics ICC1/2` `Inter Connect Cards` `ICC1 - serves 1 APV (smaller)` `ICC2 - serves 2 APVs (bigger)` `ICC1: MCVolume: (11.800 x 4.400 x 0.250) cm^3 = 12.98 cm^3` `ICC2: MCVolume: (11.800 x 6.800 x 0.250) cm^3 = 20.06 cm^3` `Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/ICCs_MB.htm` `Layer 1/2` `---------` `ICC1` `----` `Same as Layer 3/4, except:` `Circuit ICC1 (DS_ICC1)` `EDMS Code EP 680-1174-200-C` `(1-2) PCBs` `FR4: m = 8.179 g` `density (T_G10) = 1.90 g/cm^3` `--> volume = 4.305 cm^3` `copper: m = 1.575 g` `density = 8.96 g/cm^3` `--> volume = 0.176 cm^3` `(3-4) Connectors NaiS` `socket + header` `2 x ICC-Kapton bias PCB 16 pins (AXN316038S + AXN416330S)` `THIS GOES IN AOH 2 x ICC-AOH 30 pins (AXN330038S + AXN430330S)` `2 x ICC-FEH 40 pins (AXN340038S + AXN440330S)` `1 x ICC-ICB 50 pins (AXN350038S + AXN450330S)` `copper: m = 2 x (0.0461 + 0.0515) g + NULL x { 2 x (0.0865 + 0.0965) g } + 2 x (0.1153 + 0.1287) g + 1 x (0.1442 + 0.1609) g = 0.9883 g` `density = 8.96 g/cm^3` `--> volume = 0.110 cm^3` `resin: m = 2 x (0.0882 + 0.1085) g + NULL x { 2 x (0.1445 + 0.1547) g } + 2 x (0.1768 + 0.2013) g + 1 x (0.2329 + 0.2764) g = 1.6589 g` `density (epoxy) = 1.3 g/cm^3` `--> volume = 1.276 cm^3` `(5) HV stiffener (2 copies)` `FR4: m = 0.060 g` `density (T_G10) = 1.90 g/cm^3` `--> volume = 0.032 cm^3` `(6) ICC SMD Resistors, 23 x (0603) + 2 x (0805) + 4 x (1206) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed` `m = 0.0983 g` `density = 3.96525 g/cm^3` `--> volume = 0.025 cm^3` `(7) ICC SMD Capacitors, 10 x (0805) + 6 x (1812), mostly BaTiO3, the total mass is computed` `m = 1.5300 g` `density = 6.02 g/cm^3` `--> volume = 0.254 cm^3` `(8-9) ICC ASICs: 1 x ("CRT245" 24 pin) + 2 x ("LVDSBUF" 16 pin)` `epoxy: m = [ ( 1 x 0.015675 ) + ( 2 x 0.038519 ) ] g = 0.092713 g` `density = 1.3 g/cm^3` `--> volume = 0.071 cm^3` `copper: m = [ ( 1 x 0.040 + 2 x 0.076 ) - 0.092713 ] g = 0.099287 g` `density = 8.96 g/cm^3` `--> volume = 0.011 cm^3` `(10-13) Hybrid tail (2 copies)` `(14) HV pin (2 copies)` `.......................................................................` `# "TOB ICC Layer 1/2 (1 APV)" "TOB_L12_ICC1" 12.98 51.92` `* 1 "PCB board" "T_G10" 4.305 1 ELE` `* 2 "PCB copper traces" "Copper" 0.176 1 ELE` `* 3 "NAiS connectors" "Copper" 0.110 1 ELE` `* 4 "NAiS connectors" "Epoxy" 1.276 1 ELE` `* 5 "HV Stiffener" "T_G10" 0.032 2 CAB` `* 6 "ICC Resistors" "Ceramic" 0.025 1 ELE` `* 7 "ICC Capacitors" "Barium_Titanate" 0.254 1 ELE` `* 8 "ICC ASICs EMC" "Epoxy" 0.071 1 ELE` `* 9 "ICC ASICs copper" "Copper" 0.011 1 ELE` `* 10 "Hybrid Tail Kapton" "T_Kapton" 0.028 2 ELE` `* 11 "Hybrid Tail Copper" "Copper" 0.055 2 ELE` `* 12 "Hybrid Tail Solder Mask" "T_Kapton" 0.011 2 ELE` `* 13 "Hybrid Tail Glue" "Epoxy" 0.057 2 ELE` `* 14 "HV pin (module)" "Brass" 0.011 2 ELE` `.......................................................................` `=======================================================================` `ICC2` `----` `Same as Layer 3/4, except:` `Circuit ICC2 (DS_ICC2)` `EDMS Code EP 680-1174-210-D` `(1-2) PCBs` `FR4: m = 12.508 g` `density (T_G10) = 1.90 g/cm^3` `--> volume = 6.583 cm^3` `copper: m = 2.452 g` `density = 8.96 g/cm^3` `--> volume = 0.274 cm^3` `(3-4) Connectors NaiS` `socket + header` `4 x ICC-Kapton bias PCB 16 pins (AXN316038S + AXN416330S)` `THIS GOES IN AOH 4 x ICC-AOH 30 pins (AXN330038S + AXN430330S)` `4 x ICC-FEH 40 pins (AXN340038S + AXN440330S)` `1 x ICC-ICB 50 pins (AXN350038S + AXN450330S)` `copper: m = 4 x (0.0461 + 0.0515) g + NULL x { 4 x (0.0865 + 0.0965) g } + 4 x (0.1153 + 0.1287) g + 1 x (0.1442 + 0.1609) g = 1.6715 g` `density = 8.96 g/cm^3` `--> volume = 0.187 cm^3` `resin: m = 4 x (0.0882 + 0.1085) g + NULL x { 4 x (0.1445 + 0.1547) g } + 4 x (0.1768 + 0.2013) g + 1 x (0.2329 + 0.2764) g = 2.8085 g` `density (epoxy) = 1.3 g/cm^3` `--> volume = 2.160 cm^3` `(5) HV stiffener (4 copies)` `FR4: m = 0.060 g` `density (T_G10) = 1.90 g/cm^3` `--> volume = 0.032 cm^3` `(6) ICC SMD Resistors, 46 x (0603) + 4 x (0805) + 4 x (1206) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed` `m = 0.1575 g` `density = 3.96525 g/cm^3` `--> volume = 0.040 cm^3` `(7) ICC SMD Capacitors, 18 x (0805) + 12 x (1812), mostly BaTiO3, the total mass is computed` `m = 3.030 g` `density = 6.02 g/cm^3` `--> volume = 0.503 cm^3` `(8-9) ICC ASICs: 1 x ("CRT245" 24 pin) + 4 x ("LVDSBUF" 16 pin)` `epoxy: m = ( 1 x 0.015675 + 4 x 0.038519 ) g = 0.169751 g` `density = 1.3 g/cm^3` `--> volume = 0.131 cm^3` `copper: m = [ ( 1 x 0.040 + 4 x 0.076 ) - 0.169751 ) g = 0.274249 g` `density = 8.96 g/cm^3` `--> volume = 0.031 cm^3` `(10-13) Hybrid tail (4 copies)` `(14) HV pin (4 copies)` `.......................................................................` `# "TOB ICC Layer 1/2 (2 APVs)" "TOB_L12_ICC2" 20.06 80.24` `* 1 "PCB board" "T_G10" 6.583 1 ELE` `* 2 "PCB copper traces" "Copper" 0.274 1 ELE` `* 3 "NAiS connectors" "Copper" 0.187 1 ELE` `* 4 "NAiS connectors" "Epoxy" 2.160 1 ELE` `* 5 "HV Stiffener" "T_G10" 0.032 4 CAB` `* 6 "ICC Resistors" "Ceramic" 0.040 1 ELE` `* 7 "ICC Capacitors" "Barium_Titanate" 0.503 1 ELE` `* 8 "ICC ASICs EMC" "Epoxy" 0.131 1 ELE` `* 9 "ICC ASICs copper" "Copper" 0.031 1 ELE` `* 10 "Hybrid Tail Kapton" "T_Kapton" 0.028 4 ELE` `* 11 "Hybrid Tail Copper" "Copper" 0.055 4 ELE` `* 12 "Hybrid Tail Solder Mask" "T_Kapton" 0.011 4 ELE` `* 13 "Hybrid Tail Glue" "Epoxy" 0.057 4 ELE` `* 14 "HV pin (module)" "Brass" 0.011 4 ELE` `.......................................................................` `=======================================================================` `Layer 3/4` `---------` `ICC1` `----` `Circuit ICC3 (SS_ICC1)` `EDMS Code EP 680-1174-220-B` `MCVolume: ( 11.8 x 4.4 x 0.25 ) cm^3 = 12.98 cm^3` `(1-2) PCBs` `FR4: m = 5.754 g` `density (T_G10) = 1.90 g/cm^3` `--> volume = 3.028 cm^3` `copper: m = 1.289 g` `density = 8.96 g/cm^3` `--> volume = 0.144 cm^3` `(3-4) Connectors NaiS` `socket + header` `1 x ICC-Kapton bias PCB 16 pins (AXN316038S + AXN416330S)` `THIS GOES IN AOH 1 x ICC-AOH 30 pins (AXN330038S + AXN430330S)` `1 x ICC-FEH 40 pins (AXN340038S + AXN440330S)` `1 x ICC-ICB 50 pins (AXN350038S + AXN450330S)` `copper: m = 1 x (0.0461 + 0.0515) g + NULL x { 1 x (0.0865 + 0.0965) g } + 1 x (0.1153 + 0.1287) g + 1 x (0.1442 + 0.1609) g = 0.6467 g` `density = 8.96 g/cm^3` `--> volume = 0.0722 cm^3` `resin: m = 1 x (0.0882 + 0.1085) g + NULL x { 1 x (0.1445 + 0.1547) g } + 1 x (0.1768 + 0.2013) g + 1 x (0.2329 + 0.2764) g = 1.0841 g` `density (epoxy) = 1.3 g/cm^3` `--> volume = 0.834 cm^3` `(5) HV stiffener` `FR4: m = 0.060 g` `density (T_G10) = 1.90 g/cm^3` `--> volume = 0.032 cm^3` `(6) ICC SMD Resistors, 14 x (0603) + 1 x (0805) + 4 x (1206) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed` `m = 0.0741 g` `density = 3.96525 g/cm^3` `--> volume = 0.019 cm^3` `(7) ICC SMD Capacitors, 7 x (0805) + 4 x (1812), mostly BaTiO3, the total mass is computed` `m = 1.025 g` `density = 6.02 g/cm^3` `--> volume = 0.170 cm^3` `(8-9) ICC ASICs: 1 x ("CRT245" 24 pin) + 1 x ("LVDSBUF" 16 pin)` `epoxy: m = [ ( 1 x 0.015675 ) + ( 1 x 0.038519 ) ] g = 0.054194 g` `density = 1.3 g/cm^3` `--> volume = 0.042 cm^3` `copper: m = [ ( 1 x 0.040 + 1 x 0.076 ) - 0.054194 ] g = 0.061806 g` `density = 8.96 g/cm^3` `--> volume = 0.007 cm^3` `(10-13) Hybrid tail` `see http://www.fynu.ucl.ac.be/he/cms/activities/tracker/FHITfiles/CCTPHybrides.pdf` `surface: (19 x 30) mm^2 = 570 mm^2 = 5.70 cm^2` `- Kapton: (25+25) um = 50 um = 0.0050 cm --> 0.0285 cm^3` `- Copper: (18+12+18+18+18+12) um = 96 um = 0.0096 cm --> 0.05472 cm^3` `- Solder Mask: 20 um = 0.0020 cm --> 0.0114 cm^3` `- Glue: (50+50) um = 100 um thickness = 0.0100 cm --> 0.057 cm^3` `(14) HV pin` `module side:` `http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm` `m = 0.04 g per module` `ICB side:` `http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/ICB_MB.htm` `m = 0.330 g (6 HV wires) --> 0.330 g / 6 = 0.055 g per module` `HV pin (brass CuZn36Pb3 Sn plated):` `m = ( 0.04 + 0.055 ) g = 0.095 g` `density (brass) = 8.5 g/cm^3` `--> volume = 0.011 cm^3` `.......................................................................` `# "TOB ICC Layer 3/4 (1 APV)" "TOB_L34_ICC1" 12.98 51.92` `* 1 "PCB board" "T_G10" 3.028 1 ELE` `* 2 "PCB copper traces" "Copper" 0.144 1 ELE` `* 3 "NAiS connectors" "Copper" 0.0722 1 ELE` `* 4 "NAiS connectors" "Epoxy" 0.834 1 ELE` `* 5 "HV Stiffener" "T_G10" 0.032 1 CAB` `* 6 "ICC Resistors" "Ceramic" 0.019 1 ELE` `* 7 "ICC Capacitors" "Barium_Titanate" 0.170 1 ELE` `* 8 "ICC ASICs EMC" "Epoxy" 0.042 1 ELE` `* 9 "ICC ASICs copper" "Copper" 0.007 1 ELE` `* 10 "Hybrid Tail Kapton" "T_Kapton" 0.028 1 ELE` `* 11 "Hybrid Tail Copper" "Copper" 0.055 1 ELE` `* 12 "Hybrid Tail Solder Mask" "T_Kapton" 0.011 1 ELE` `* 13 "Hybrid Tail Glue" "Epoxy" 0.057 1 ELE` `* 14 "HV pin (module)" "Brass" 0.011 1 ELE` `.......................................................................` `=======================================================================` `ICC2` `----` `Circuit ICC4 (SS_ICC2)` `EDMS Code EP 680-1174-230-B` `MCVolume: ( 11.8 x 6.8 x 0.25 ) cm^3 = 20.06 cm^3` `(1-2) PCBs` `FR4: m = 8.175 g` `density (T_G10) = 1.90 g/cm^3` `--> volume = 4.302 cm^3` `copper: m = 1.617 g` `density = 8.96 g/cm^3` `--> volume = 0.180 cm^3` `(3-4) Connectors NaiS` `socket + header` `2 x ICC-Kapton bias PCB 16 pins (AXN316038S + AXN416330S)` `THIS GOES IN AOH 2 x ICC-AOH 30 pins (AXN330038S + AXN430330S)` `2 x ICC-FEH 40 pins (AXN340038S + AXN440330S)` `1 x ICC-ICB 50 pins (AXN350038S + AXN450330S)` `copper: m = 2 x (0.0461 + 0.0515) g + NULL x { 2 x (0.0865 + 0.0965) g } + 2 x (0.1153 + 0.1287) g + 1 x (0.1442 + 0.1609) g = 0.9883 g` `density = 8.96 g/cm^3` `--> volume = 0.110 cm^3` `resin: m = 2 x (0.0882 + 0.1085) g + NULL x { 2 x (0.1445 + 0.1547) g } + 2 x (0.1768 + 0.2013) g + 1 x (0.2329 + 0.2764) g = 1.6589 g` `density (epoxy) = 1.3 g/cm^3` `--> volume = 1.276 cm^3` `(5) HV stiffener (2 copies)` `FR4: m = 0.060 g` `density (T_G10) = 1.90 g/cm^3` `--> volume = 0.032 cm^3` `(6) ICC SMD Resistors, 28 x (0603) + 2 x (0805) + 4 x (1206) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed` `m = 0.1090 g` `density = 3.96525 g/cm^3` `--> volume = 0.027 cm^3` `(7) ICC SMD Capacitors, 12 x (0805) + 8 x (1812), mostly BaTiO3, the total mass is computed` `m = 2.020 g` `density = 6.02 g/cm^3` `--> volume = 0.336 cm^3` `(8-9) ICC ASICs: 1 x ("CRT245" 24 pin) + 2 x ("LVDSBUF" 16 pin)` `epoxy: m = ( 1 x 0.015675 + 2 x 0.038519 ) g = 0.092713 g` `density = 1.3 g/cm^3` `--> volume = 0.0713 cm^3` `copper: m = [ ( 1 x 0.040 + 2 x 0.076 ) - 0.092713 ) g = 0.099287 g` `density = 8.96 g/cm^3` `--> volume = 0.011 cm^3` `(10-13) Hybrid tail (2 copies)` `see http://www.fynu.ucl.ac.be/he/cms/activities/tracker/FHITfiles/CCTPHybrides.pdf` `surface: (19 x 30) mm^2 = 570 mm^2 = 5.70 cm^2` `- Kapton: (25+25) um = 50 um = 0.0050 cm --> 0.0285 cm^3` `- Copper: (18+12+18+18+18+12) um = 96 um = 0.0096 cm --> 0.05472 cm^3` `- Solder Mask: 20 um = 0.0020 cm --> 0.0114 cm^3` `- Glue: (50+50) um = 100 um thickness = 0.0100 cm --> 0.057 cm^3` `(14) HV pin (2 copies)` `module side:` `http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm` `m = 0.04 g per module` `ICB side:` `http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/ICB_MB.htm` `m = 0.330 g (6 HV wires) --> 0.330 g / 6 = 0.055 per module` `HV pin (brass CuZn36Pb3 Sn plated):` `m = ( 0.04 + 0.055 ) g = 0.095 g` `density (brass) = 8.5 g/cm^3` `--> volume = 0.011 cm^3` `.......................................................................` `# "TOB ICC Layer 3/4 (2 APVs)" "TOB_L34_ICC2" 20.06 80.24` `* 1 "PCB board" "T_G10" 4.302 1 ELE` `* 2 "PCB copper traces" "Copper" 0.180 1 ELE` `* 3 "NAiS connectors" "Copper" 0.110 1 ELE` `* 4 "NAiS connectors" "Epoxy" 1.276 1 ELE` `* 5 "HV Stiffener" "T_G10" 0.032 2 CAB` `* 6 "ICC Resistors" "Ceramic" 0.027 1 ELE` `* 7 "ICC Capacitors" "Barium_Titanate" 0.336 1 ELE` `* 8 "ICC ASICs EMC" "Epoxy" 0.0713 1 ELE` `* 9 "ICC ASICs copper" "Copper" 0.011 1 ELE` `* 10 "Hybrid Tail Kapton" "T_Kapton" 0.028 2 ELE` `* 11 "Hybrid Tail Copper" "Copper" 0.055 2 ELE` `* 12 "Hybrid Tail Solder Mask" "T_Kapton" 0.011 2 ELE` `* 13 "Hybrid Tail Glue" "Epoxy" 0.057 2 ELE` `* 14 "HV pin (module)" "Brass" 0.011 2 ELE` `.......................................................................` `=======================================================================` `Layer 5/6` `---------` `ICC1` `----` `Same as Layer 3/4.` `(15-16) Laser Diodes (1 additional copy for the L56 AOH, AOHs have only 2 copies)` `MISSING:m = xxx g` `density = xxx g/cm^3` `--> volume = xxx cm^3` `Covers (Al2O3 Aluminiumoxid, ceramic): m = 0.347 g` `density = 3.96525 g/cm^3` `--> volume = 0.0875 cm^3` `.......................................................................` `# "TOB ICC Layer 5/6 (1 APV)" "TOB_L56_ICC1" 12.98 51.92` `* 1 "PCB board" "T_G10" 3.028 1 ELE` `* 2 "PCB copper traces" "Copper" 0.144 1 ELE` `* 3 "NAiS connectors" "Copper" 0.0722 1 ELE` `* 4 "NAiS connectors" "Epoxy" 0.834 1 ELE` `* 5 "HV Stiffener" "T_G10" 0.032 1 CAB` `* 6 "ICC Resistors" "Ceramic" 0.019 1 ELE` `* 7 "ICC Capacitors" "Barium_Titanate" 0.170 1 ELE` `* 8 "ICC ASICs EMC" "Epoxy" 0.042 1 ELE` `* 9 "ICC ASICs copper" "Copper" 0.007 1 ELE` `* 10 "Hybrid Tail Kapton" "T_Kapton" 0.028 1 ELE` `* 11 "Hybrid Tail Copper" "Copper" 0.055 1 ELE` `* 12 "Hybrid Tail Solder Mask" "T_Kapton" 0.011 1 ELE` `* 13 "Hybrid Tail Glue" "Epoxy" 0.057 1 ELE` `* 14 "HV pin (module)" "Brass" 0.011 1 ELE` `* 15 "Laser Diode" "Air" 0.0000 1 ELE` `* 16 "Laser Cover" "Ceramic" 0.0875 1 ELE` `.......................................................................` `=======================================================================` `ICC2` `----` `Same as Layer 3/4.` `(14-15) Laser Diodes (2 additional copies for the L56 AOH, AOHs have only 2 copies)` `MISSING:m = xxx g` `density = xxx g/cm^3` `--> volume = xxx cm^3` `Covers (Al2O3 Aluminiumoxid, ceramic): m = 0.347 g` `density = 3.96525 g/cm^3` `--> volume = 0.0875 cm^3` `.......................................................................` `# "TOB ICC Layer 5/6 (2 APVs)" "TOB_L56_ICC2" 20.06 80.24` `* 1 "PCB board" "T_G10" 4.302 1 ELE` `* 2 "PCB copper traces" "Copper" 0.180 1 ELE` `* 3 "NAiS connectors" "Copper" 0.151 1 ELE` `* 4 "NAiS connectors" "Epoxy" 1.736 1 ELE` `* 5 "HV Stiffener" "T_G10" 0.032 2 CAB` `* 6 "ICC Resistors" "Ceramic" 0.027 1 ELE` `* 7 "ICC Capacitors" "Barium_Titanate" 0.336 1 ELE` `* 8 "ICC ASICs EMC" "Epoxy" 0.0713 1 ELE` `* 9 "ICC ASICs copper" "Copper" 0.011 1 ELE` `* 10 "Hybrid Tail Kapton" "T_Kapton" 0.028 2 ELE` `* 11 "Hybrid Tail Copper" "Copper" 0.055 2 ELE` `* 12 "Hybrid Tail Solder Mask" "T_Kapton" 0.011 2 ELE` `* 13 "Hybrid Tail Glue" "Epoxy" 0.057 2 ELE` `* 14 "Laser Diode" "Air" 0.0000 2 ELE` `* 15 "Laser Cover" "Ceramic" 0.0875 2 ELE` `.......................................................................` `=======================================================================` `o AOH` `---` `MCVolume: ( 2.3 x 3.0 x 0.2 ) cm^3 = 1.38 cm^3` `(1-2) PCBs` `FR4: m = 0.65 g` `density (T_G10) = 1.90 g/cm^3` `--> volume = 0.342 cm^3` `copper: m = 0.497 g` `density = 8.96 g/cm^3` `--> volume = 0.055 cm^3` `(3-4) Connectors NaiS` `socket + header` `1 x ICC-AOH 30 pins (AXN330038S + AXN430330S)` `copper: m = 1 x (0.0865 + 0.0965) g = 0.183 g` `density = 8.96 g/cm^3` `--> volume = 0.020 cm^3` `resin: m = 1 x (0.1445 + 0.1547) g = 0.2992 g` `density (epoxy) = 1.3 g/cm^3` `--> volume = 0.230 cm^3` `(5) AOH SMD Resistors, 6 x (0603) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed` `m = 0.0127 g` `density = 3.96525 g/cm^3` `--> volume = 0.0032 cm^3` `(6) AOH SMD Capacitors, 3 x (0603) + 3 x (0805) mostly BaTiO3, the total mass is computed` `m = 0.0687 g` `density = 6.02 g/cm^3` `--> volume = 0.0114 cm^3` `(7-8) AOH ASICs: 1 x ("LLD" 32 pin)` `epoxy: m = ( 1 x 0.027098 ) g = 0.027098 g` `density = 1.3 g/cm^3` `--> volume = 0.0208 cm^3` `copper: m = [ ( 1 x 0.070 ) - 0.027098 ) ] g = 0.042902 g` `density = 8.96 g/cm^3` `--> volume = 0.0048 cm^3` `(9-10) Laser Diodes (2 copies per each AOH + 2 additional copies for the L56 AOH directly in TOB_L56_ICC1/2)` `MISSING:m = xxx g` `density = xxx g/cm^3` `--> volume = xxx cm^3` `Covers (Al2O3 Aluminiumoxid, ceramic): m = 0.347 g` `density = 3.96525 g/cm^3` `--> volume = 0.0875 cm^3` `(11) 3D Label` `Plastic (kapton): m = 0.020 g` `density = 1.40 g/cm^3` `--> volume = 0.0143 cm^3` `.......................................................................` `# "TOB AOH" "TOB_AOH" 1.38 6.90` `* 1 "PCB board" "T_G10" 0.342 1 ELE` `* 2 "PCB copper traces" "Copper" 0.055 1 ELE` `* 3 "NAiS connectors" "Copper" 0.020 1 ELE` `* 4 "NAiS connectors" "Epoxy" 0.230 1 ELE` `* 5 "AOH Resistors" "Ceramic" 0.0032 1 ELE` `* 6 "AOH Capacitors" "Barium_Titanate" 0.0114 1 ELE` `* 7 "AOH ASICs EMC" "Epoxy" 0.0208 1 ELE` `* 8 "AOH ASICs copper" "Copper" 0.0048 1 ELE` `* 9 "Laser Diode" "Air" 0.0000 2 ELE` `* 10 "Laser Cover" "Ceramic" 0.0875 2 ELE` `* 11 "AOH 3D Label" "T_Kapton" 0.0143 1 ELE` `.......................................................................` `=======================================================================` `o TOB_CCUM` `---------` `The TOB CCUM board.` `Composition taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/CCUM_MB.htm` `MCVolume: (11.8 x 7.0 x 0.25) cm^3 = 20.65 cm^3` `CCUM` `-----` `(1) CCUM FR4 (G10) EDMS Code EDA-00036-V1` `m = 13.190 g` `density = 1.90 g/cm^3` `--> volume = 6.942 cm^3` `(2) CCUM copper traces EDMS Code EDA-00036-V1` `m = 2.787 g` `density = 8.96 g/cm^3` `--> volume = 0.311 cm^3` `(3-4) CCUM NAiS connector EDMS Code EDA-00036-V1, details from http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Connectors_MB.htm` `socket + header CCUM-ICB 80 pins (AXN350038S + AXN480330S)` `copper: m = (0.2306 + 0.2574) g = 0.488 g` `density = 8.96 g/cm^3` `--> volume = 0.054 cm^3` `resin: m = (0.337 + 0.3882) g = 0.7259 g` `density (epoxy) = 1.3 g/cm^3` `--> volume = 0.558 cm^3` `(5) CCUM SMD Resistors EDMS Code EDA-00036-V1, 28 x (0603), mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed` `m = 0.060 g` `density = 3.96525 g/cm^3` `--> volume = 0.015 cm^3` `(6) CCUM SMD Capacitors EDMS Code EDA-00036-V1, 20 x (0805) + 3 x (1210), mostly BaTiO3, the total mass is computed` `m = 0.570 g` `density = 6.02 g/cm^3` `--> volume = 0.095 cm^3` `(7-9) CCUM ASICs EDMS Code EDA-00036-V1 IC "CCU" 196 pin` `BGA196 (Ball Grid Array), Sn/Pb/Ag 62/36/2:` `m = 0.1131 g` `density = 8.82 g/cm^3` `--> volume = 0.013 cm^3` `epoxy: m = 0.4269 g` `density = 1.3 g/cm^3` `volume = 0.328 cm^3` `copper: m = (0.678 - 0.1131 - 0.4269) g = 0.138 g` `density = 8.96 g/cm^3` `--> volume = 0.015 cm^3` `(10) Other components: araldite glue (take epoxy): 1/2 CCUM, (1/4 SCLAC), (1/4 SCACC)` `m = 1.05 g / 2 = 0.525 g` `density = 1.3 g/cm^3` `volume = 0.404 cm^3` `The wires are in TOB_Conn[12/34/56]` `............................................................................` `# "TOB CCUM board" "TOB_CCUM" 20.65 82.6` `* 1 "CCUM board" "T_G10" 6.942 1 ELE` `* 2 "CCUM copper traces" "Copper" 0.311 1 ELE` `* 3 "CCUM-ICB NAiS connector" "Copper" 0.054 1 ELE` `* 4 "CCUM-ICB NAiS connector" "Epoxy" 0.558 1 ELE` `* 5 "CCUM Resistors" "Ceramic" 0.015 1 ELE` `* 6 "CCUM Capacitors" "Barium_Titanate" 0.095 1 ELE` `* 7 "CCUM ASICs BGA" "BGA" 0.013 1 ELE` `* 8 "CCUM ASICs EMC" "Epoxy" 0.328 1 ELE` `* 9 "CCUM ASICs copper" "Copper" 0.015 1 ELE` `* 10 "CCUM glue" "Epoxy" 0.404 1 ELE` `............................................................................` `============================================================================` `o TOB Rod Connectors (inside)` `---------------------------` `MCVolume: (11.800 x 7.500 x 0.500) cm^3 = 44.25 cm^3` `All the TOB Connectors are the same (Layers 12/34/56) except the optical part.` `Layer 1/2` `----------` `As Layer 3/4, except optical components.` `Optical components` `------------------` `Different for different layers` `(22-24) Optical fibers` `masses are per AOH, multiplicity will be given by the number of AOHs` `AOH x ( #fibers x type ) x length_fraction` `length_fraction: (total_length-5) cm per each fiber is in TOB_optfib_L12` `2 x ( TOB_2_088 ) x 5/88 = 2 x 2 x 88 cm x 5/88 = 20 cm` `2 x ( TOB_2_070 ) x 5/70 = 2 x 2 x 70 cm x 5/70 = 20 cm` `4 x ( TOB_2_056 ) x 5/56 = 4 x 2 x 56 cm x 5/56 = 40 cm` `4 x ( TOB_2_035 ) x 5/35 = 4 x 2 x 35 c mx 5/35 = 40 cm` `Total optical fibers length: 120 cm` `All here:` `3D label tags (kapton): m = [ (2 x 2) + (2 x 2) + (4 x 2) + (4 x 2) ] x 0.110 g = 24 x 0.110 g = 2.64 g` `density = 1.40 g/cm^3` `--> volume = 1.714 cm^3` `MU connectors (kapton): m = [ (2 x 2) + (2 x 2) + (4 x 2) + (4 x 2) ] x 0.822 g = 24 x 0.822 g = 19.728 g` `density = 1.40 g/cm^3` `--> volume = 14.091 cm^3` `(25) Ribbon connectors (2 copies)` `(26) Ruggedized ribbon: total length 80 mm` `.....................................................................................` `# "TOB Rod Connections Layer 1/2" "TOB_CONN12" 44.25 88.5` `* 1 "SCLAC board" "T_G10" 0.211 1 ELE` `* 2 "SCLAC copper traces" "Copper" 0.007 1 ELE` `* 3 "CCUM wires Cu" "Copper" 0.191 2 CAB` `* 4 "CCUM wires Al" "Aluminium" 0.123 2 CAB` `* 5 "CCUM wires PEI" "Silicone_Gel" 0.203 2 CAB` `* 6 "CCUM wires SILTEM" "Polyethylene" 0.788 2 CAB` `* 7 "BUS wires Cu" "Copper" 0.740 1 CAB` `* 8 "BUS wires Al" "Aluminium" 0.0877 1 CAB` `* 9 "BUS wires PEI" "Silicone_Gel" 0.144 1 CAB` `* 10 "BUS wires SILTEM" "Polyethylene" 2.365 1 CAB` `* 11 "SCLAC glue" "Epoxy" 0.202 1 SUP` `* 12 "Output cable Shield" "Aluminium" 0.089 1 CAB` `* 13 "Output cable Sleeve" "Polyethylene" 0.642 1 CAB` `* 14 "Input and Output cable Tie" "T_Kapton" 0.195 1 CAB` `* 15 "Input and Output cable Solder Paste" "BGA" 0.038 1 CAB` `* 16 "ICB,LVLAC,HVLAC glue" "Epoxy" 0.181 1 SUP` `* 17 "ICB Solder Paste" "BGA" 0.005 1 CAB` `* 18 "LVLAC substrate" "T_G10" 0.242 1 ELE` `* 19 "LVLAC copper traces" "Copper" 0.0126 1 ELE` `* 20 "HVLAC substrate" "T_G10" 0.174 1 ELE` `* 21 "HVLAC copper traces" "Copper" 0.0036 1 ELE` `* 22 "Optical fibers" "Optical_Fiber" 6.362E-3 120 CAB` `* 23 "Optical fibers 3D label tag" "T_Kapton" 1.714 1 CAB` `* 24 "Optical fibers MU connectors" "T_Kapton" 14.091 1 CAB` `* 25 "Ribbon Connectors" "T_Ribbon12xMUConn" 12.0 2 CAB` `* 26 "Ruggedized ribbons" "T_RuggRibbon" 0.086 8 CAB` `.....................................................................................` `=====================================================================================` `Layer 3/4` `----------` `SCLAC` `-----` `Ladder Adapter Card` `Composition taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/CCUM_MB.htm` `EDMS Code EP 680-1174-510` `(1) SCLAC FR4` `m = 0.400 g` `density = 1.90 g/cm^3` `--> volume = 0.211 cm^3` `(2) SCLAC copper traces` `m = 0.061 g` `density = 8.96 g/cm^3` `--> volume = 0.007 cm^3` `Wires` `-----` `Short tail (to be multiplied by 2, the difference 'long tail'-1x'short tail' will be included outside)` `(3-6) - Connected to CCUM` `Shielded Twisted pair (112 mm), 9 pairs, total mass of a single wire (number of components to be multiplied by 2)` `+ shielded twisted pair + 0.5 mm^2 Copper wire, 2 pieces 106 mm 1 piece 100 mm.` `Tinned copper wire 100% outside the rod.` `total mass; 2 copies in the mixture` `Copper: m = ( 0.3417 + 0.9328 + 0.4400 ) g = 1.7145 g` `density = 8.96 g/cm^3` `--> volume = 0.191 cm^3` `Aluminium:` `m = ( 0.3326 + 0 + 0 ) = 0.3326 g` `density = 2.7 g/cm^3` `--> volume = 0.123 cm^3` `PEI: m = ( 0.1956 + 0 + 0 ) = 0.1956 g` `density (silicone gel) = 0.965 g/cm^3` `--> volume = 0.203 cm^3` `SILTEM: m = ( 0 + 0.5088 + 0.240 ) g = 0.7488 g` `density (polyethylene) = 0.95 g/cm^3` `--> volume = 0.788 cm^3` `(7-10) - Connected to BUS` `Shielded Twisted pair (112 mm), 4 pieces` `+ Shielded Twisted pair (135 mm), 2 pieces` `+ 1.0 mm^2 Copper wire, 4 pieces 112 mm` `+ 0.5 mm^2 Copper wire, 1 piece 112 mm, 1 piece 147 mm, 1 piece 149 mm` `+ 1.0 mm^2 Copper wire, 1 piece 290 mm, only 80 mm here, the rest outside the rod` `total mass; 1 only copy in the mixture` `Copper: m = ( 0.1519 + 0.0915 + 3.8976 + 0.4928 + 0.6468 + 0.6556 + 80/290 x 2.5230 ) g = 6.6322 g` `density = 8.96 g/cm^3` `--> volume = 0.740 cm^3` `Aluminium:` `m = ( 0.1478 + 0.0891 + 0 + 0 + 0 + 0 + 80/290 x 0 ) = 0.2369 g` `density = 2.7 g/cm^3` `--> volume = 0.0877 cm^3` `PEI: m = ( 0.0869 + 0.0524 + 0 + 0 + 0 + 0 + 80/290 x 0 ) = 0.1393 g` `density (silicone gel) = 0.965 g/cm^3` `--> volume = 0.144 cm^3` `SILTEM: m = ( 0 + 0 + 1.0752 + 0.2688 + 0.3528 + 0.3576 + 80/290 x 0.6960 ) g = 2.2464 g` `density (polyethylene) = 0.95 g/cm^3` `--> volume = 2.365 cm^3` `Other components` `----------------` `(11) Araldite glue (take epoxy): (1/2 CCUM), 1/4 SCLAC, (1/4 SCACC)` `m = 1.05 g / 4 = 0.2625 g` `density = 1.3 g/cm^3` `volume = 0.202 cm^3` `(12) Output cable shield Aluminium: 1/2 here, (1/2 outside)` `m = 0.480 g / 2 = 0.240 g` `density = 2.7 g/cm^3` `volume = 0.089 cm^3` `(13) Output cable sleeve (l=55 mm, ext diameter=9.5 mm, 1 piece) + (l=10 mm, ext diameter=3.0 mm, 4 pieces) Polyolefin (take polyethylene):` `total mass, 1/2 here, (1/2 outside)` `m = ( 0.90 + 0.32 ) g / 2 = 0.61 g` `density = 0.95 g/cm^3` `volume = 0.642 cm^3` `(14) Input & Output cable tie Kapton: 2/3 here, (1/3 outside)` `m = 0.41 g * (2/3) = 0.273 g` `density = 1.40 g/cm^3` `volume = 0.195 cm^3` `(15) Input & Output cable solder paste (BGA): 1/2 here, (1/2 outside)` `m = 0.67 g / 2 = 0.335 g` `density = 8.82 g/cm^3` `volume = 0.038 cm^3` `(16) ICB Araldite glue (take epoxy): 1/2 CONN, (1/2 ICB)` `m = 0.47 g / 2 = 0.235 g` `density = 1.3 g/cm^3` `volume = 0.181 cm^3` `(17) ICB Solder paste (BGA): (1/2 ICB), 1/2 CONN` `m = 0.09 g / 2 = 0.045 g` `density = 8.82 g/cm^3` `volume = 0.005 cm^3` `LVLAC` `-----` `(18-19) LVLAC From the ICB` `FR4: m = 0.46 g` `density (T_G10) = 1.90 g/cm^3` `--> volume = 0.242 cm^3` `Copper: m = 0.113 g` `density = 8.96 g/cm^3` `--> volume = 0.0126 cm^3` `HVLAC` `-----` `(20-21) HVLAC From the ICB` `FR4: m = 0.33 g` `density (T_G10) = 1.90 g/cm^3` `--> volume = 0.174 cm^3` `Copper: m = 0.032 g` `density = 8.96 g/cm^3` `--> volume = 0.0036 cm^3` `SCCAC` `-----` `Slow Control Cable Adapter Card` `Composition taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/CCUM_MB.htm` `2 x short tail` `It will go 100% outside` `Optical components` `------------------` `Different for different layers` `(22-24) Optical fibers` `masses are per AOH, multiplicity will be given by the number of AOHs` `AOH x ( #fibers x type ) x length_fraction` `length_fraction: (total_length-5) cm per each fiber is in TOB_optfib_L34` `1 x ( TOB_2_088 ) x 5/88 = 1 x 2 x 88 cm x 5/88 = 10 cm` `1 x ( TOB_2_070 ) x 5/70 = 1 x 2 x 70 cm x 5/70 = 10 cm` `2 x ( TOB_2_056 ) x 5/56 = 2 x 2 x 56 cm x 5/56 = 20 cm` `2 x ( TOB_2_035 ) x 5/35 = 2 x 2 x 35 c mx 5/35 = 20 cm` `Total optical fibers length: 60 cm` `All here:` `3D label tags (kapton): m = [ (1 x 2) + (1 x 2) + (2 x 2) + (2 x 2) ] x 0.110 g = 12 x 0.110 g = 1.32 g` `density = 1.40 g/cm^3` `--> volume = 0.943 cm^3` `MU connectors (kapton): m = [ (1 x 2) + (1 x 2) + (2 x 2) + (2 x 2) ] x 0.822 g = 12 x 0.822 g = 9.864 g` `density = 1.40 g/cm^3` `--> volume = 7.046 cm^3` `(25) Ribbon connectors (1 copy)` `(26) Ruggedized ribbon: total length 40 mm` `.....................................................................................` `# "TOB Rod Connections Layer 3/4" "TOB_CONN34" 44.25 88.5` `* 1 "SCLAC board" "T_G10" 0.211 1 ELE` `* 2 "SCLAC copper traces" "Copper" 0.007 1 ELE` `* 3 "CCUM wires Cu" "Copper" 0.191 2 CAB` `* 4 "CCUM wires Al" "Aluminium" 0.123 2 CAB` `* 5 "CCUM wires PEI" "Silicone_Gel" 0.203 2 CAB` `* 6 "CCUM wires SILTEM" "Polyethylene" 0.788 2 CAB` `* 7 "BUS wires Cu" "Copper" 0.740 1 CAB` `* 8 "BUS wires Al" "Aluminium" 0.0877 1 CAB` `* 9 "BUS wires PEI" "Silicone_Gel" 0.144 1 CAB` `* 10 "BUS wires SILTEM" "Polyethylene" 2.365 1 CAB` `* 11 "SCLAC glue" "Epoxy" 0.202 1 SUP` `* 12 "Output cable Shield" "Aluminium" 0.089 1 CAB` `* 13 "Output cable Sleeve" "Polyethylene" 0.642 1 CAB` `* 14 "Input and Output cable Tie" "T_Kapton" 0.195 1 CAB` `* 15 "Input and Output cable Solder Paste" "BGA" 0.038 1 CAB` `* 16 "ICB,LVLAC,HVLAC glue" "Epoxy" 0.181 1 SUP` `* 17 "ICB Solder Paste" "BGA" 0.005 1 CAB` `* 18 "LVLAC substrate" "T_G10" 0.242 1 ELE` `* 19 "LVLAC copper traces" "Copper" 0.0126 1 ELE` `* 20 "HVLAC substrate" "T_G10" 0.174 1 ELE` `* 21 "HVLAC copper traces" "Copper" 0.0036 1 ELE` `* 22 "Optical fibers" "Optical_Fiber" 6.362E-3 60 CAB` `* 23 "Optical fibers 3D label tag" "T_Kapton" 0.943 1 CAB` `* 24 "Optical fibers MU connectors" "T_Kapton" 7.046 1 CAB` `* 25 "Ribbon Connectors" "T_Ribbon12xMUConn" 12.0 1 CAB` `* 26 "Ruggedized ribbons" "T_RuggRibbon" 0.086 4 CAB` `.....................................................................................` `=====================================================================================` `Layer 5/6` `----------` `As Layer 3/4, except optical components.` `Optical components` `------------------` `Different for different layers` `(22-24) Optical fibers` `masses are per AOH, multiplicity will be given by the number of AOHs` `AOH x ( #fibers x type ) x length_fraction` `length_fraction: (total_length-5) cm per each fiber is in TOB_optfib_L56` `1 x ( TOB_3_088 ) x 5/88 = 1 x 3 x 88 cm x 5/88 = 15 cm` `1 x ( TOB_3_070 ) x 5/70 = 1 x 3 x 70 cm x 5/70 = 15 cm` `2 x ( TOB_3_056 ) x 5/56 = 2 x 3 x 56 cm x 5/56 = 30 cm` `2 x ( TOB_3_035 ) x 5/35 = 2 x 3 x 35 c mx 5/35 = 30 cm` `Total optical fibers length: 90 cm` `All here:` `3D label tags (kapton): m = [ (1 x 3) + (1 x 3) + (2 x 3) + (2 x 3) ] x 0.110 g = 18 x 0.110 g = 1.98 g` `density = 1.40 g/cm^3` `--> volume = 1.414 cm^3` `MU connectors (kapton): m = [ (1 x 3) + (1 x 3) + (2 x 3) + (2 x 3) ] x 0.822 g = 18 x 0.822 g = 14.796 g` `density = 1.40 g/cm^3` `--> volume = 10.569 cm^3` `(25) Ribbon connectors (2 copies)` `(26) Ruggedized ribbon: total length 60 mm` `.....................................................................................` `# "TOB Rod Connections Layer 5/6" "TOB_CONN56" 44.25 88.5` `* 1 "SCLAC board" "T_G10" 0.211 1 ELE` `* 2 "SCLAC copper traces" "Copper" 0.007 1 ELE` `* 3 "CCUM wires Cu" "Copper" 0.191 2 CAB` `* 4 "CCUM wires Al" "Aluminium" 0.123 2 CAB` `* 5 "CCUM wires PEI" "Silicone_Gel" 0.203 2 CAB` `* 6 "CCUM wires SILTEM" "Polyethylene" 0.788 2 CAB` `* 7 "BUS wires Cu" "Copper" 0.740 1 CAB` `* 8 "BUS wires Al" "Aluminium" 0.0877 1 CAB` `* 9 "BUS wires PEI" "Silicone_Gel" 0.144 1 CAB` `* 10 "BUS wires SILTEM" "Polyethylene" 2.365 1 CAB` `* 11 "SCLAC glue" "Epoxy" 0.202 1 SUP` `* 12 "Output cable Shield" "Aluminium" 0.089 1 CAB` `* 13 "Output cable Sleeve" "Polyethylene" 0.642 1 CAB` `* 14 "Input and Output cable Tie" "T_Kapton" 0.195 1 CAB` `* 15 "Input and Output cable Solder Paste" "BGA" 0.038 1 CAB` `* 16 "ICB,LVLAC,HVLAC glue" "Epoxy" 0.181 1 SUP` `* 17 "ICB Solder Paste" "BGA" 0.005 1 CAB` `* 18 "LVLAC substrate" "T_G10" 0.242 1 ELE` `* 19 "LVLAC copper traces" "Copper" 0.0126 1 ELE` `* 20 "HVLAC substrate" "T_G10" 0.174 1 ELE` `* 21 "HVLAC copper traces" "Copper" 0.0036 1 ELE` `* 22 "Optical fibers" "Optical_Fiber" 6.362E-3 90 CAB` `* 23 "Optical fibers 3D label tag" "T_Kapton" 1.414 1 CAB` `* 24 "Optical fibers MU connectors" "T_Kapton" 10.569 1 CAB` `* 25 "Ribbon Connectors" "T_Ribbon12xMUConn" 12.0 2 CAB` `* 26 "Ruggedized ribbons" "T_RuggRibbon" 0.086 6 CAB` `.....................................................................................` `=====================================================================================` `# "END" "END" 0. 0.` `this has to be the last line !` `[WAS` `o Aluminium cooling IV` `--------------------` `Al and locator piece at hybrid sides` `No screw !` `MCVolume: 1.5 x 2.8 x 0.03 cm` `(1) Al heat spreader` `dimensions from EDM file CMSTKOBM0024 version 0` `{ [ 15 x 28 ] - (8 x 8 / 2) - [ pi x (2/2)^2 ] } mm^2 x 0.300 mm` `= 384.8584 mm^2 x 0.300 mm = 115.4575 mm^3` `[WAS 0.116 cm^3]` `[THIS MATERIAL HAS BEEN CREATED APART` `(2) CF compensator` `dimensions from EDM file CMSTKOBM0035 version AA` `{ [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm =` `= 337.46 mm^2 x 0.300 mm = 101.238 mm^3` `[WAS 0.15 cm^3]` `]` `(2) CuBe/brass -> take all Cu for now:` `0.0044 cm^3 x 3` `..................................................................` `# "TOB Module Cooling 4" "TOB_mod_cool4" 0.126 4.2` `* 1 "Al heat spreader" "Aluminium" 0.115475 1 COL` `* 2 "Cu locator" "Copper" 0.0044 3 SUP` `..................................................................` `==================================================================` `NO MORE NEEDED, ALL THE SPREADER ARE THE SAME` `]` `[WAS: o TOB_CCUM` `---------` `Not much know at this stage, so here comes some SciFi !` `MCVolume: 11.8 x 7 x 0.25 cm` `Take the proposal from Marchioro with 3 instead of 2 connectors !` `G10 32 x 32 x 1 mm -> 1.02 cm^3` `4 layer Cu 17 um, 50 % occ` `CCU in plastic housing, 15 x 15 x 1mm` `196 solder "balls" diameter 0.5 mm` `2 more plastic ship carriers, 7 x 7 x 0.3 mm` `4 caps, half size of 0402` `8 R "` `For connectors: take Robert's proposal NAIS 80 pin connector.` `......................................................................` `"TOB CCUM board" "TOB_CCUM" 20.65 82.6` `1 "CCUM board" "G10" 1.02 1 ELE` `2 "Copper traces" "Copper" 0.035 1 ELE` `3 "CCU in housing" "T_Kapton" 0.225 1 ELE` `4 "Solder balls" "SMD_metal" 0.01 1 ELE` `5 "Other chips" "T_Kapton" 0.015 2 ELE` `6 "Capacitors" "Alumina" 1.E-4 4 ELE` `7 "Resistors" "Carbon" 1.E-4 8 ELE` `8 "Solder" "SMD_metal" 1.E-4 12 ELE` `9 "Connector" "T_Kapton" 9.107E-3 80 ELE` `10 "Connector pins" "Copper" 8.092E-4 80 ELE` `.....................................................................` `===================================================================== ]` `[WAS: o TOB Electronics ICC1/2` `-----------------------` `Need 6 different mixtures here !` `Don't know about cooling !! Left out for the moment` `$$ Per ICC:` `(1) CF support piece: 12.5 x 3 x 0.09 cm` `(2-3) ICC1 card: 11.8 x 4.4 - 20.252 = 50.92 cm^2 x 0.1 cm = 5.09 cm^3 G10` `Cu : 4 layers a 25 um, 50 % occ => 0.26 cm^3` `ICC2 card: 11.8 x 6.8 - 20.252 = 79.24 cm^2 x 0.1 cm = 7.92 cm^3 G10` `Cu : 0.4 cm^3` `(4-5) Connector pairs: all NAIS` `per pin : Plastic: 0.01275 g -> 9.107E-3 cm^3 Kapton` `Cu : 7.25E-3 g -> 8.092E-4 cm^3 Cu` `Pins: 50 + (40+16+30)OH` `(6-10) Optohybrid: dimensions: 23 x 30 mm, 0.5 mm thick FR4` `For the rest: take information from TIB OH !!` `Cu : 4 layers 50 % occ, 35 um` `Laser driver: 0.0025 cm^3 Si (1/OH)` `Laser diode: 0.02 cm^3 Si (1 for 2 APVs)` `Fiber clamps: 1.4 x 0.3 x 0.15 cm Kapton (1/OH)` `Additional components:` `Kapton from hybrid to ICC: 4 x 3 x 0.01 cm -> 0.12 cm^3` `Cu: 2 layers 50 um 50 % occ -> 0.06 cm^3` `Buffers on ICC & ICB: 0.02 cm^3 Kapton, 3.1E-3 Cu` `1 + 1OH` `Capacitors large 4x7x2 mm = 0.056 cm^3` `2+3OH` `Capacitors (0805) 2x1.25x1.25 = 3.1E-3 cm^3` `19OH+3` `Resistors (0603) 1.15E-3 cm^3` `12.5OH+3` `Solder: 1.E-3(large caps) + 2.E-4*(small caps+R)` `Layer 5/6 ICC1 (serves 1 double sided module)` `=> 2 Optohybrids` `2 Kapton pigtails, 3 buffers` `8 large caps, 41 small caps, 28 R's` `.................................................................` `"TOB electronics lay 5/6 ICC1" "TOB_ICC1" 25.96 51.92` `1 "CF support" "Carbon fibre str." 3.375 1 SUP` `2 "ICC card" "G10" 5.09 1 ELE` `3 "ICC traces" "Copper" 0.254 1 ELE` `4 "Connectors" "T_Kapton" 9.107E-3 222 ELE` `5 "Connectors pins" "Copper" 8.092E-4 222 ELE` `6 "Optohybrid" "T_FR4" 0.345 2 ELE` `7 "Optohybrid traces" "Copper" 0.048 2 ELE` `8 "Laser drivers" "Silicon" 0.0025 2 ELE` `9 "Laser diode" "Silicon" 0.02 4 ELE` `10 "Fiber clamp" "T_Kapton" 0.063 2 ELE` `11 "Pigtail and buffers" "T_Kapton" 0.3 1 ELE` `12 "Pigtail and buffers" "Copper" 0.129 1 ELE` `13 "Capacitors" "Alumina" 0.5751 1 ELE` `14 "Resistors" "Carbon" 1.15E-3 28 ELE` `15 "Solder" "SMD_metal" 0.022 1 ELE` `................................................................` `Layer 5/6 ICC2 (serves 2 double sided module)` `=> 4 Optohybrids` `4 Kapton pigtails, 5 buffers` `14 large caps, 79 small caps, 53 R's` `.................................................................` `"TOB electronics lay 5/6 ICC2" "TOB_ICC2" 40.12 80.24` `1 "CF support" "Carbon fibre str." 3.375 1 SUP` `2 "ICC card" "G10" 7.92 1 ELE` `3 "ICC traces" "Copper" 0.4 1 ELE` `4 "Connectors" "T_Kapton" 9.107E-3 394 ELE` `5 "Connectors pins" "Copper" 8.092E-4 394 ELE` `6 "Optohybrid G10" "T_FR4" 0.345 4 ELE` `7 "Optohybrid traces" "Copper" 0.048 4 ELE` `8 "Laser drivers" "Silicon" 0.0025 4 ELE` `9 "Laser diode" "Silicon" 0.02 8 ELE` `10 "Fiber clamp" "T_Kapton" 0.063 4 ELE` `11 "Pigtail and buffers" "T_Kapton" 0.58 1 ELE` `12 "Pigtail and buffers" "Copper" 0.256 1 ELE` `13 "Capacitors" "Alumina" 1.029 1 ELE` `14 "Resistors" "Carbon" 1.15E-3 53 ELE` `15 "Solder" "SMD_metal" 0.04 1 ELE` `.................................................................` `Layer 7/8 ICC1 (serves 1 single sided module with 4 APVs)` `=> 1 Optohybrids` `1 Kapton pigtails, 2 buffers` `5 large caps, 22 small caps, 16 R's` `.................................................................` `"TOB electronics lay 7/8 ICC1" "TOB_ICC3" 25.96 51.92` `1 "CF support" "Carbon fibre str." 3.375 1 SUP` `2 "ICC card" "G10" 5.09 1 ELE` `3 "ICC traces" "Copper" 0.254 1 ELE` `4 "Connectors" "T_Kapton" 9.107E-3 136 ELE` `5 "Connectors pins" "Copper" 8.092E-4 136 ELE` `6 "Optohybrid" "T_FR4" 0.345 1 ELE` `7 "Optohybrid traces" "Copper" 0.048 1 ELE` `8 "Laser drivers" "Silicon" 0.0025 1 ELE` `9 "Laser diode" "Silicon" 0.02 2 ELE` `10 "Fiber clamp" "T_Kapton" 0.063 1 ELE` `11 "Pigtail and buffers" "T_Kapton" 0.16 1 ELE` `12 "Pigtail and buffers" "Copper" 0.0662 1 ELE` `13 "Capacitors" "Alumina" 0.348 1 ELE` `14 "Resistors" "Carbon" 1.15E-3 16 ELE` `15 "Solder" "SMD_metal" 0.0126 1 ELE` `.................................................................` `Layer 7/8 ICC2 (serves 2 single sided module with 4 APVs)` `=> 2 Optohybrids` `2 Kapton pigtails, 3 buffers` `8 large caps, 41 small caps, 28 R's` `.................................................................` `"TOB electronics lay 7/8 ICC2" "TOB_ICC4" 40.12 80.24` `1 "CF support" "Carbon fibre str." 3.375 1 SUP` `2 "ICC card" "G10" 7.92 1 ELE` `3 "ICC traces" "Copper" 0.4 1 ELE` `4 "Connectors" "T_Kapton" 9.107E-3 222 ELE` `5 "Connectors pins" "Copper" 8.092E-4 222 ELE` `6 "Optohybrid" "T_FR4" 0.345 2 ELE` `7 "Optohybrid traces" "Copper" 0.048 2 ELE` `8 "Laser drivers" "Silicon" 0.0025 2 ELE` `9 "Laser diode" "Silicon" 0.02 4 ELE` `10 "Fiber clamp" "T_Kapton" 0.063 2 ELE` `11 "Pigtail and buffers" "T_Kapton" 0.3 1 ELE` `12 "Pigtail and buffers" "Copper" 0.129 1 ELE` `13 "Capacitors" "Alumina" 0.5751 1 ELE` `14 "Resistors" "Carbon" 1.15E-3 28 ELE` `15 "Solder" "SMD_metal" 0.022 1 ELE` `.................................................................` `Layer 9/10 ICC1 (serves 1 single sided module with 6 APVs)` `=> 1 Optohybrids` `1 Kapton pigtails, 2 buffers` `5 large caps, 22 small caps, 16 R's` `.................................................................` `"TOB electronics lay 9/10 ICC1" "TOB_ICC5" 25.96 51.92` `1 "CF support" "Carbon fibre str." 3.375 1 SUP` `2 "ICC card" "G10" 5.09 1 ELE` `3 "ICC traces" "Copper" 0.254 1 ELE` `4 "Connectors" "T_Kapton" 9.107E-3 136 ELE` `5 "Connectors pins" "Copper" 8.092E-4 136 ELE` `6 "Optohybrid" "T_FR4" 0.345 1 ELE` `7 "Optohybrid traces" "Copper" 0.048 1 ELE` `8 "Laser drivers" "Silicon" 0.0025 1 ELE` `9 "Laser diode" "Silicon" 0.02 3 ELE` `10 "Fiber clamp" "T_Kapton" 0.063 1 ELE` `11 "Pigtail and buffers" "T_Kapton" 0.16 1 ELE` `12 "Pigtail and buffers" "Copper" 0.0662 1 ELE` `13 "Capacitors" "Alumina" 0.348 1 ELE` `14 "Resistors" "Carbon" 1.15E-3 16 ELE` `15 "Solder" "SMD_metal" 0.0126 1 ELE` `.................................................................` `Layer 9/10 ICC2 (serves 2 single sided module with 6 APVs)` `=> 2 Optohybrids` `2 Kapton pigtails, 3 buffers` `8 large caps, 41 small caps, 28 R's` `.................................................................` `"TOB electronics lay 9/10 ICC2" "TOB_ICC6" 40.12 80.24` `1 "CF support" "Carbon fibre str." 3.375 1 SUP` `2 "ICC card" "G10" 7.92 1 ELE` `3 "ICC traces" "Copper" 0.4 1 ELE` `4 "Connectors" "T_Kapton" 9.107E-3 222 ELE` `5 "Connectors pins" "Copper" 8.092E-4 222 ELE` `6 "Optohybrid" "T_FR4" 0.345 2 ELE` `7 "Optohybrid traces" "Copper" 0.048 2 ELE` `8 "Laser drivers" "Silicon" 0.0025 2 ELE` `9 "Laser diode" "Silicon" 0.02 6 ELE` `10 "Fiber clamp" "T_Kapton" 0.063 2 ELE` `11 "Pigtail and buffers" "T_Kapton" 0.3 1 ELE` `12 "Pigtail and buffers" "Copper" 0.129 1 ELE` `13 "Capacitors" "Alumina" 0.5751 1 ELE` `14 "Resistors" "Carbon" 1.15E-3 28 ELE` `15 "Solder" "SMD_metal" 0.022 1 ELE` `.................................................................` `================================================================= ]` `[WAS:` `o TOB rod connectors (inside)` `---------------------------` `MCVolume 11.8 x 7.5 x 0.5 cm` `(1) CF support plate: 12.5 x 12.5 x 0.09 cm = 14.06 cm^3` `(2) Loose wires (Robert)` `Al xsection 1 mm^2` `For control: 10 cables with l=22cm, 10 with l=12 cm` `LV : 8 " l=12 cm` `Forget about the Polyethylene shielding, absorbed in` `optical connector uncertainty !` `(3) Optical connectors: 2 for layer 5/6, 1 for 7-10` `Info from Francois: 46.8 g Plastic, 8.4 g Cu` `OVERESTIMATE, don't believe ! take 15 cm^3 plastic` `.....................................................................` `"TOB rod connections 5/6" "TOB_CONN1" 44.25 88.5` `1 "Support plate" "Carbon fibre str." 14.06 1 SUP` `2 "Al wires" "Aluminium" 0.12 37 CAB` `3 "Optoconnector" "T_Kapton" 15.0 2 CAB` `4 "Optoconnector" "Copper" 0.446 2 CAB` `....................................................................` `....................................................................` `"TOB rod connections 7-10" "TOB_CONN2/3" 44.25 88.5` `1 "Support plate" "Carbon fibre str." 14.06 1 SUP` `2 "Al wires" "Aluminium" 0.12 37 CAB` `3 "Optoconnector" "T_Kapton" 15.0 1 CAB` `4 "Optoconnector" "Copper" 0.446 1 CAB` `....................................................................` `==================================================================== ]`

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TOB MODULES
============

$$  This includes all the volumes that make up the TOB modules
$$  as well as the electronics on the rods !


Input file for mixture.f
Start new mixtures with a '#' in the first column
Start the components with a '*' in the first column
You can type any kind of comment in as long as you don't start it
with '#' or '*' !
.....................................................................
For mixture declaration: Name of Mixture, Name of GMIX for title file, 
                         Monte Carlo Volume, MC Area
For items in a compound: Item number, Comment, Material (has to be 
                 written exactly as in material.input file), 
                 Volume, Multiplicity, Type
      Type is one of the following:  SUP for support
                                     SEN for sensitive volumes
                                     CAB for cables
                                     COL for cooling
                                     ELE for electronics
..................................................................... 


o Pitch adapter, r-phi
  --------------------
MCVolume: (8.6 x 1.25 x 0.11) cm^3

(1) Glass pitch adapter
	material is Schott D263 Borosilicate Glass, density = 2.51 g/cm^3
		properties taken from http://www.schott.com/fpd/english/products/fpd/d263t.html
		and http://www.osti.gov/bridge/servlets/purl/10117627-uo1lPX/webviewable/10117627.pdf
		(TIB: CORNING 1737F density = 2.54 g/cm^3)
	Borosilicate Glass chemical composition: http://www.qvf.com/en/Equipment_1/Borosilicate%20glass/Composition.shtml
	dimensions 9.64 x 1.25 x 0.0550 cm^3 = 0.66275 cm^3 (TIB: 300 um, TID/TOB/TEC: 550 um thickness)
		[WAS dimensions 9.64 x 1.25 x 0.03 cm^3 = 0.3615 cm^3]
(2) Pitch adapter spacers
	dimensions 86x3x0.635 mm^3 + 60x3x0.635 mm^3 = 278.13 mm^3 = 0.27813 cm^3
		[WAS (NOMEX)    0.24 cm^3]
		[WAS (3) Carbon fibre support piece dimensions 8.6 x 1.18 x 0.06 cm^3]
......................................................................
# "TOB Pitch Adapter r-phi"  "TOB_PA_rphi"        1.1825   10.75
* 1 "Glass pitch adapter"    "Borosilicate_Glass" 0.66275   1    ELE 
* 2 "Spacer"                 "Ceramic"            0.27813   1    SUP
......................................................................
====================================================================== 

o Pitch adapter, stereo
  --------------------
MCVolume: (0.78*8.6*0.11 + 0.5 * 0.863*8.6*0.11) cm^3 = 1.146 cm^3

(1) Glass pitch adapter 
	material is Schott D263 Borosilicate Glass, density = 2.51 g/cm^3
		properties taken from http://www.schott.com/fpd/english/products/fpd/d263t.html
		and http://www.osti.gov/bridge/servlets/purl/10117627-uo1lPX/webviewable/10117627.pdf
		(TIB: CORNING 1737F density = 2.54 g/cm^3)
	Borosilicate Glass chemical composition: http://www.qvf.com/en/Equipment_1/Borosilicate%20glass/Composition.shtml
	dimensions: [ ( 0.9 x 9.6 x 0.0550 ) + 0.5 x ( 0.9 x 9.6 x 0.0550 ) ] cm^3 = 0.7128 cm^3 (TIB: 300 um, TID/TOB/TEC: 550 um thickness)
		[WAS dimensions 0.9*9.6*0.03 + 0.5 * 0.9*9.6*0.03 = 0.389 cm^3]
(2) Pitch adapter spacers
	dimensions 86x3x0.635 mm^3 + 60x3x0.635 mm^3 = 278.13 mm^3 = 0.27813 cm^3
		[WAS (NOMEX)    0.24 cm^3]
		[WAS (3) Carbon fibre support piece dimensions 8.6 x 1.18 x 0.06 cm^3]
		[WAS (3) Carbon fibre frame piece      
			    0.8*8.0*1.5*0.06 = 0.576 cm^3 ]
........................................................................
# "TOB Pitch Adapter stereo"  "TOB_PA_ster"        1.146     10.42
* 1 "Glass pitch adapter"     "Borosilicate_Glass" 0.7128     1    ELE
* 2 "Spacer"                  "Ceramic"            0.27813    1    SUP
........................................................................
======================================================================== 

o Module end plate
  ----------------
Carbon fiber endplate where electronics sits on top
MCVolume: (12 x 4.5 x 0.0625) cm^3 
(1) CF
	dimensions from EDM file CMSTKOBM0026 version AA
	{ [ 39 x 119.7] + 2 x [ 6 x 29.9 ] - 2 x [ pi x (8.4 / 2)^2 ] - 2 x [ pi x (3.5 / 2)^2 ] - 4 x [ pi x (1.6 / 2)^2 ] } mm^2 x 0.625 mm =
	= 4888.98 mm^2 x 0.625 mm = 3055.61 mm^3
		[WAS dimensions: 12 x 4.7 x 0.06 cm = 3.384 cm^3]

(2) 3D Label
	Plastic (kapton): m = 0.020 g
		density = 1.40 g/cm^3
		--> volume = 0.0143 cm^3


...................................................................
# "TOB module end plate"    "TOB_frame_ele"      3.375   54.0
* 1 "CF plate"              "Carbon fibre str."  3.05561  1    SUP
* 2 "Module 3D Label"       "T_Kapton"           0.0143   1    ELE
...................................................................
===================================================================

o Ceramic Hybrid Support
	[WAS CF Hybrid Support]
  --------------
MCVolume: (8.6 x 3.71 x 0.0380) cm^3 = 1.2124 cm^3
		[WAS MCVolume: 7 x 3.33 x 0.06 = 1.3986 cm^3]
(1) Ceramic plate
	dimensions: [ (37.1-11.8)x72 + 11.8x86] mm^2 x 0.380 mm =
	= 2836.4 mm^2 x 0.380 mm = 1077.832 mm^3
		[WAS (1) CF dimensions: 7 x 3.4 x 0.06 = 1.428 cm^3]
....................................................................
# "TOB hybrid support"       "TOB_hybrid_supp"    1.3986   23.31
* 1 "Hybrid support"         "Ceramic"            1.077832  1   SUP
....................................................................
====================================================================

o Aluminium cooling I 
  -------------------
Al piece at sensor middle
This one includes the screw !
MCVolume: (1.6 x 2 x 0.03) cm^3

(1) Al heat spreader   
	dimensions from EDM file CMSTKOBM0025 version 0
	{ [ 16 x 20 ] - [ pi x (2/2)^2 ] } mm^2 x 0.300 mm 
	= 316.8584 mm^2 x 0.300 mm = 95.0575 mm^3
		[WAS 0.096 cm^3]
	[THIS MATERIAL HAS BEEN CREATED APART
		(2) CF compensator
			dimensions from EDM file CMSTKOBM0035 version AA
			{ [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm =
			= 337.46 mm^2 x 0.300 mm = 101.238 mm^3
				[WAS 0.15  cm^3]
	]
(2-3) Screw: 0.009 cm^3 Stainless Steel,
             0.02  cm^3 Al washer
.....................................................................
# "TOB Module Cooling 1"   "TOB_mod_cool1"      0.096       3.2
* 1 "Al heat spreader"     "Aluminium"          0.0950575   1    COL
* 2 "Steel screw"          "Steel-008"          0.009       1    COL
* 3 "Al washer"            "Aluminium"          0.02        1    COL
.....................................................................
=====================================================================

[WAS
	o Aluminium cooling II 
	  --------------------
	Al piece at sensor middle
	No screw !
	MCVolume: (1.5 x 2.8 x 0.03) cm
	
	(1) Al heat spreader   
		dimensions from EDM file CMSTKOBM0025 version 0
		{ [ 16 x 20 ] - [ pi x (2/2)^2 ] } mm^2 x 0.300 mm 
		= 316.8584 mm^2 x 0.300 mm = 95.0575 mm^3
			[WAS 0.096 cm^3]
		[THIS MATERIAL HAS BEEN CREATED APART
			(2) CF compensator
				dimensions from EDM file CMSTKOBM0035 version AA
				{ [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm =
				= 337.46 mm^2 x 0.300 mm = 101.238 mm^3
					[WAS 0.15  cm^3]
		]
	....................................................................
	# "TOB Module Cooling 2"   "TOB_mod_cool2"      0.126       4.2
	* 1 "Al heat spreader"     "Aluminium"          0.0950575   1   COL
	....................................................................
	====================================================================
NO MORE NEEDED, ALL THE SPREADER ARE THE SAME
]

o Aluminium cooling III
	[WAS o Aluminium cooling III ]
  ---------------------
Al and locator piece at hybrid sides
This one includes the screw !
MCVolume: (1.5 x 2.8 x 0.03) cm^3

(1) Al heat spreader   
	dimensions from EDM file CMSTKOBM0024 version 0
	{ [ 15 x 28 ] - (8 x 8 / 2) - [ pi x (2/2)^2 ] } mm^2 x 0.300 mm
	= 384.8584 mm^2 x 0.300 mm = 115.4575 mm^3
		[WAS 0.116 cm^3]
	[THIS MATERIAL HAS BEEN CREATED APART
		(2) CF compensator
			dimensions from EDM file CMSTKOBM0035 version AA
			{ [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm =
			= 337.46 mm^2 x 0.300 mm = 101.238 mm^3
				[WAS 0.15  cm^3]
	]
(2-3) Screw: 0.009 cm^3 Stainless Steel,
             0.02  cm^3 Al washer
(4) CuBe/brass -> take all Cu for now:
             (0.0044 * 3) cm^3
...................................................................
# "TOB Module Cooling 2"   "TOB_mod_cool2"      0.126      4.2
* 1 "Al heat spreader"     "Aluminium"          0.1154575  1   COL
* 2 "Steel screw"          "Steel-008"          0.009      1   COL
* 3 "Al washer"            "Aluminium"          0.02       1   COL
* 4 "Cu locator"           "Copper"             0.0044     3   SUP
...................................................................
===================================================================

o Carbon Fibre Compensator (cooling)
  --------------------
MCVolume: (1.6 x 2.6 x 0.03) cm^3

(1) CF compensator
	dimensions from EDM file CMSTKOBM0035 version AA
	{ [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm =
	= 337.46 mm^2 x 0.300 mm = 101.238 mm^3
............................................................................
# "TOB Module Cooling Compensator"   "TOB_mod_comp"        0.1248    4.16
* 1 "CF Compensator"                 "Carbon fibre str."   0.101238  1  COL
............................................................................
============================================================================



o Module side rail I rphi (heavier side)
  ---------------------------------------
Volumes from single-sided modules. Also used for double-sided modules
MCVolume: (1.7 x 21 x 0.08) cm^3

(1) Carbon fiber leg
	dimensions from EDM file CMSTKOBM0026 version AA
	{ [ 15.1 x 210 ] + [ 4.0 x 122 ] + 2 x [ 1.5 x 22.5 ] - [ pi x (8.4 / 2)^2 ] - [ pi x ( 2.5 / 2 )^2 ] } mm^2 x 0.625 mm =
	= 3666.17 x 0.625 mm^3 = 2291.36 mm^3
    		[WAS 21 x 1.7 x 0.06 cm = 2.14 cm^3]

Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm
EDMS Code EP 680-1174-080-A (ss) and EP 680-1174-060-D (ds)
(2-3) DS or SS rphi Bias
	Kapton:	m = 0.552 g
		density = 1.4 g/cm^3
		--> volume = 0.394 cm^3
	Copper:	m = 0.088 g
		density = 8.96 g/cm^3
		--> volume = 0.010 cm^3

(4) HV wire (115 mm)
	Copper:	m = (0.14+0.10) g = 0.24 g
		density = 8.96 g/cm^3
		--> volume = 0.027 cm^3

(5) Transparent Sleeve
	Polyethylene:
		m = 0.040 g
		density = 0.95 g/cm^3
		--> volume = 0.042 cm^3

(6) Soldering (Sn/Pb alloy)
	BGA196 (Ball Grid Array), Sn/Pb/Ag 62/36/2:
		m = 0.030 g
		density = 8.82 g/cm^3
		--> volume = 0.0034 cm^3

(7) Thermistor Caps
	Kapton:	m = 0.010 g
		density = 1.4 g/cm^3
		--> volume = 0.0071 cm^3
	
(8) Thermistor Stiffeners
	FR4:    m = 0.040 g
		density (T_G10) = 1.90 g/cm^3
		--> volume = 0.021 cm^3
	
(9) SMD Capacitors
	BaTiO3:	m = 0.090 g
		density = 6.02 g/cm^3
		--> volume = 0.015 cm^3

(10) SMD Resistors
	Al2O3:	m = 0.050 g
		density = 3.96525 g/cm^3
		--> volume = 0.0126 cm^3

	[WAS: 
		(2) Kapton 
		    from Bill's table: ~0.5 cm^3
		(3) Copper traces  
		    Robert: Cu is approx 15 um thick => 0.01 cm^3 (just a guess)
		(4) Components: 
		    Caps:  1 x 1206  3 x 1.5 x 1.5 mm^3
		           1 x 1210  3.2 x 2.5 x 1.5  mm^3
		    Rs:    2 x 1206 
		           3 x 0603  1.6 x 0.8 x 0.8  mm (thermistors)
	]

..........................................................................
# "TOB side rail active rphi" "TOB_sid_rail1"            2.856   35.7 
* 1 "CF leg"                  "Carbon fibre str."        2.29136  1   SUP   
* 2 "Bias Kapton"             "T_Kapton"                 0.394    1   ELE
* 3 "Bias Copper"             "Copper"                   0.010    1   ELE
* 4 "HV Wire"                 "Copper"                   0.027    1   ELE
* 5 "Transparent Sleeve"      "Polyethylene"             0.042    1   ELE
* 6 "Soldering"               "BGA"                      0.0034   1   ELE
* 7 "Thermistor Caps"         "T_Kapton"                 0.0071   1   ELE
* 8 "Thermistor Stiffeners"   "T_G10"                    0.021    1   ELE
* 9 "Capacitors"              "Barium_Titanate"          0.015    1   ELE
* 10 "Resistors"              "Ceramic"                  0.0126   1   ELE
..........................................................................
========================================================================== 

o Module side rail II rphi (lighter side)
  ----------------------------------------
Volumes from single-sided modules. Also used for double-sided modules
MCVolume: (1.7 x 21 x 0.08) cm^3

(1) Carbon fiber leg
	dimensions from EDM file CMSTKOBM0026 version AA
	{ [ 15.1 x 210 ] + [ 4.0 x 122 ] + 2 x [ 1.5 x 22.5 ] - [ pi x (8.4 / 2)^2 ] - [ pi x ( 2.5 / 2 )^2 ] } mm^2 x 0.625 mm =
	= 3666.17 x 0.625 mm^3 = 2291.36 mm^3
    		[WAS 21 x 1.7 x 0.06 cm = 2.14 cm^3]

Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm
EDMS Code EP 680-1174-090-A (ss) and EP 680-1174-050-C (ds)
(2-3) DS or SS rphi Insulator
	Kapton:	m = 0.402 g
		density = 1.4 g/cm^3
		--> volume = 0.287 cm^3
	Copper:	m = 0.041 g
		density = 8.96 g/cm^3
		--> volume = 0.0046 cm^3

	[WAS: 
		(2) Kapton 
		    from Bill's table: ~0.45 cm^3
		(3) Copper: 2 x 20x8 mm^2 x 17 um = 0.00544 cm^3
	]


........................................................................
# "TOB side rail passive rphi"  "TOB_sid_rail2"        2.856   35.7 
* 1 "CF leg"                    "Carbon fibre str."    2.29136  1   SUP   
* 2 "Insulator Kapton"          "T_Kapton"             0.287    1   ELE
* 3 "Insulator Copper"          "Copper"               0.0046   1   ELE
........................................................................
========================================================================


o Module side rail I stereo (heavier side)
  ---------------------------------------
Volumes from single-sided modules. Also used for double-sided modules
MCVolume: (1.7 x 21 x 0.08) cm^3

(1) Carbon fiber leg
	dimensions from EDM file CMSTKOBM0026 version AA
	{ [ 15.1 x 210 ] + [ 4.0 x 122 ] + 2 x [ 1.5 x 22.5 ] - [ pi x (8.4 / 2)^2 ] - [ pi x ( 2.5 / 2 )^2 ] } mm^2 x 0.625 mm =
	= 3666.17 x 0.625 mm^3 = 2291.36 mm^3
    		[WAS 21 x 1.7 x 0.06 cm = 2.14 cm^3]

Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm
EDMS Code EP 680-1174-080-A
(2-3) DS or SS rphi Bias (different with respect to rphi)
	Kapton:	m = 0.514 g
		density = 1.4 g/cm^3
		--> volume = 0.367 cm^3
	Copper:	m = 0.088 g
		density = 8.96 g/cm^3
		--> volume = 0.0098 cm^3

(4) HV wire (115 mm)
	Copper:	m = (0.14+0.10) g = 0.24 g
		density = 8.96 g/cm^3
		--> volume = 0.027 cm^3

(5) Transparent Sleeve
	Polyethylene:
		m = 0.040 g
		density = 0.95 g/cm^3
		--> volume = 0.042 cm^3

(6) Soldering (Sn/Pb alloy)
	BGA196 (Ball Grid Array), Sn/Pb/Ag 62/36/2:
		m = 0.030 g
		density = 8.82 g/cm^3
		--> volume = 0.0034 cm^3

(7) Thermistor Caps
	Kapton:	m = 0.010 g
		density = 1.4 g/cm^3
		--> volume = 0.0071 cm^3
	
(8) Thermistor Stiffeners
	FR4:    m = 0.040 g
		density (T_G10) = 1.90 g/cm^3
		--> volume = 0.021 cm^3
	
(9) SMD Capacitors
	BaTiO3:	m = 0.090 g
		density = 6.02 g/cm^3
		--> volume = 0.015 cm^3

(10) SMD Resistors
	Al2O3:	m = 0.050 g
		density = 3.96525 g/cm^3
		--> volume = 0.0126 cm^3

	[WAS: 
		(2) Kapton 
		    from Bill's table: ~0.5 cm^3
		(3) Copper traces  
		    Robert: Cu is approx 15 um thick => 0.01 cm^3 (just a guess)
		(4) Components: 
		    Caps:  1 x 1206  3 x 1.5 x 1.5 mm^3
		           1 x 1210  3.2 x 2.5 x 1.5  mm^3
		    Rs:    2 x 1206 
		           3 x 0603  1.6 x 0.8 x 0.8  mm (thermistors)
	]

...........................................................................
# "TOB side rail active stereo" "TOB_sid_rail1st"         2.856   35.7 
* 1 "CF leg"                   "Carbon fibre str."        2.29136  1   SUP   
* 2 "Bias Kapton"              "T_Kapton"                 0.367    1   ELE
* 3 "Bias Copper"              "Copper"                   0.0098   1   ELE
* 4 "HV Wire"                  "Copper"                   0.027    1   ELE
* 5 "Transparent Sleeve"       "Polyethylene"             0.042    1   ELE
* 6 "Soldering"                "BGA"                      0.0034   1   ELE
* 7 "Thermistor Caps"          "T_Kapton"                 0.0071   1   ELE
* 8 "Thermistor Stiffeners"    "T_G10"                    0.021    1   ELE
* 9 "Capacitors"               "Barium_Titanate"          0.015    1   ELE
* 10 "Resistors"               "Ceramic"                  0.0126   1   ELE
...........................................................................
=========================================================================== 

o Module side rail II stereo (lighter side)
  ----------------------------------------
Volumes from single-sided modules. Also used for double-sided modules
MCVolume: (1.7 x 21 x 0.08) cm^3

(1) Carbon fiber leg
	dimensions from EDM file CMSTKOBM0026 version AA
	{ [ 15.1 x 210 ] + [ 4.0 x 122 ] + 2 x [ 1.5 x 22.5 ] - [ pi x (8.4 / 2)^2 ] - [ pi x ( 2.5 / 2 )^2 ] } mm^2 x 0.625 mm =
	= 3666.17 x 0.625 mm^3 = 2291.36 mm^3
    		[WAS 21 x 1.7 x 0.06 cm = 2.14 cm^3]

Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm
EDMS Code EP 680-1174-100-A
(2-3) DS or SS rphi Insulator (different with respect to rphi)
	Kapton:	m = 0.389 g
		density = 1.4 g/cm^3
		--> volume = 0.278 cm^3
	Copper:	m = 0.041 g
		density = 8.96 g/cm^3
		--> volume = 0.0046 cm^3

	[WAS: 
		(2) Kapton 
		    from Bill's table: ~0.45 cm^3
		(3) Copper: 2 x 20x8 mm^2 x 17 um = 0.00544 cm^3
	]


........................................................................
# "TOB side rail passive rphi"  "TOB_sid_rail2st"      2.856   35.7 
* 1 "CF leg"                    "Carbon fibre str."    2.29136  1   SUP   
* 2 "Insulator Kapton"          "T_Kapton"             0.278    1   ELE
* 3 "Insulator Copper"          "Copper"               0.0046   1   ELE
........................................................................
========================================================================

o  Hybrid for TOB layers 1/2 
   -------------------------
		[WAS o  Hybrid for TOB layers 5/6 
		   -------------------------     ]

These are the hybrids of the double sided layers. 
Each of the hybrids carries 4 APVs (changed 15/03/02)

Hybrids have 4 APVs

MCVolume: (6 x 2.5 x 0.05) cm^3 = 0.75 cm^3

Dimensions (60 x 25) mm^2 = 15 cm^2
(1) Hybrid reviewed November 2006 - Central Hybrid (no kapton tail, which is in ICC* material definition, see below)
	see http://www.fynu.ucl.ac.be/he/cms/activities/tracker/FHITfiles/CCTPHybrides.pdf
	- Kapton: (25+25) um = 50 um = 0.0050 cm --> 0.075 cm^3
	- Copper: (18+12+18+18+18+12) um = 96 um = 0.0096 cm --> 0.144 cm^3
	- Solder Mask: 20 um = 0.0020 cm --> 0.030 cm^3
	- Glue: (50+50) um = 100 um thickness = 0.0100 cm --> 0.150 cm^3 
		[WAS (1) new FR4 hybrid
		Estimate: 300 mu FR4,
	          3 x 25 mu Cu
	          ~300 mu Kapton 
		-Pt-Au layer: tbd  ]
(2) Hybrid components
    R: (14 + n_APV)   0402 size  material: carbon   -> 18 
    C: 2 x 1206 large ones
       (5 + 2*n_APV)  0402 size    -> 13
                 0402: (1 x 0.5 x 0.5) mm^3 = 0.25 mm^3 = 0.25 x 10^-3 cm^3
                 1206: (3 x 1.5 x 1.5) mm^3 = 6.75 mm^3 = 6.75 x 10^-3 cm^3
    APV25:     (7.1 x 8.1 x 0.3) mm^3 = 17.253 mm^3 = 0.017253 cm^3     4 per hybrid REVIEWED November 2006 OK
    PLL:       (4.0 x 4.0 x 0.3) mm^3 = 4.8 mm^3 = 0.0048 cm^3          1 per hybrid REVIEWED November 2006 OK
			(see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/PauloMoreira/PLL25%20User%20Manua2.1.pdf)
    MUX:       (5.0 x 5.0 x 0.3) mm^3 = 7.5 mm^3 = 0.0075 cm^3          1 per hybrid REVIEWED November 2006 OK
			(see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/LVDSMUX3_datasheet.pdf)
    		[WAS PLL+MUX  : 2.0 x 7.1 x 0.3 mm^3     1 per hybrid ]
http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/manuals.htm
    DCU  :     (2.0 x 2.0 x 0.3) mm^3 = 1.2 mm^3 = 0.0012 cm^3          1 per hybrid REVIEWED November 2006 OK
			(see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/Magazzu/DCUF_User_Manual_v3.0.pdf)
(3) Wire bonds
	http://cms.ct.infn.it/bonding/bondspec.htm
		Al, 1% Si, 25 um diameter, medium hardness
		tail length visible but short < 50 um
	1 wire bond: average of 4 mm length diameter 25 um + 1 tail =
			= { [ pi x (0.025/2)^2 ] mm^2 x 4 mm } + { [ pi x (0.025/2)^2 ] mm^2 x 0.050 mm } =
			= [1.963x10^-3 mm^3] + [0.0245x10^-3 mm^3] = 2.0x10^-3 mm^3 = 2.0x10^-6 cm^3 [99% Aluminium + 1% Silicon]
		PA bias line to sensor bias ring: 5 bonds
		PA to hybrid: nAPV x 128 bonds
		PA to sensor: nAPV x 128 bonds
	TOTAL: 2x128xnAPV+5 bonds = 1029 bonds
......................................................................
# "TOB Hybrid Layer 1/2"          "TOB_ele12"       0.75       15.0
Central Hybrid (no tail)
* 1  "Central Hybrid Kapton"      "T_Kapton"        0.075       1 ELE
* 2  "Central Hybrid Copper"      "Copper"          0.144       1 ELE
* 3  "Central Hybrid Solder Mask" "T_Kapton"        0.030       1 ELE
* 4  "Central Hybrid Glue"        "Epoxy"           0.150       1 ELE
Components:  Resistors
* 5  "Resistors"                  "Carbon"          0.25E-3    18 ELE
* 6  "R metal"                    "SMD_metal"       1.E-4      18 ELE
Capacitors
* 7  "Small caps"                 "Alumina"         0.25E-3    13 ELE
* 8  "C metal"                    "SMD_metal"       1.E-4      13 ELE
* 9  "Large caps"                 "Alumina"         6.75E-3     2 ELE
* 10 "C metal large"              "SMD_metal"       1.E-3       2 ELE
* 11 "APV25"                      "Silicon"         0.017253    4 ELE
* 12 "PLL"                        "Silicon"         4.8E-3      1 ELE
* 13 "MUX"                        "Silicon"         7.5E-3      1 ELE
* 14 "DCU"                        "Silicon"         1.2E-3      1 ELE
Wire bonds
* 15 "Wire bonds"                 "Aluminium"       1.98E-6  1029 ELE
* 16 "Wire bonds"                 "Silicon"         0.02E-6  1029 ELE
......................................................................
======================================================================

o  Hybrid for TOB layers 3/4 
   -------------------------
		[WAS o  Hybrid for TOB layers 7/8 
		   -------------------------     ]
Hybrids have 4 APVs

as above, except: 
(2) Hybrid components
    R: (14 + n_APV)   0402 size  material: carbon   -> 18 
    C: 2 x 1206 large ones
       (5 + 2*n_APV)  0402 size    -> 13
(3) Wire bonds
	see above for details
	TOTAL: 2x128xnAPV+5 bonds = 1029 bonds
......................................................................
# "TOB Hybrid Layer 3/4"          "TOB_ele34"       0.75       15.0
Central Hybrid (no tail)
* 1  "Central Hybrid Kapton"      "T_Kapton"        0.075       1 ELE
* 2  "Central Hybrid Copper"      "Copper"          0.144       1 ELE
* 3  "Central Hybrid Solder Mask" "T_Kapton"        0.030       1 ELE
* 4  "Central Hybrid Glue"        "Epoxy"           0.150       1 ELE
Components:  Resistors
* 5  "Resistors"                  "Carbon"          0.25E-3    18 ELE
* 6  "R metal"                    "SMD_metal"       1.E-4      18 ELE
Capacitors
* 7  "Small caps"                 "Alumina"         0.25E-3    13 ELE
* 8  "C metal"                    "SMD_metal"       1.E-4      13 ELE
* 9  "Large caps"                 "Alumina"         6.75E-3     2 ELE
* 10 "C metal large"              "SMD_metal"       1.E-3       2 ELE
* 11 "APV25"                      "Silicon"         0.017253    4 ELE
* 12 "PLL"                        "Silicon"         4.8E-3      1 ELE
* 13 "MUX"                        "Silicon"         7.5E-3      1 ELE
* 14 "DCU"                        "Silicon"         1.2E-3      1 ELE
Wire bonds
* 15 "Wire bonds"                 "Aluminium"       1.98E-6  1029 ELE
* 16 "Wire bonds"                 "Silicon"         0.02E-6  1029 ELE
......................................................................
======================================================================

o  Hybrid for TOB layers 5/6 
   --------------------------
		[WAS  Hybrid for TOB layers 9/10 
		   --------------------------    ]
Hybrids have 6 APVs

as above, except: 
(2) Hybrid components
    R: (14 + n_APV)   0402 size  material: carbon   -> 20 
    C: 2 x 1206 large ones
       (5 + 2*n_APV)  0402 size    -> 17
(3) Wire bonds
	see above for details
	TOTAL: 2x128xnAPV+5 bonds = 1541 bonds
......................................................................
# "TOB Hybrid Layer 5/6"          "TOB_ele56"       0.75       15.0
Central Hybrid (no tail)
* 1  "Central Hybrid Kapton"      "T_Kapton"        0.075       1 ELE
* 2  "Central Hybrid Copper"      "Copper"          0.144       1 ELE
* 3  "Central Hybrid Solder Mask" "T_Kapton"        0.030       1 ELE
* 4  "Central Hybrid Glue"        "Epoxy"           0.150       1 ELE
Components:  Resistors
* 5  "Resistors"                  "Carbon"          0.25E-3    20 ELE
* 6  "R metal"                    "SMD_metal"       1.E-4      20 ELE
Capacitors
* 7  "Small caps"                 "Alumina"         0.25E-3    17 ELE
* 8  "C metal"                    "SMD_metal"       1.E-4      17 ELE
* 9  "Large caps"                 "Alumina"         6.75E-3     2 ELE
* 10 "C metal large"              "SMD_metal"       1.E-3       2 ELE
* 11 "APV25"                      "Silicon"         0.017253    6 ELE
* 12 "PLL"                        "Silicon"         4.8E-3      1 ELE
* 13 "MUX"                        "Silicon"         7.5E-3      1 ELE
* 14 "DCU"                        "Silicon"         1.2E-3      1 ELE
Wire bonds
* 15 "Wire bonds"                 "Aluminium"       1.98E-6  1541 ELE
* 16 "Wire bonds"                 "Silicon"         0.02E-6  1541 ELE
......................................................................
======================================================================

o TOB Interface between two sensors and sensor-Pitch Adapter
  -----------------------------------------------------------
The inactive part between the two sensors and between PA-sensor:
 Sylgard encapsulant (Silicone) + wire bonds

MCVolume: (9.3696 x 0.55 x 0.2) cm^3 = 1.030656 cm^3
(1) Silicone encapsulant
	http://www.vestaweb.com/silicone/silicone_properties.htm
	http://www.answers.com/topic/silicone
	http://www.answers.com/topic/dimethyl-polysiloxane
	Must weight 0.83 g and dens=0.965 g/cm^3 --> volume = 0.80095 cm^3
(2) Wire bonds
	see above for details
		sen-sen bias bonds: 5 bonds
	TOTAL: 2x128xnAPV+5 bonds = 1029-1541 bonds (average: 1285)

................................................................................
# "TOB Two-Sensor Interface"  "TOB_Sens_Interface"      1.030656    7.49568
* 1 "Glue"                    "Silicone_Gel"            0.80095     1 SUP
Wire bonds
* 2 "Wire bonds"              "Aluminium"               1.98E-6  1285 ELE
* 3 "Wire bonds"              "Silicon"                 0.02E-6  1285 ELE
................................................................................
================================================================================


o TOB Electronics ICC1/2
Inter Connect Cards
	ICC1 - serves 1 APV (smaller)
	ICC2 - serves 2 APVs (bigger)
ICC1: MCVolume: (11.800 x 4.400 x 0.250) cm^3 = 12.98 cm^3
ICC2: MCVolume: (11.800 x 6.800 x 0.250) cm^3 = 20.06 cm^3
Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/ICCs_MB.htm


	Layer 1/2
	---------

ICC1
----
Same as Layer 3/4, except:
Circuit ICC1 (DS_ICC1)
EDMS Code EP 680-1174-200-C

(1-2) PCBs
	FR4:    m = 8.179 g
		density (T_G10) = 1.90 g/cm^3
		--> volume = 4.305 cm^3
	copper: m = 1.575 g
		density = 8.96 g/cm^3
		--> volume = 0.176 cm^3

(3-4) Connectors NaiS
	socket + header
	2 x ICC-Kapton bias PCB 16 pins (AXN316038S + AXN416330S)
	THIS GOES IN AOH 2 x ICC-AOH             30 pins (AXN330038S + AXN430330S)
	2 x ICC-FEH             40 pins (AXN340038S + AXN440330S)
	1 x ICC-ICB             50 pins (AXN350038S + AXN450330S)
	copper: m = 2 x (0.0461 + 0.0515) g + NULL x { 2 x (0.0865 + 0.0965) g } + 2 x (0.1153 + 0.1287) g + 1 x (0.1442 + 0.1609) g = 0.9883 g
		density = 8.96 g/cm^3
		--> volume = 0.110 cm^3
	resin:  m = 2 x (0.0882 + 0.1085) g + NULL x { 2 x (0.1445 + 0.1547) g } + 2 x (0.1768 + 0.2013) g + 1 x (0.2329 + 0.2764) g = 1.6589 g
		density (epoxy) = 1.3 g/cm^3
		--> volume = 1.276 cm^3

(5) HV stiffener (2 copies)
	FR4:    m = 0.060 g
		density (T_G10) = 1.90 g/cm^3
		--> volume = 0.032 cm^3
	
(6) ICC SMD Resistors, 23 x (0603) + 2 x (0805) + 4 x (1206) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed
	m = 0.0983 g
	density = 3.96525 g/cm^3
	--> volume = 0.025 cm^3

(7) ICC SMD Capacitors, 10 x (0805) + 6 x (1812), mostly BaTiO3, the total mass is computed
	m = 1.5300 g
	density = 6.02 g/cm^3
	--> volume = 0.254 cm^3

(8-9) ICC ASICs: 1 x ("CRT245" 24 pin) + 2 x ("LVDSBUF" 16 pin)
	epoxy:	m = [ ( 1 x 0.015675 ) + ( 2 x 0.038519 ) ] g = 0.092713 g
		density = 1.3 g/cm^3
		--> volume = 0.071 cm^3
	copper: m = [ ( 1 x 0.040 + 2 x 0.076 ) - 0.092713 ] g = 0.099287 g
		density = 8.96 g/cm^3
		--> volume = 0.011 cm^3

(10-13) Hybrid tail (2 copies)

(14) HV pin (2 copies)

.......................................................................
# "TOB ICC Layer 1/2 (1 APV)"   "TOB_L12_ICC1"    12.98   51.92
* 1 "PCB board"                 "T_G10"            4.305   1     ELE
* 2 "PCB copper traces"         "Copper"           0.176   1     ELE	 
* 3 "NAiS connectors"           "Copper"           0.110   1     ELE
* 4 "NAiS connectors"           "Epoxy"            1.276   1     ELE
* 5 "HV Stiffener"              "T_G10"            0.032   2     CAB
* 6 "ICC Resistors"             "Ceramic"          0.025   1     ELE
* 7 "ICC Capacitors"            "Barium_Titanate"  0.254   1     ELE
* 8 "ICC ASICs EMC"             "Epoxy"            0.071   1     ELE
* 9 "ICC ASICs copper"          "Copper"           0.011   1     ELE
* 10 "Hybrid Tail Kapton"       "T_Kapton"         0.028   2     ELE
* 11 "Hybrid Tail Copper"       "Copper"           0.055   2     ELE
* 12 "Hybrid Tail Solder Mask"  "T_Kapton"         0.011   2     ELE
* 13 "Hybrid Tail Glue"         "Epoxy"            0.057   2     ELE
* 14 "HV pin (module)"          "Brass"            0.011   2     ELE
.......................................................................
=======================================================================

ICC2
----
Same as Layer 3/4, except:
Circuit ICC2 (DS_ICC2)
EDMS Code EP 680-1174-210-D

(1-2) PCBs
	FR4:    m = 12.508 g
		density (T_G10) = 1.90 g/cm^3
		--> volume = 6.583 cm^3
	copper: m = 2.452 g
		density = 8.96 g/cm^3
		--> volume = 0.274 cm^3

(3-4) Connectors NaiS
	socket + header
	4 x ICC-Kapton bias PCB 16 pins (AXN316038S + AXN416330S)
	THIS GOES IN AOH 4 x ICC-AOH             30 pins (AXN330038S + AXN430330S)
	4 x ICC-FEH             40 pins (AXN340038S + AXN440330S)
	1 x ICC-ICB             50 pins (AXN350038S + AXN450330S)
	copper: m = 4 x (0.0461 + 0.0515) g + NULL x { 4 x (0.0865 + 0.0965) g } + 4 x (0.1153 + 0.1287) g + 1 x (0.1442 + 0.1609) g = 1.6715 g
		density = 8.96 g/cm^3
		--> volume = 0.187 cm^3
	resin:  m = 4 x (0.0882 + 0.1085) g + NULL x { 4 x (0.1445 + 0.1547) g } + 4 x (0.1768 + 0.2013) g + 1 x (0.2329 + 0.2764) g = 2.8085 g
		density (epoxy) = 1.3 g/cm^3
		--> volume = 2.160 cm^3

(5) HV stiffener (4 copies)
	FR4:    m = 0.060 g
		density (T_G10) = 1.90 g/cm^3
		--> volume = 0.032 cm^3
	
(6) ICC SMD Resistors, 46 x (0603) + 4 x (0805) + 4 x (1206) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed
	m = 0.1575 g
	density = 3.96525 g/cm^3
	--> volume = 0.040 cm^3

(7) ICC SMD Capacitors, 18 x (0805) + 12 x (1812), mostly BaTiO3, the total mass is computed
	m = 3.030 g
	density = 6.02 g/cm^3
	--> volume = 0.503 cm^3

(8-9) ICC ASICs: 1 x ("CRT245" 24 pin) + 4 x ("LVDSBUF" 16 pin)
	epoxy:	m = ( 1 x 0.015675 + 4 x 0.038519 ) g = 0.169751 g
		density = 1.3 g/cm^3
		--> volume = 0.131 cm^3
	copper: m = [ ( 1 x 0.040 + 4 x 0.076 ) - 0.169751 ) g = 0.274249 g
		density = 8.96 g/cm^3
		--> volume = 0.031 cm^3

(10-13) Hybrid tail (4 copies)

(14) HV pin (4 copies)

.......................................................................
# "TOB ICC Layer 1/2 (2 APVs)"  "TOB_L12_ICC2"    20.06   80.24
* 1 "PCB board"                 "T_G10"            6.583   1     ELE
* 2 "PCB copper traces"         "Copper"           0.274   1     ELE	 
* 3 "NAiS connectors"           "Copper"           0.187   1     ELE
* 4 "NAiS connectors"           "Epoxy"            2.160   1     ELE
* 5 "HV Stiffener"              "T_G10"            0.032   4     CAB
* 6 "ICC Resistors"             "Ceramic"          0.040   1     ELE
* 7 "ICC Capacitors"            "Barium_Titanate"  0.503   1     ELE
* 8 "ICC ASICs EMC"             "Epoxy"            0.131   1     ELE
* 9 "ICC ASICs copper"          "Copper"           0.031   1     ELE
* 10 "Hybrid Tail Kapton"       "T_Kapton"         0.028   4     ELE
* 11 "Hybrid Tail Copper"       "Copper"           0.055   4     ELE
* 12 "Hybrid Tail Solder Mask"  "T_Kapton"         0.011   4     ELE
* 13 "Hybrid Tail Glue"         "Epoxy"            0.057   4     ELE
* 14 "HV pin (module)"          "Brass"            0.011   4     ELE
.......................................................................
=======================================================================

	Layer 3/4
	---------
	
ICC1
----
Circuit ICC3 (SS_ICC1)
EDMS Code EP 680-1174-220-B

MCVolume: ( 11.8 x 4.4 x 0.25 ) cm^3 = 12.98 cm^3

(1-2) PCBs
	FR4:    m = 5.754 g
		density (T_G10) = 1.90 g/cm^3
		--> volume = 3.028 cm^3
	copper: m = 1.289 g
		density = 8.96 g/cm^3
		--> volume = 0.144 cm^3

(3-4) Connectors NaiS
	socket + header
	1 x ICC-Kapton bias PCB 16 pins (AXN316038S + AXN416330S)
	THIS GOES IN AOH 1 x ICC-AOH             30 pins (AXN330038S + AXN430330S)
	1 x ICC-FEH             40 pins (AXN340038S + AXN440330S)
	1 x ICC-ICB             50 pins (AXN350038S + AXN450330S)
	copper: m = 1 x (0.0461 + 0.0515) g + NULL x { 1 x (0.0865 + 0.0965) g } + 1 x (0.1153 + 0.1287) g + 1 x (0.1442 + 0.1609) g = 0.6467 g
		density = 8.96 g/cm^3
		--> volume = 0.0722 cm^3
	resin:  m = 1 x (0.0882 + 0.1085) g + NULL x { 1 x (0.1445 + 0.1547) g } + 1 x (0.1768 + 0.2013) g + 1 x (0.2329 + 0.2764) g = 1.0841 g
		density (epoxy) = 1.3 g/cm^3
		--> volume = 0.834 cm^3

(5) HV stiffener
	FR4:    m = 0.060 g
		density (T_G10) = 1.90 g/cm^3
		--> volume = 0.032 cm^3

(6) ICC SMD Resistors, 14 x (0603) + 1 x (0805) + 4 x (1206) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed
	m = 0.0741 g
	density = 3.96525 g/cm^3
	--> volume = 0.019 cm^3

(7) ICC SMD Capacitors, 7 x (0805) + 4 x (1812), mostly BaTiO3, the total mass is computed
	m = 1.025 g
	density = 6.02 g/cm^3
	--> volume = 0.170 cm^3

(8-9) ICC ASICs: 1 x ("CRT245" 24 pin) + 1 x ("LVDSBUF" 16 pin)
	epoxy:	m = [ ( 1 x 0.015675 ) + ( 1 x 0.038519 ) ] g = 0.054194 g
		density = 1.3 g/cm^3
		--> volume = 0.042 cm^3
	copper: m = [ ( 1 x 0.040 + 1 x 0.076 ) - 0.054194 ] g = 0.061806 g
		density = 8.96 g/cm^3
		--> volume = 0.007 cm^3

(10-13) Hybrid tail
	see http://www.fynu.ucl.ac.be/he/cms/activities/tracker/FHITfiles/CCTPHybrides.pdf
	surface: (19 x 30) mm^2 = 570 mm^2 = 5.70 cm^2
	- Kapton: (25+25) um = 50 um = 0.0050 cm --> 0.0285 cm^3
	- Copper: (18+12+18+18+18+12) um = 96 um = 0.0096 cm --> 0.05472 cm^3
	- Solder Mask: 20 um = 0.0020 cm --> 0.0114 cm^3
	- Glue: (50+50) um = 100 um thickness = 0.0100 cm --> 0.057 cm^3 

(14) HV pin
	module side:
		http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm
		m = 0.04 g per module
	ICB side:
		http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/ICB_MB.htm
		m = 0.330 g (6 HV wires) --> 0.330 g / 6 = 0.055 g per module
	HV pin (brass CuZn36Pb3 Sn plated):
		m = ( 0.04 + 0.055 ) g = 0.095 g
		density (brass) = 8.5 g/cm^3
		--> volume = 0.011 cm^3

.......................................................................
# "TOB ICC Layer 3/4 (1 APV)"   "TOB_L34_ICC1"    12.98   51.92
* 1 "PCB board"                 "T_G10"            3.028   1     ELE
* 2 "PCB copper traces"         "Copper"           0.144   1     ELE	 
* 3 "NAiS connectors"           "Copper"           0.0722  1     ELE
* 4 "NAiS connectors"           "Epoxy"            0.834   1     ELE
* 5 "HV Stiffener"              "T_G10"            0.032   1     CAB
* 6 "ICC Resistors"             "Ceramic"          0.019   1     ELE
* 7 "ICC Capacitors"            "Barium_Titanate"  0.170   1     ELE
* 8 "ICC ASICs EMC"             "Epoxy"            0.042   1     ELE
* 9 "ICC ASICs copper"          "Copper"           0.007   1     ELE
* 10 "Hybrid Tail Kapton"       "T_Kapton"         0.028   1     ELE
* 11 "Hybrid Tail Copper"       "Copper"           0.055   1     ELE
* 12 "Hybrid Tail Solder Mask"  "T_Kapton"         0.011   1     ELE
* 13 "Hybrid Tail Glue"         "Epoxy"            0.057   1     ELE
* 14 "HV pin (module)"          "Brass"            0.011   1     ELE
.......................................................................
=======================================================================

ICC2
----
Circuit ICC4 (SS_ICC2)
EDMS Code EP 680-1174-230-B

MCVolume: ( 11.8 x 6.8 x 0.25 ) cm^3 = 20.06 cm^3

(1-2) PCBs
	FR4:    m = 8.175 g
		density (T_G10) = 1.90 g/cm^3
		--> volume = 4.302 cm^3
	copper: m = 1.617 g
		density = 8.96 g/cm^3
		--> volume = 0.180 cm^3

(3-4) Connectors NaiS
	socket + header
	2 x ICC-Kapton bias PCB 16 pins (AXN316038S + AXN416330S)
	THIS GOES IN AOH 2 x ICC-AOH             30 pins (AXN330038S + AXN430330S)
	2 x ICC-FEH             40 pins (AXN340038S + AXN440330S)
	1 x ICC-ICB             50 pins (AXN350038S + AXN450330S)
	copper: m = 2 x (0.0461 + 0.0515) g + NULL x { 2 x (0.0865 + 0.0965) g } + 2 x (0.1153 + 0.1287) g + 1 x (0.1442 + 0.1609) g = 0.9883 g
		density = 8.96 g/cm^3
		--> volume = 0.110 cm^3
	resin:  m = 2 x (0.0882 + 0.1085) g + NULL x { 2 x (0.1445 + 0.1547) g } + 2 x (0.1768 + 0.2013) g + 1 x (0.2329 + 0.2764) g = 1.6589 g
		density (epoxy) = 1.3 g/cm^3
		--> volume = 1.276 cm^3

(5) HV stiffener (2 copies)
	FR4:    m = 0.060 g
		density (T_G10) = 1.90 g/cm^3
		--> volume = 0.032 cm^3

(6) ICC SMD Resistors, 28 x (0603) + 2 x (0805) + 4 x (1206) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed
	m = 0.1090 g
	density = 3.96525 g/cm^3
	--> volume = 0.027 cm^3

(7) ICC SMD Capacitors, 12 x (0805) + 8 x (1812), mostly BaTiO3, the total mass is computed
	m = 2.020 g
	density = 6.02 g/cm^3
	--> volume = 0.336 cm^3

(8-9) ICC ASICs: 1 x ("CRT245" 24 pin) + 2 x ("LVDSBUF" 16 pin)
	epoxy:	m = ( 1 x 0.015675 + 2 x 0.038519 ) g = 0.092713 g
		density = 1.3 g/cm^3
		--> volume = 0.0713 cm^3
	copper: m = [ ( 1 x 0.040 + 2 x 0.076 ) - 0.092713 ) g = 0.099287 g
		density = 8.96 g/cm^3
		--> volume = 0.011 cm^3

(10-13) Hybrid tail (2 copies)
	see http://www.fynu.ucl.ac.be/he/cms/activities/tracker/FHITfiles/CCTPHybrides.pdf
	surface: (19 x 30) mm^2 = 570 mm^2 = 5.70 cm^2
	- Kapton: (25+25) um = 50 um = 0.0050 cm --> 0.0285 cm^3
	- Copper: (18+12+18+18+18+12) um = 96 um = 0.0096 cm --> 0.05472 cm^3
	- Solder Mask: 20 um = 0.0020 cm --> 0.0114 cm^3
	- Glue: (50+50) um = 100 um thickness = 0.0100 cm --> 0.057 cm^3 
	
(14) HV pin (2 copies)
	module side:
		http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm
		m = 0.04 g per module
	ICB side:
		http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/ICB_MB.htm
		m = 0.330 g (6 HV wires) --> 0.330 g / 6 = 0.055 per module
	HV pin (brass CuZn36Pb3 Sn plated):
		m = ( 0.04 + 0.055 ) g = 0.095 g
		density (brass) = 8.5 g/cm^3
		--> volume = 0.011 cm^3

.......................................................................
# "TOB ICC Layer 3/4 (2 APVs)"  "TOB_L34_ICC2"    20.06   80.24
* 1 "PCB board"                 "T_G10"            4.302   1     ELE
* 2 "PCB copper traces"         "Copper"           0.180   1     ELE	 
* 3 "NAiS connectors"           "Copper"           0.110   1     ELE
* 4 "NAiS connectors"           "Epoxy"            1.276   1     ELE
* 5 "HV Stiffener"              "T_G10"            0.032   2     CAB
* 6 "ICC Resistors"             "Ceramic"          0.027   1     ELE
* 7 "ICC Capacitors"            "Barium_Titanate"  0.336   1     ELE
* 8 "ICC ASICs EMC"             "Epoxy"            0.0713  1     ELE
* 9 "ICC ASICs copper"          "Copper"           0.011   1     ELE
* 10 "Hybrid Tail Kapton"       "T_Kapton"         0.028   2     ELE
* 11 "Hybrid Tail Copper"       "Copper"           0.055   2     ELE
* 12 "Hybrid Tail Solder Mask"  "T_Kapton"         0.011   2     ELE
* 13 "Hybrid Tail Glue"         "Epoxy"            0.057   2     ELE
* 14 "HV pin (module)"          "Brass"            0.011   2     ELE
.......................................................................
=======================================================================

	Layer 5/6
	---------
	
ICC1
----
Same as Layer 3/4.

(15-16) Laser Diodes (1 additional copy for the L56 AOH, AOHs have only 2 copies)
	MISSING:m = xxx g
		density = xxx g/cm^3
		--> volume = xxx cm^3
	Covers (Al2O3 Aluminiumoxid, ceramic): m = 0.347 g
		density = 3.96525 g/cm^3
		--> volume = 0.0875 cm^3
	
.......................................................................
# "TOB ICC Layer 5/6 (1 APV)"   "TOB_L56_ICC1"    12.98   51.92
* 1 "PCB board"                 "T_G10"            3.028   1     ELE
* 2 "PCB copper traces"         "Copper"           0.144   1     ELE	 
* 3 "NAiS connectors"           "Copper"           0.0722  1     ELE
* 4 "NAiS connectors"           "Epoxy"            0.834   1     ELE
* 5 "HV Stiffener"              "T_G10"            0.032   1     CAB
* 6 "ICC Resistors"             "Ceramic"          0.019   1     ELE
* 7 "ICC Capacitors"            "Barium_Titanate"  0.170   1     ELE
* 8 "ICC ASICs EMC"             "Epoxy"            0.042   1     ELE
* 9 "ICC ASICs copper"          "Copper"           0.007   1     ELE
* 10 "Hybrid Tail Kapton"       "T_Kapton"         0.028   1     ELE
* 11 "Hybrid Tail Copper"       "Copper"           0.055   1     ELE
* 12 "Hybrid Tail Solder Mask"  "T_Kapton"         0.011   1     ELE
* 13 "Hybrid Tail Glue"         "Epoxy"            0.057   1     ELE
* 14 "HV pin (module)"          "Brass"            0.011   1     ELE
* 15 "Laser Diode"              "Air"              0.0000  1     ELE
* 16 "Laser Cover"              "Ceramic"          0.0875  1     ELE
.......................................................................
=======================================================================

ICC2
----
Same as Layer 3/4.
	
(14-15) Laser Diodes (2 additional copies for the L56 AOH, AOHs have only 2 copies)
	MISSING:m = xxx g
		density = xxx g/cm^3
		--> volume = xxx cm^3
	Covers (Al2O3 Aluminiumoxid, ceramic): m = 0.347 g
		density = 3.96525 g/cm^3
		--> volume = 0.0875 cm^3

.......................................................................
# "TOB ICC Layer 5/6 (2 APVs)"  "TOB_L56_ICC2"    20.06   80.24
* 1 "PCB board"                 "T_G10"            4.302   1     ELE
* 2 "PCB copper traces"         "Copper"           0.180   1     ELE	 
* 3 "NAiS connectors"           "Copper"           0.151   1     ELE
* 4 "NAiS connectors"           "Epoxy"            1.736   1     ELE
* 5 "HV Stiffener"              "T_G10"            0.032   2     CAB
* 6 "ICC Resistors"             "Ceramic"          0.027   1     ELE
* 7 "ICC Capacitors"            "Barium_Titanate"  0.336   1     ELE
* 8 "ICC ASICs EMC"             "Epoxy"            0.0713  1     ELE
* 9 "ICC ASICs copper"          "Copper"           0.011   1     ELE
* 10 "Hybrid Tail Kapton"       "T_Kapton"         0.028   2     ELE
* 11 "Hybrid Tail Copper"       "Copper"           0.055   2     ELE
* 12 "Hybrid Tail Solder Mask"  "T_Kapton"         0.011   2     ELE
* 13 "Hybrid Tail Glue"         "Epoxy"            0.057   2     ELE
* 14 "Laser Diode"              "Air"              0.0000  2     ELE
* 15 "Laser Cover"              "Ceramic"          0.0875  2     ELE
.......................................................................
=======================================================================


o AOH
  ---

MCVolume: ( 2.3 x 3.0 x 0.2 ) cm^3 = 1.38 cm^3

(1-2) PCBs
	FR4:    m = 0.65 g
		density (T_G10) = 1.90 g/cm^3
		--> volume = 0.342 cm^3
	copper: m = 0.497 g
		density = 8.96 g/cm^3
		--> volume = 0.055 cm^3

(3-4) Connectors NaiS
	socket + header
	1 x ICC-AOH             30 pins (AXN330038S + AXN430330S)
	copper: m = 1 x (0.0865 + 0.0965) g = 0.183 g
		density = 8.96 g/cm^3
		--> volume = 0.020 cm^3
	resin:  m = 1 x (0.1445 + 0.1547) g = 0.2992 g
		density (epoxy) = 1.3 g/cm^3
		--> volume = 0.230 cm^3

(5) AOH SMD Resistors, 6 x (0603) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed
	m = 0.0127 g
	density = 3.96525 g/cm^3
	--> volume = 0.0032 cm^3

(6) AOH SMD Capacitors, 3 x (0603) + 3 x (0805) mostly BaTiO3, the total mass is computed
	m = 0.0687 g
	density = 6.02 g/cm^3
	--> volume = 0.0114 cm^3

(7-8) AOH ASICs: 1 x ("LLD" 32 pin)
	epoxy:	m = ( 1 x 0.027098 ) g = 0.027098 g
		density = 1.3 g/cm^3
		--> volume = 0.0208 cm^3
	copper: m = [ ( 1 x 0.070 ) - 0.027098 ) ] g = 0.042902 g
		density = 8.96 g/cm^3
		--> volume = 0.0048 cm^3

(9-10) Laser Diodes (2 copies per each AOH + 2 additional copies for the L56 AOH directly in TOB_L56_ICC1/2)
	MISSING:m = xxx g
		density = xxx g/cm^3
		--> volume = xxx cm^3
	Covers (Al2O3 Aluminiumoxid, ceramic): m = 0.347 g
		density = 3.96525 g/cm^3
		--> volume = 0.0875 cm^3
	
(11) 3D Label
	Plastic (kapton): m = 0.020 g
		density = 1.40 g/cm^3
		--> volume = 0.0143 cm^3
	

.......................................................................
# "TOB AOH"                     "TOB_AOH"          1.38    6.90
* 1 "PCB board"                 "T_G10"            0.342   1     ELE
* 2 "PCB copper traces"         "Copper"           0.055   1     ELE	 
* 3 "NAiS connectors"           "Copper"           0.020   1     ELE
* 4 "NAiS connectors"           "Epoxy"            0.230   1     ELE
* 5 "AOH Resistors"             "Ceramic"          0.0032  1     ELE
* 6 "AOH Capacitors"            "Barium_Titanate"  0.0114  1     ELE
* 7 "AOH ASICs EMC"             "Epoxy"            0.0208  1     ELE
* 8 "AOH ASICs copper"          "Copper"           0.0048  1     ELE
* 9 "Laser Diode"               "Air"              0.0000  2     ELE
* 10 "Laser Cover"              "Ceramic"          0.0875  2     ELE
* 11 "AOH 3D Label"             "T_Kapton"         0.0143  1     ELE
.......................................................................
=======================================================================



o TOB_CCUM
  ---------
The TOB CCUM board.
Composition taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/CCUM_MB.htm
MCVolume: (11.8 x 7.0 x 0.25) cm^3 = 20.65 cm^3

	CCUM
	-----
(1) CCUM FR4 (G10) EDMS Code EDA-00036-V1
	m = 13.190 g
	density = 1.90 g/cm^3
	--> volume = 6.942 cm^3

(2) CCUM copper traces  EDMS Code EDA-00036-V1
	m = 2.787 g
	density = 8.96 g/cm^3
	--> volume = 0.311 cm^3

(3-4) CCUM NAiS connector EDMS Code EDA-00036-V1, details from http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Connectors_MB.htm
	socket + header CCUM-ICB 80 pins (AXN350038S + AXN480330S)
	copper: m = (0.2306 + 0.2574) g = 0.488 g
		density = 8.96 g/cm^3
		--> volume = 0.054 cm^3
	resin:  m = (0.337 + 0.3882) g = 0.7259 g
		density (epoxy) = 1.3 g/cm^3
		--> volume = 0.558 cm^3

(5) CCUM SMD Resistors EDMS Code EDA-00036-V1, 28 x (0603), mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed
	m = 0.060 g
	density = 3.96525 g/cm^3
	--> volume = 0.015 cm^3

(6) CCUM SMD Capacitors EDMS Code EDA-00036-V1, 20 x (0805) + 3 x (1210), mostly BaTiO3, the total mass is computed
	m = 0.570 g
	density = 6.02 g/cm^3
	--> volume = 0.095 cm^3

(7-9) CCUM ASICs EDMS Code EDA-00036-V1 IC "CCU" 196 pin
	BGA196 (Ball Grid Array), Sn/Pb/Ag 62/36/2:
		m = 0.1131 g
		density = 8.82 g/cm^3
		--> volume = 0.013 cm^3
	epoxy:	m = 0.4269 g
		density = 1.3 g/cm^3
		volume = 0.328 cm^3
	copper: m = (0.678 - 0.1131 - 0.4269) g = 0.138 g
		density = 8.96 g/cm^3
		--> volume = 0.015 cm^3

(10) Other components: araldite glue (take epoxy): 1/2 CCUM, (1/4 SCLAC), (1/4 SCACC)
	m = 1.05 g / 2 = 0.525 g
	density = 1.3 g/cm^3
	volume = 0.404 cm^3

The wires are in TOB_Conn[12/34/56]

............................................................................
# "TOB CCUM board"            "TOB_CCUM"                 20.65    82.6
* 1 "CCUM board"              "T_G10"                     6.942    1   ELE
* 2 "CCUM copper traces"      "Copper"                    0.311    1   ELE
* 3 "CCUM-ICB NAiS connector" "Copper"                    0.054    1   ELE
* 4 "CCUM-ICB NAiS connector" "Epoxy"                     0.558    1   ELE
* 5 "CCUM Resistors"          "Ceramic"                   0.015    1   ELE
* 6 "CCUM Capacitors"         "Barium_Titanate"           0.095    1   ELE
* 7 "CCUM ASICs BGA"          "BGA"                       0.013    1   ELE
* 8 "CCUM ASICs EMC"          "Epoxy"                     0.328    1   ELE
* 9 "CCUM ASICs copper"       "Copper"                    0.015    1   ELE
* 10 "CCUM glue"              "Epoxy"                     0.404    1   ELE
............................................................................
============================================================================


o TOB Rod Connectors (inside)
  ---------------------------
MCVolume: (11.800 x 7.500 x 0.500) cm^3 = 44.25 cm^3
All the TOB Connectors are the same (Layers 12/34/56) except the optical part.

Layer 1/2
----------
As Layer 3/4, except optical components.

	Optical components
	------------------
Different for different layers
(22-24) Optical fibers
	masses are per AOH, multiplicity will be given by the number of AOHs
	AOH x ( #fibers x type ) x length_fraction
		length_fraction: (total_length-5) cm per each fiber is in TOB_optfib_L12 
	2 x ( TOB_2_088 ) x 5/88 = 2 x 2 x 88 cm x 5/88 = 20 cm
	2 x ( TOB_2_070 ) x 5/70 = 2 x 2 x 70 cm x 5/70 = 20 cm
	4 x ( TOB_2_056 ) x 5/56 = 4 x 2 x 56 cm x 5/56 = 40 cm
	4 x ( TOB_2_035 ) x 5/35 = 4 x 2 x 35 c mx 5/35 = 40 cm
	Total optical fibers length: 120 cm

	All here:
	3D label tags (kapton): m = [ (2 x 2) + (2 x 2) + (4 x 2) + (4 x 2) ] x 0.110 g = 24 x 0.110 g = 2.64 g
		density = 1.40 g/cm^3
		--> volume = 1.714 cm^3
	MU connectors (kapton): m = [ (2 x 2) + (2 x 2) + (4 x 2) + (4 x 2) ] x 0.822 g = 24 x 0.822 g = 19.728 g
		density = 1.40 g/cm^3
		--> volume = 14.091 cm^3

(25) Ribbon connectors (2 copies)

(26) Ruggedized ribbon: total length 80 mm 

.....................................................................................
# "TOB Rod Connections Layer 1/2"          "TOB_CONN12"        44.25       88.5
* 1 "SCLAC board"                          "T_G10"              0.211       1    ELE
* 2 "SCLAC copper traces"                  "Copper"             0.007       1    ELE
* 3 "CCUM wires Cu"                        "Copper"             0.191       2    CAB
* 4 "CCUM wires Al"                        "Aluminium"          0.123       2    CAB
* 5 "CCUM wires PEI"                       "Silicone_Gel"       0.203       2    CAB
* 6 "CCUM wires SILTEM"                    "Polyethylene"       0.788       2    CAB
* 7 "BUS wires Cu"                         "Copper"             0.740       1    CAB
* 8 "BUS wires Al"                         "Aluminium"          0.0877      1    CAB
* 9 "BUS wires PEI"                        "Silicone_Gel"       0.144       1    CAB
* 10 "BUS wires SILTEM"                    "Polyethylene"       2.365       1    CAB
* 11 "SCLAC glue"                          "Epoxy"              0.202       1    SUP
* 12 "Output cable Shield"                 "Aluminium"          0.089       1    CAB
* 13 "Output cable Sleeve"                 "Polyethylene"       0.642       1    CAB
* 14 "Input and Output cable Tie"          "T_Kapton"           0.195       1    CAB
* 15 "Input and Output cable Solder Paste" "BGA"                0.038       1    CAB
* 16 "ICB,LVLAC,HVLAC glue"                "Epoxy"              0.181       1    SUP
* 17 "ICB Solder Paste"                    "BGA"                0.005       1    CAB
* 18 "LVLAC substrate"                     "T_G10"              0.242       1    ELE
* 19 "LVLAC copper traces"                 "Copper"             0.0126      1    ELE
* 20 "HVLAC substrate"                     "T_G10"              0.174       1    ELE
* 21 "HVLAC copper traces"                 "Copper"             0.0036      1    ELE
* 22 "Optical fibers"                      "Optical_Fiber"      6.362E-3  120    CAB
* 23 "Optical fibers 3D label tag"         "T_Kapton"           1.714       1    CAB
* 24 "Optical fibers MU connectors"        "T_Kapton"          14.091       1    CAB
* 25 "Ribbon Connectors"                   "T_Ribbon12xMUConn" 12.0         2    CAB
* 26 "Ruggedized ribbons"                  "T_RuggRibbon"       0.086       8    CAB
.....................................................................................
=====================================================================================


Layer 3/4
----------

	SCLAC
	-----
Ladder Adapter Card
Composition taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/CCUM_MB.htm
EDMS Code EP 680-1174-510

(1) SCLAC FR4
	m = 0.400 g
	density = 1.90 g/cm^3
	--> volume = 0.211 cm^3

(2) SCLAC copper traces
	m = 0.061 g
	density = 8.96 g/cm^3
	--> volume = 0.007 cm^3


	Wires
	-----

Short tail (to be multiplied by 2, the difference 'long tail'-1x'short tail' will be included outside)

(3-6)  - Connected to CCUM
	Shielded Twisted pair (112 mm), 9 pairs, total mass of a single wire (number of components to be multiplied by 2)
	+ shielded twisted pair + 0.5 mm^2 Copper wire, 2 pieces 106 mm 1 piece 100 mm.
	Tinned copper wire 100% outside the rod.
	total mass; 2 copies in the mixture
	Copper:	m = ( 0.3417 + 0.9328 + 0.4400 ) g = 1.7145 g
		density = 8.96 g/cm^3
		--> volume = 0.191 cm^3
	Aluminium:
	 	m = ( 0.3326 + 0 + 0 ) = 0.3326 g
		density = 2.7 g/cm^3
		--> volume = 0.123 cm^3
	PEI: 	m = ( 0.1956 + 0 + 0 ) = 0.1956 g
		density (silicone gel) = 0.965 g/cm^3
		--> volume = 0.203 cm^3
	SILTEM:	m = ( 0 + 0.5088 + 0.240 ) g = 0.7488 g
		density (polyethylene) = 0.95 g/cm^3
		--> volume = 0.788 cm^3

(7-10) - Connected to BUS
	Shielded Twisted pair (112 mm), 4 pieces
	+ Shielded Twisted pair (135 mm), 2 pieces
	+ 1.0 mm^2 Copper wire, 4 pieces 112 mm
	+ 0.5 mm^2 Copper wire, 1 piece 112 mm, 1 piece 147 mm, 1 piece 149 mm
	+ 1.0 mm^2 Copper wire, 1 piece 290 mm, only 80 mm here, the rest outside the rod
	total mass; 1 only copy in the mixture
	Copper:	m = ( 0.1519 + 0.0915 + 3.8976 + 0.4928 + 0.6468 + 0.6556 + 80/290 x 2.5230 ) g = 6.6322 g
		density = 8.96 g/cm^3
		--> volume = 0.740 cm^3
	Aluminium:
	 	m = ( 0.1478 + 0.0891 + 0 + 0 + 0 + 0 + 80/290 x 0 ) = 0.2369 g
		density = 2.7 g/cm^3
		--> volume = 0.0877 cm^3
	PEI: 	m = ( 0.0869 + 0.0524 + 0 + 0 + 0 + 0 + 80/290 x 0 ) = 0.1393 g
		density (silicone gel) = 0.965 g/cm^3
		--> volume = 0.144 cm^3
	SILTEM:	m = ( 0 + 0 + 1.0752 + 0.2688 + 0.3528 + 0.3576 + 80/290 x 0.6960 ) g = 2.2464 g
		density (polyethylene) = 0.95 g/cm^3
		--> volume = 2.365 cm^3


	Other components
	----------------

(11) Araldite glue (take epoxy): (1/2 CCUM), 1/4 SCLAC, (1/4 SCACC)
	m = 1.05 g / 4 = 0.2625 g
	density = 1.3 g/cm^3
	volume = 0.202 cm^3

(12) Output cable shield Aluminium: 1/2 here, (1/2 outside)
	m = 0.480 g / 2 = 0.240 g
	density = 2.7 g/cm^3
	volume = 0.089 cm^3

(13) Output cable sleeve (l=55 mm, ext diameter=9.5 mm, 1 piece) + (l=10 mm, ext diameter=3.0 mm, 4 pieces) Polyolefin (take polyethylene):
	total mass, 1/2 here, (1/2 outside)
	m = ( 0.90 + 0.32 ) g / 2 = 0.61 g
	density = 0.95 g/cm^3
	volume = 0.642 cm^3

(14) Input & Output cable tie Kapton: 2/3 here, (1/3 outside)
	m = 0.41 g * (2/3) = 0.273 g
	density = 1.40 g/cm^3
	volume = 0.195 cm^3

(15) Input & Output cable solder paste (BGA): 1/2 here, (1/2 outside)
	m = 0.67 g / 2 = 0.335 g
	density = 8.82 g/cm^3
	volume = 0.038 cm^3

(16) ICB Araldite glue (take epoxy): 1/2 CONN, (1/2 ICB)
	m = 0.47 g / 2 = 0.235 g
	density = 1.3 g/cm^3
	volume = 0.181 cm^3

(17) ICB Solder paste (BGA): (1/2 ICB), 1/2 CONN
	m = 0.09 g / 2 = 0.045 g
	density = 8.82 g/cm^3
	volume = 0.005 cm^3

	LVLAC
	-----
(18-19) LVLAC From the ICB
	FR4:	m = 0.46 g
		density (T_G10) = 1.90 g/cm^3
		--> volume = 0.242 cm^3
	Copper:	m = 0.113 g
		density = 8.96 g/cm^3
		--> volume = 0.0126 cm^3

	HVLAC
	-----
(20-21) HVLAC From the ICB
	FR4:	m = 0.33 g
		density (T_G10) = 1.90 g/cm^3
		--> volume = 0.174 cm^3
	Copper:	m = 0.032 g
		density = 8.96 g/cm^3
		--> volume = 0.0036 cm^3


	SCCAC
	-----
Slow Control Cable Adapter Card
Composition taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/CCUM_MB.htm
2 x short tail
It will go 100% outside

	Optical components
	------------------
Different for different layers
(22-24) Optical fibers
	masses are per AOH, multiplicity will be given by the number of AOHs
	AOH x ( #fibers x type ) x length_fraction
		length_fraction: (total_length-5) cm per each fiber is in TOB_optfib_L34 
	1 x ( TOB_2_088 ) x 5/88 = 1 x 2 x 88 cm x 5/88 = 10 cm
	1 x ( TOB_2_070 ) x 5/70 = 1 x 2 x 70 cm x 5/70 = 10 cm
	2 x ( TOB_2_056 ) x 5/56 = 2 x 2 x 56 cm x 5/56 = 20 cm
	2 x ( TOB_2_035 ) x 5/35 = 2 x 2 x 35 c mx 5/35 = 20 cm
	Total optical fibers length: 60 cm

	All here:
	3D label tags (kapton): m = [ (1 x 2) + (1 x 2) + (2 x 2) + (2 x 2) ] x 0.110 g = 12 x 0.110 g = 1.32 g
		density = 1.40 g/cm^3
		--> volume = 0.943 cm^3
	MU connectors (kapton): m = [ (1 x 2) + (1 x 2) + (2 x 2) + (2 x 2) ] x 0.822 g = 12 x 0.822 g = 9.864 g
		density = 1.40 g/cm^3
		--> volume = 7.046 cm^3

(25) Ribbon connectors (1 copy)

(26) Ruggedized ribbon: total length 40 mm 

.....................................................................................
# "TOB Rod Connections Layer 3/4"          "TOB_CONN34"        44.25       88.5
* 1 "SCLAC board"                          "T_G10"              0.211       1    ELE
* 2 "SCLAC copper traces"                  "Copper"             0.007       1    ELE
* 3 "CCUM wires Cu"                        "Copper"             0.191       2    CAB
* 4 "CCUM wires Al"                        "Aluminium"          0.123       2    CAB
* 5 "CCUM wires PEI"                       "Silicone_Gel"       0.203       2    CAB
* 6 "CCUM wires SILTEM"                    "Polyethylene"       0.788       2    CAB
* 7 "BUS wires Cu"                         "Copper"             0.740       1    CAB
* 8 "BUS wires Al"                         "Aluminium"          0.0877      1    CAB
* 9 "BUS wires PEI"                        "Silicone_Gel"       0.144       1    CAB
* 10 "BUS wires SILTEM"                    "Polyethylene"       2.365       1    CAB
* 11 "SCLAC glue"                          "Epoxy"              0.202       1    SUP
* 12 "Output cable Shield"                 "Aluminium"          0.089       1    CAB
* 13 "Output cable Sleeve"                 "Polyethylene"       0.642       1    CAB
* 14 "Input and Output cable Tie"          "T_Kapton"           0.195       1    CAB
* 15 "Input and Output cable Solder Paste" "BGA"                0.038       1    CAB
* 16 "ICB,LVLAC,HVLAC glue"                "Epoxy"              0.181       1    SUP
* 17 "ICB Solder Paste"                    "BGA"                0.005       1    CAB
* 18 "LVLAC substrate"                     "T_G10"              0.242       1    ELE
* 19 "LVLAC copper traces"                 "Copper"             0.0126      1    ELE
* 20 "HVLAC substrate"                     "T_G10"              0.174       1    ELE
* 21 "HVLAC copper traces"                 "Copper"             0.0036      1    ELE
* 22 "Optical fibers"                      "Optical_Fiber"      6.362E-3   60    CAB
* 23 "Optical fibers 3D label tag"         "T_Kapton"           0.943       1    CAB
* 24 "Optical fibers MU connectors"        "T_Kapton"           7.046       1    CAB
* 25 "Ribbon Connectors"                   "T_Ribbon12xMUConn" 12.0         1    CAB
* 26 "Ruggedized ribbons"                  "T_RuggRibbon"       0.086       4    CAB
.....................................................................................
=====================================================================================


Layer 5/6
----------
As Layer 3/4, except optical components.

	Optical components
	------------------
Different for different layers
(22-24) Optical fibers
	masses are per AOH, multiplicity will be given by the number of AOHs
	AOH x ( #fibers x type ) x length_fraction
		length_fraction: (total_length-5) cm per each fiber is in TOB_optfib_L56 
	1 x ( TOB_3_088 ) x 5/88 = 1 x 3 x 88 cm x 5/88 = 15 cm
	1 x ( TOB_3_070 ) x 5/70 = 1 x 3 x 70 cm x 5/70 = 15 cm
	2 x ( TOB_3_056 ) x 5/56 = 2 x 3 x 56 cm x 5/56 = 30 cm
	2 x ( TOB_3_035 ) x 5/35 = 2 x 3 x 35 c mx 5/35 = 30 cm
	Total optical fibers length: 90 cm

	All here:
	3D label tags (kapton): m = [ (1 x 3) + (1 x 3) + (2 x 3) + (2 x 3) ] x 0.110 g = 18 x 0.110 g = 1.98 g
		density = 1.40 g/cm^3
		--> volume = 1.414 cm^3
	MU connectors (kapton): m = [ (1 x 3) + (1 x 3) + (2 x 3) + (2 x 3) ] x 0.822 g = 18 x 0.822 g = 14.796 g
		density = 1.40 g/cm^3
		--> volume = 10.569 cm^3

(25) Ribbon connectors (2 copies)

(26) Ruggedized ribbon: total length 60 mm 

.....................................................................................
# "TOB Rod Connections Layer 5/6"          "TOB_CONN56"        44.25       88.5
* 1 "SCLAC board"                          "T_G10"              0.211       1    ELE
* 2 "SCLAC copper traces"                  "Copper"             0.007       1    ELE
* 3 "CCUM wires Cu"                        "Copper"             0.191       2    CAB
* 4 "CCUM wires Al"                        "Aluminium"          0.123       2    CAB
* 5 "CCUM wires PEI"                       "Silicone_Gel"       0.203       2    CAB
* 6 "CCUM wires SILTEM"                    "Polyethylene"       0.788       2    CAB
* 7 "BUS wires Cu"                         "Copper"             0.740       1    CAB
* 8 "BUS wires Al"                         "Aluminium"          0.0877      1    CAB
* 9 "BUS wires PEI"                        "Silicone_Gel"       0.144       1    CAB
* 10 "BUS wires SILTEM"                    "Polyethylene"       2.365       1    CAB
* 11 "SCLAC glue"                          "Epoxy"              0.202       1    SUP
* 12 "Output cable Shield"                 "Aluminium"          0.089       1    CAB
* 13 "Output cable Sleeve"                 "Polyethylene"       0.642       1    CAB
* 14 "Input and Output cable Tie"          "T_Kapton"           0.195       1    CAB
* 15 "Input and Output cable Solder Paste" "BGA"                0.038       1    CAB
* 16 "ICB,LVLAC,HVLAC glue"                "Epoxy"              0.181       1    SUP
* 17 "ICB Solder Paste"                    "BGA"                0.005       1    CAB
* 18 "LVLAC substrate"                     "T_G10"              0.242       1    ELE
* 19 "LVLAC copper traces"                 "Copper"             0.0126      1    ELE
* 20 "HVLAC substrate"                     "T_G10"              0.174       1    ELE
* 21 "HVLAC copper traces"                 "Copper"             0.0036      1    ELE
* 22 "Optical fibers"                      "Optical_Fiber"      6.362E-3   90    CAB
* 23 "Optical fibers 3D label tag"         "T_Kapton"           1.414       1    CAB
* 24 "Optical fibers MU connectors"        "T_Kapton"          10.569       1    CAB
* 25 "Ribbon Connectors"                   "T_Ribbon12xMUConn" 12.0         2    CAB
* 26 "Ruggedized ribbons"                  "T_RuggRibbon"       0.086       6    CAB
.....................................................................................
=====================================================================================



# "END"  "END"  0.  0.   
this has to be the last line !


[WAS
	o Aluminium cooling IV 
	  --------------------
	Al and locator piece at hybrid sides
	No screw !
	MCVolume: 1.5 x 2.8 x 0.03 cm
	
	(1) Al heat spreader   
		dimensions from EDM file CMSTKOBM0024 version 0
		{ [ 15 x 28 ] - (8 x 8 / 2) - [ pi x (2/2)^2 ] } mm^2 x 0.300 mm
		= 384.8584 mm^2 x 0.300 mm = 115.4575 mm^3
			[WAS 0.116 cm^3]
		[THIS MATERIAL HAS BEEN CREATED APART
			(2) CF compensator
				dimensions from EDM file CMSTKOBM0035 version AA
				{ [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm =
				= 337.46 mm^2 x 0.300 mm = 101.238 mm^3
					[WAS 0.15  cm^3]
		]
	(2) CuBe/brass -> take all Cu for now:
	             0.0044 cm^3 x 3
	..................................................................
	# "TOB Module Cooling 4"   "TOB_mod_cool4"      0.126      4.2
	* 1 "Al heat spreader"     "Aluminium"          0.115475   1  COL
	* 2 "Cu locator"           "Copper"             0.0044     3  SUP
	..................................................................
	==================================================================
NO MORE NEEDED, ALL THE SPREADER ARE THE SAME
]



		[WAS: o TOB_CCUM
		        ---------
		Not much know at this stage, so here comes some SciFi !
		
		MCVolume: 11.8 x 7 x 0.25 cm 
		
		Take the proposal from Marchioro with 3 instead of 2 connectors !
		
		G10 32 x 32 x 1 mm  -> 1.02 cm^3
		4 layer Cu 17 um, 50 % occ
		CCU in plastic housing, 15 x 15 x 1mm
		196 solder "balls" diameter 0.5 mm
		2 more plastic ship carriers, 7 x 7 x 0.3 mm
		4 caps, half size of 0402
		8 R     "   
		For connectors: take Robert's proposal NAIS 80 pin connector.
		
		......................................................................
		"TOB CCUM board"            "TOB_CCUM"        20.65  82.6
		1 "CCUM board"              "G10"              1.02     1   ELE
		2 "Copper traces"           "Copper"           0.035    1   ELE
		3 "CCU in housing"          "T_Kapton"         0.225    1   ELE
		4 "Solder balls"            "SMD_metal"        0.01     1   ELE
		5 "Other chips"             "T_Kapton"         0.015    2   ELE
		6 "Capacitors"              "Alumina"          1.E-4    4   ELE
		7 "Resistors"               "Carbon"           1.E-4    8   ELE       
		8 "Solder"                  "SMD_metal"        1.E-4    12  ELE
		9 "Connector"               "T_Kapton"       9.107E-3   80  ELE 
		10 "Connector pins"         "Copper"          8.092E-4  80  ELE         
		.....................................................................
		=====================================================================  ]



		[WAS: o TOB Electronics ICC1/2
		  -----------------------
		Need 6 different mixtures here !
		
		Don't know about cooling !! Left out for the moment
		
		$$ Per ICC:
		(1) CF support piece: 12.5 x 3 x 0.09 cm
		(2-3) ICC1 card: 11.8 x 4.4 - 2*0.25*2 = 50.92 cm^2 x 0.1 cm = 5.09 cm^3 G10
		         Cu : 4 layers a 25 um, 50 % occ    => 0.26 cm^3 
		      ICC2 card: 11.8 x 6.8 - 2*0.25*2 = 79.24 cm^2 x 0.1 cm = 7.92 cm^3 G10
		         Cu :                                  0.4 cm^3
		(4-5) Connector pairs: all NAIS 
		       per pin : Plastic:  0.01275 g -> 9.107E-3 cm^3 Kapton
		                 Cu     :  7.25E-3 g -> 8.092E-4 cm^3 Cu
		      Pins: 50 + (40+16+30)*OH
		
		(6-10) Optohybrid: dimensions: 23 x 30 mm, 0.5 mm thick FR4
		      For the rest: take information from TIB OH !!
		      Cu : 4 layers 50 % occ, 35 um 
		
		      Laser driver: 0.0025 cm^3 Si              (1/OH)
		      Laser diode: 0.02 cm^3 Si            (1 for 2 APVs)
		      Fiber clamps: 1.4 x 0.3 x 0.15 cm Kapton  (1/OH)
		
		Additional components: 
		      Kapton from hybrid to ICC: 4 x 3 x 0.01 cm   -> 0.12 cm^3
		                             Cu: 2 layers 50 um 50 % occ -> 0.06 cm^3  
		      Buffers on ICC & ICB: 0.02 cm^3 Kapton, 3.1E-3 Cu 
		                            1 + 1*OH
		
		      Capacitors large 4x7x2 mm = 0.056 cm^3 
		                                        2+3*OH 
		      Capacitors (0805) 2x1.25x1.25 = 3.1E-3 cm^3
		                                      19*OH+3
		      Resistors  (0603)  1.15E-3 cm^3
		                                      12.5*OH+3
		      Solder: 1.E-3*(large caps) + 2.E-4*(small caps+R) 
		
		Layer 5/6 ICC1 (serves 1 double sided module)
		  => 2 Optohybrids
		     2 Kapton pigtails, 3 buffers
		     8 large caps, 41 small caps, 28 R's 
		
		.................................................................
		 "TOB electronics lay 5/6 ICC1"   "TOB_ICC1"    25.96   51.92
		 1 "CF support"             "Carbon fibre str."  3.375    1    SUP
		 2 "ICC card"               "G10"                 5.09    1    ELE
		 3 "ICC traces"             "Copper"              0.254   1	ELE	 
		 4 "Connectors"             "T_Kapton"         9.107E-3   222  ELE
		 5 "Connectors pins"        "Copper"           8.092E-4   222  ELE
		 6 "Optohybrid"             "T_FR4"               0.345   2    ELE
		 7 "Optohybrid traces"      "Copper"              0.048   2    ELE
		 8 "Laser drivers"         "Silicon"            0.0025    2    ELE
		 9 "Laser diode"           "Silicon"              0.02    4    ELE
		 10 "Fiber clamp"           "T_Kapton"            0.063   2    ELE
		 11 "Pigtail and buffers"   "T_Kapton"            0.3     1    ELE
		 12 "Pigtail and buffers"   "Copper"              0.129   1    ELE
		 13 "Capacitors"            "Alumina"             0.5751  1    ELE
		 14 "Resistors"             "Carbon"             1.15E-3 28    ELE
		 15 "Solder"                "SMD_metal"          0.022    1    ELE
		................................................................
		
		
		Layer 5/6 ICC2 (serves 2 double sided module)
		  => 4 Optohybrids
		     4 Kapton pigtails, 5 buffers
		     14 large caps, 79 small caps, 53 R's 
		.................................................................
		 "TOB electronics lay 5/6 ICC2"   "TOB_ICC2"    40.12   80.24
		 1 "CF support"             "Carbon fibre str."  3.375    1    SUP
		 2 "ICC card"               "G10"                 7.92    1    ELE
		 3 "ICC traces"             "Copper"              0.4     1	ELE	
		 4 "Connectors"             "T_Kapton"         9.107E-3   394  ELE
		 5 "Connectors pins"        "Copper"           8.092E-4   394  ELE
		 6 "Optohybrid G10"         "T_FR4"               0.345   4    ELE
		 7 "Optohybrid traces"      "Copper"              0.048   4    ELE
		 8 "Laser drivers"         "Silicon"            0.0025    4    ELE
		 9 "Laser diode"           "Silicon"              0.02    8    ELE
		 10 "Fiber clamp"           "T_Kapton"            0.063   4    ELE
		 11 "Pigtail and buffers"   "T_Kapton"            0.58    1    ELE
		 12 "Pigtail and buffers"   "Copper"              0.256   1    ELE
		 13 "Capacitors"            "Alumina"             1.029   1    ELE
		 14 "Resistors"             "Carbon"             1.15E-3 53    ELE
		 15 "Solder"                "SMD_metal"           0.04    1    ELE
		.................................................................
		
		Layer 7/8 ICC1 (serves 1 single sided module with 4 APVs)
		  => 1 Optohybrids
		     1 Kapton pigtails, 2 buffers
		     5 large caps, 22 small caps, 16 R's 
		.................................................................
		"TOB electronics lay 7/8 ICC1"   "TOB_ICC3"    25.96   51.92
		1 "CF support"             "Carbon fibre str."  3.375    1    SUP
		2 "ICC card"               "G10"                 5.09    1    ELE
		3 "ICC traces"             "Copper"              0.254   1	ELE	
		4 "Connectors"             "T_Kapton"         9.107E-3   136  ELE
		5 "Connectors pins"        "Copper"           8.092E-4   136  ELE
		6 "Optohybrid"             "T_FR4"               0.345   1    ELE
		7 "Optohybrid traces"      "Copper"              0.048   1    ELE
		8 "Laser drivers"         "Silicon"            0.0025    1    ELE
		9 "Laser diode"           "Silicon"              0.02    2    ELE
		10 "Fiber clamp"           "T_Kapton"            0.063   1    ELE
		11 "Pigtail and buffers"   "T_Kapton"            0.16    1    ELE
		12 "Pigtail and buffers"   "Copper"              0.0662  1    ELE
		13 "Capacitors"            "Alumina"             0.348   1    ELE
		14 "Resistors"             "Carbon"             1.15E-3 16    ELE
		15 "Solder"                "SMD_metal"          0.0126   1    ELE
		.................................................................
		
		Layer 7/8 ICC2 (serves 2 single sided module with 4 APVs)
		  => 2 Optohybrids
		     2 Kapton pigtails, 3 buffers
		     8 large caps, 41 small caps, 28 R's 
		.................................................................
		 "TOB electronics lay 7/8 ICC2"   "TOB_ICC4"    40.12   80.24
		 1 "CF support"             "Carbon fibre str."  3.375    1    SUP
		 2 "ICC card"               "G10"                 7.92    1    ELE
		 3 "ICC traces"             "Copper"              0.4     1	ELE	
		 4 "Connectors"             "T_Kapton"         9.107E-3   222  ELE
		 5 "Connectors pins"        "Copper"           8.092E-4   222  ELE
		 6 "Optohybrid"             "T_FR4"               0.345   2    ELE
		 7 "Optohybrid traces"      "Copper"              0.048   2    ELE
		 8 "Laser drivers"         "Silicon"            0.0025    2    ELE
		 9 "Laser diode"           "Silicon"              0.02    4    ELE
		 10 "Fiber clamp"           "T_Kapton"            0.063   2    ELE
		 11 "Pigtail and buffers"   "T_Kapton"              0.3   1    ELE
		 12 "Pigtail and buffers"   "Copper"              0.129   1    ELE
		 13 "Capacitors"            "Alumina"             0.5751  1    ELE
		 14 "Resistors"             "Carbon"             1.15E-3  28   ELE
		 15 "Solder"                "SMD_metal"           0.022    1   ELE
		.................................................................
		
		Layer 9/10 ICC1 (serves 1 single sided module with 6 APVs)
		  => 1 Optohybrids
		     1 Kapton pigtails, 2 buffers
		     5 large caps, 22 small caps, 16 R's 
		.................................................................
		 "TOB electronics lay 9/10 ICC1"   "TOB_ICC5"    25.96   51.92
		 1 "CF support"             "Carbon fibre str."  3.375    1   SUP
		 2 "ICC card"               "G10"                 5.09    1   ELE
		 3 "ICC traces"             "Copper"              0.254   1   ELE	 
		 4 "Connectors"             "T_Kapton"         9.107E-3   136 ELE
		 5 "Connectors pins"        "Copper"           8.092E-4   136 ELE
		 6 "Optohybrid"            "T_FR4"                0.345   1   ELE
		 7 "Optohybrid traces"      "Copper"              0.048   1   ELE
		 8 "Laser drivers"         "Silicon"            0.0025    1   ELE
		 9 "Laser diode"           "Silicon"              0.02    3   ELE
		 10 "Fiber clamp"           "T_Kapton"            0.063   1   ELE
		 11 "Pigtail and buffers"   "T_Kapton"            0.16    1   ELE
		 12 "Pigtail and buffers"   "Copper"              0.0662  1   ELE
		 13 "Capacitors"            "Alumina"             0.348   1   ELE
		 14 "Resistors"             "Carbon"             1.15E-3 16   ELE
		 15 "Solder"                "SMD_metal"          0.0126   1   ELE
		.................................................................
		
		Layer 9/10 ICC2 (serves 2 single sided module with 6 APVs)
		  => 2 Optohybrids
		     2 Kapton pigtails, 3 buffers
		     8 large caps, 41 small caps, 28 R's 
		.................................................................
		 "TOB electronics lay 9/10 ICC2"   "TOB_ICC6"    40.12   80.24
		 1 "CF support"             "Carbon fibre str."  3.375    1    SUP
		 2 "ICC card"               "G10"                 7.92    1    ELE
		 3 "ICC traces"             "Copper"              0.4     1	ELE	
		 4 "Connectors"             "T_Kapton"         9.107E-3   222  ELE
		 5 "Connectors pins"        "Copper"           8.092E-4   222  ELE
		 6 "Optohybrid"             "T_FR4"               0.345   2    ELE
		 7 "Optohybrid traces"      "Copper"              0.048   2    ELE
		 8 "Laser drivers"         "Silicon"            0.0025    2    ELE
		 9 "Laser diode"           "Silicon"              0.02    6    ELE
		 10 "Fiber clamp"           "T_Kapton"            0.063   2    ELE
		 11 "Pigtail and buffers"   "T_Kapton"              0.3   1    ELE
		 12 "Pigtail and buffers"   "Copper"              0.129   1    ELE
		 13 "Capacitors"            "Alumina"             0.5751  1    ELE
		 14 "Resistors"             "Carbon"             1.15E-3 28    ELE
		 15 "Solder"                "SMD_metal"           0.022    1   ELE
		.................................................................
		=================================================================    ]

		[WAS:
		o TOB rod connectors (inside)
		  ---------------------------
		MCVolume 11.8 x 7.5 x 0.5 cm
		
		(1) CF support plate: 12.5 x 12.5 x 0.09 cm = 14.06 cm^3 
		(2) Loose wires (Robert)
		        Al xsection 1 mm^2 
		         For control: 10 cables with l=22cm, 10 with l=12 cm
		                 LV :  8   "         l=12 cm			             
		    Forget about the Polyethylene shielding, absorbed in 
		    optical connector uncertainty !
		(3) Optical connectors: 2 for layer 5/6, 1 for 7-10
		   Info from Francois: 46.8 g Plastic, 8.4 g Cu
		   OVERESTIMATE, don't believe ! take 15 cm^3 plastic
		.....................................................................
		 "TOB rod connections 5/6"      "TOB_CONN1"          44.25 88.5
		 1 "Support plate"          "Carbon fibre str."    14.06   1   SUP
		 2 "Al wires"               "Aluminium"            0.12    37  CAB
		 3 "Optoconnector"          "T_Kapton"             15.0     2  CAB
		 4 "Optoconnector"          "Copper"               0.446    2  CAB
		....................................................................
		....................................................................
		 "TOB rod connections 7-10"      "TOB_CONN2/3"       44.25 88.5
		 1 "Support plate"          "Carbon fibre str."    14.06   1   SUP
		 2 "Al wires"               "Aluminium"            0.12    37  CAB
		 3 "Optoconnector"          "T_Kapton"             15.0     1  CAB
		 4 "Optoconnector"          "Copper"               0.446    1  CAB
		....................................................................
		==================================================================== ]