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<?xml version="1.0"?>
<DDDefinition xmlns="http://www.cern.ch/cms/DDL" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.cern.ch/cms/DDL ../../../DetectorDescription/Schema/DDLSchema.xsd">
<!--
== CMS Forward Pixels Geometry ==
@version 3.02.01 May 30, 2006
@created Sunanda Banjeree
@modified Dmitry Onoprienko
== COMPONENT DEFINED BY THIS FILE: ==
Common parts for all types of plaquettes.
-->
<!-- Rotations for placing sensors -->
<RotationSection label="PlaquetteCommon">
<Rotation name="Z90" phiX="90.*deg" thetaX="90.*deg" phiY="180.*deg" thetaY="90.*deg" phiZ="0.*deg" thetaZ="0.*deg"/>
<Rotation name="Z270" phiX="-90.*deg" thetaX="90.*deg" phiY="0.*deg" thetaY="90.*deg" phiZ="0.*deg" thetaZ="0.*deg"/>
</RotationSection>
<ConstantsSection label="Input" eval="true">
<Constant name="SensorT" value="0.270*mm"/>
<Constant name="BumpT" value="0.025*mm"/>
<Constant name="ROChipT" value="0.200*mm"/>
<Constant name="EpoxyT" value="0.178*mm"/>
<Constant name="FlexCircuitT" value="0.125*mm"/>
<Constant name="AdhFilmT" value="0.051*mm"/>
<Constant name="BackingT" value="0.300*mm"/>
<Constant name="ChoThermT" value="0.178*mm"/>
<Constant name="ROChipW" value="8.005*mm"/>
<!-- Readout chip width -->
<Constant name="ROChipH" value="9.935*mm"/>
<!-- Readout chip height -->
<Constant name="ROChipSpaceW" value="8.100*mm"/>
<!-- Distance (along width) between centers of adjacent chips -->
</ConstantsSection>
<ConstantsSection label="Calculated" eval="true">
<!-- Thicknesses of superlayers -->
<Constant name="BumpROChipEpoxyT" value="[BumpT]+[ROChipT]+[EpoxyT]"/>
<Constant name="PassiveT" value="[BumpROChipEpoxyT]+[FlexCircuitT]+[AdhFilmT]+[BackingT]+[ChoThermT]"/>
<Constant name="PlaquetteT" value="[SensorT]+[PassiveT]"/>
<!-- Z-positions of superlayers to be positioned into plaquette root volume -->
<Constant name="SensorZ" value="([PlaquetteT]-[SensorT])/2."/>
<Constant name="PassiveZ" value="(-[PlaquetteT]+[PassiveT])/2."/>
<!-- Z-positions of layers to be positioned into "Passive" layer -->
<Constant name="BumpROChipEpoxyZ" value="([PassiveT]-[BumpROChipEpoxyT])/2."/>
<Constant name="FlexCircuitZ" value="[PassiveT]/2.-[BumpROChipEpoxyT]-[FlexCircuitT]/2."/>
<Constant name="AdhFilmZ" value="[PassiveT]/2.-[BumpROChipEpoxyT]-[FlexCircuitT]-[AdhFilmT]/2."/>
<Constant name="BackingZ" value="[PassiveT]/2.-[BumpROChipEpoxyT]-[FlexCircuitT]-[AdhFilmT]-[BackingT]/2."/>
<Constant name="ChoThermZ" value="(-[PassiveT]+[ChoThermT])/2."/>
</ConstantsSection>
<!-- Readout chip with epoxy and bump bond -->
<ConstantsSection label="BumpROChipCalculated" eval="true">
<Constant name="BumpZ" value="([BumpROChipEpoxyT]-[BumpT])/2."/>
<Constant name="EpoxyZ" value="(-[BumpROChipEpoxyT]+[EpoxyT])/2."/>
</ConstantsSection>
<SolidSection label="BumpROChipEpoxy">
<Box name="PixelForwardBumpROChipEpoxy" dx="[ROChipW]/2." dy="[ROChipH]/2" dz="[BumpROChipEpoxyT]/2."/>
<Box name="PixelForwardBump" dx="[ROChipW]/2." dy="[ROChipH]/2" dz="[BumpT]/2."/>
<Box name="PixelForwardEpoxy" dx="[ROChipW]/2." dy="[ROChipH]/2" dz="[EpoxyT]/2."/>
</SolidSection>
<LogicalPartSection label="BumpROChipEpoxy">
<LogicalPart name="PixelForwardBumpROChipEpoxy" category="unspecified">
<rSolid name="PixelForwardBumpROChipEpoxy"/>
<rMaterial name="materials:Silicon"/>
</LogicalPart>
<LogicalPart name="PixelForwardBump" category="unspecified">
<rSolid name="PixelForwardBump"/>
<rMaterial name="pixfwdMaterials:Pix_Fwd_Bump"/>
</LogicalPart>
<LogicalPart name="PixelForwardEpoxy" category="unspecified">
<rSolid name="PixelForwardEpoxy"/>
<rMaterial name="pixfwdMaterials:Pix_Fwd_AgEpoxy"/>
</LogicalPart>
</LogicalPartSection>
<PosPartSection label="BumpROChipEpoxy">
<PosPart copyNumber="1">
<rParent name="PixelForwardBumpROChipEpoxy"/>
<rChild name="PixelForwardBump"/>
<Translation x="0.*mm" y="0.*mm" z="[BumpZ]"/>
</PosPart>
<PosPart copyNumber="1">
<rParent name="PixelForwardBumpROChipEpoxy"/>
<rChild name="PixelForwardEpoxy"/>
<Translation x="0.*mm" y="0.*mm" z="[EpoxyZ]"/>
</PosPart>
</PosPartSection>
</DDDefinition>
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