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0001 PIXEL forward detector
0002 ============
0003
0004 @version October 17, 2007
0005 @created Vesna Cuplov (2006)
0006 @modified Vesna Cuplov (2007)
0007 - Forward pixel Disks and Service cylinder mixtures definitions.
0008 - All mixtures for FPix disks were updated in october 2007.
0009 (added capacitors, resistors, solders in the HDI and VHDI mixtures..... )
0010 - Mixtures for Service cylinder were fully implemented in october 2007.
0011 @modified Vesna Cuplov (2008)
0012 New Aluminium density for the Outer Ring volume in order to take into account
0013 the non-implemented holes in the Outer Ring. We used the real volume (this volume takes
0014 into account the holes in the ring) of the outer ring calculated by G. Derylo.
0015 The inner ring material was not implemented with the mixture program because
0016 this ring was modified (more holes in it) in order to remove more material. So, to
0017 implement the new aluminium density to be used in the simulation, we used the
0018 inner ring mass value from the lab measurements and computed the denisty needed
0019 to reproduce this mass with a simulated inner ring volume without implemented holes.
0020
0021 .....................................................................................
0022 .....................................................................................
0023
0024 Input file for mixture.f
0025 Start new mixtures with a '#' in the first column
0026 Start the components with a '*' in the first column
0027 You can type any kind of comment in as long as you don't start it
0028 with '#' or '*' !
0029 .....................................................................
0030 For mixture declaration: Name of Mixture, Name of GMIX for title file,
0031 Monte Carlo Volume, MC Area
0032 For items in a compound: Item number, Comment, Material (has to be
0033 written exactly as in material.input file),
0034 Volume, Multiplicity, Type
0035 Type is one of the following: SUP for support
0036 SEN for sensitive volumes
0037 CAB for cables
0038 COL for cooling
0039 ELE for electronics
0040 .....................................................................
0041
0042
0043 1) BumpBonds+Air layer per ROC area
0044 ============================================
0045 ROC dimensions: Length=0.994cm, Width=0.801cm and Thickness=0.0190cm
0046
0047 An average of 4160 Bump Bonds (63% Tin and 37% Lead) per ROC
0048 Bump Bond size: Length= 0.003cm, Width=0.003cm and Thickness=0.0025cm
0049 Volume will be approximatively: V = 0.0000000225 cm^3
0050
0051 The bump bond is made of a material named Bump_Bond.
0052 .....................................................................
0053 # "Pixel Forward BumpBond layer per ROC" "Pix_Fwd_Bump" 0.00199 1
0054 * 1 "Bump Bonds" "FPix_TinLeadSolder" 0.0000936 1 ELE
0055
0056
0057 2) VHDI
0058 ================================
0059 The total area of VHDI on a blade is 60.5326 cm2
0060 We have one layer of Kapton on 60.5326 cm2 area and thickness of 0.009cm
0061 We have Copper only 60% of the volume made by 60.5326 cm2 area and thickness of 0.004cm
0062
0063 So the Kapton Volume is 0.5448 cm3 and the Copper Volume is 0.1453 cm3.
0064
0065 The total volume of VHDI on a blade is 60.5326 cm2 * 0.009 + 60% * 60.5326* 0.004 = 0.6901 cm3
0066
0067 There are 135 capacitors made of Marium_Titanate. (L=1mm, W=0.5mm and Thickness=0.25mm)
0068 There are Solders made of Tin/Lead in proportion of 63/37: Total volume of Solder is: 0.0054 cm3
0069
0070 .....................................................................
0071 # "Pixel Forward VHDI" "Pix_Fwd_VHDI" 0.7124 60.5326
0072 * 1 "VHDI: Kapton" "FPix_Kapton" 0.5448 1 ELE
0073 * 2 "VHDI: Copper" "Copper" 0.1453 1 ELE
0074 * 3 "Capacitors" "Barium_Titanate" 0.000125 135 ELE
0075 * 4 "Solders" "FPix_TinLeadSolder" 0.0054 1 ELE
0076
0077
0078
0079 3) AgEpoxy (also called ChoTherm1680)
0080 ============================================
0081
0082 There are 2 places where we put this material: Between VHDI and ROC and Between Plaquette and HDI prom panel.
0083 The last bottom layer of a plaquette is made of AgEpoxy and will then be touching the HDI layer of a panel.
0084
0085 Greg Derylo called this ChoTherm (the XML file call this Pix_Fwd_AgEpoxy.
0086
0087 Description of the layer between VHDI and ROC : Acrylic (Epoxy assumed) V = 0.0895 cm3
0088 BN powder V = 0.0895 cm3
0089 (Boron Nitride powder ~ ceramic)
0090 Silicone V = 0.3579 cm3
0091 Polyimide V = 0.0895 cm3
0092 .....................................................................
0093 # "Pixel Forward AgEpoxy VHDI-ROC" "Pix_Fwd_AgEpoxy" 0.6264 1
0094 * 1 "Acrylic is epoxy" "FPix_Epoxy" 0.0895 1 SUP
0095 * 2 "BN powder" "FPix_BNPowder" 0.0895 1 SUP
0096 * 3 "Silicone" "FPix_Silicone" 0.3579 1 SUP
0097 * 4 "Polyimide is kapton" "FPix_Kapton" 0.0895 1 ELE
0098
0099
0100 4) Adhesive Film: 3M 9882 tape
0101 ==========================
0102 This tape is made of Acrylic (Epoxy assumed) V = 0.2421cm3 and Ceramic (BN powder) V = 0.0605 cm3
0103 .....................................................................
0104 # "Pixel Forward AdhFilm 3M 9882" "Pix_Fwd_AdhFilm" 0.3026 1
0105 * 1 "Acrylic is epoxy" "FPix_Epoxy" 0.2421 1 SUP
0106 * 2 "Ceramic" "FPix_BNPowder" 0.0605 1 SUP
0107
0108
0109 5) HDI + other components per blade
0110 ===============================
0111 HDI on a BLADE (2 panels) is made of: Kapton (0.4278 * 2 cm3), an internal flex adhesive(~epoxy) (0.2139 * 2 cm3), Copper (0.0675 * 2 cm3).
0112 There are 8 capacitors made of BaTiO3: V = 0.0019 cm3
0113 There are 9 resistors made of Alumina: V = 0.0022 cm3
0114 There are Solders made of Tin/Lead in proportion of 63/37: Total volume of Solder is: 0.0085 cm3
0115 We also have Bias and Ground Wires: Copper V = 0.0362 cm3
0116 Kapton V = 0.1087 cm3
0117 Solder Tin/Lead (63/37) V = 0.012 cm3
0118 Epoxy V = 0.030 cm3
0119 Indium solders In/Sn (52/48) V = 0.006 cm3
0120
0121 .....................................................................
0122 # "Pixel Forward HDI" "Pix_Fwd_HDI" 1.6232 1
0123 * 1 "Kapton" "FPix_Kapton" 0.8556 1 ELE
0124 * 2 "Internal flex adhesive is like epoxy" "FPix_Epoxy" 0.4278 1 SUP
0125 * 3 "Copper" "Copper" 0.1349 1 ELE
0126 * 4 "Capacitors" "Barium_Titanate" 0.0019 1 ELE
0127 * 5 "Resistors" "FPix_Alumina" 0.0022 1 ELE
0128 * 6 "Solders" "FPix_TinLeadSolder" 0.0085 1 ELE
0129 * 7 "Copper" "Copper" 0.0362 1 ELE
0130 * 8 "Kapton" "FPix_Kapton" 0.1087 1 ELE
0131 * 9 "Solders" "FPix_TinLeadSolder" 0.012 1 ELE
0132 * 10 "Epoxy" "FPix_Epoxy" 0.030 1 SUP
0133 * 11 "Solders Indium" "Indium" 0.006 1 ELE
0134
0135
0136 6) Aluminium for inner ring (NO EDGES)
0137 ===================================
0138 We want a new aluminium density that is used for the inner Ring in order to take
0139 into account the holes that are not implemented in the simulation.
0140 18.78 cm3 is the volume of an inner-ring without holes as it is in the simulation.
0141 G. Derylo calulated the inner-ring REAL volume (there are many holes in the ring):
0142 13.944 cm3 - 0.624 cm3 (2 x 0.312cm3 = 2 x one inner edge volume)
0143 G. Derylo used docDB 506 to get inner and outer ring drawing numbers and then pulled
0144 the 3D part models out of the library and used the CAD software to calculate the
0145 volumes.
0146
0147 # "Aluminium for inner ring" "Aluminium_InnerRing" 18.78 1
0148 * 1 "Aluminium" "Aluminium" 13.32 1 SUP
0149
0150
0151 7) Aluminium for outer ring (NO EDGES)
0152 ===================================
0153 We want a new aluminium density that is used for the outer Ring in order to take
0154 into account the holes in the outer ring that are not implemented in the
0155 simulation.
0156 58.572 cm3 is the volume of an outer-ring without holes as it is in the simulation.
0157 G. Derylo calulated the outer-ring REAL volume (there are many holes in the ring):
0158 41.446 cm3 - 2 cm3 (2 x 1cm3 = 2 x one outer edge volume )
0159
0160 # "Aluminium for outer ring" "Aluminium_OuterRing" 58.572 1
0161 * 1 "Aluminium" "Aluminium" 39.446 1 SUP
0162
0163
0164 SERVICE CYLINDER MATERIAL (V. Cuplov)
0165 =============================================
0166 The following description (Volumes 1-8) has been done by B. Gobbi and E. Spencer.
0167 See FPix DOC DB: 1628-v2
0168 https://docdb.fnal.gov/CMS-private/DocDB/DocumentDatabase
0169
0170 # "Volume 1 " "Pix_Fwd_Servi_Cylind" 8957 1
0171 * 1 "Carbon Fiber" "FPix_Cylind_CF" 1162 1 SUP
0172 * 2 "G10" "FPix_Cylind_G10" 26 1 CAB
0173 * 3 "Aluminium" "Aluminium" 6 1 SUP
0174 * 4 "Ceramic" "Ceramic" 1 1 SUP
0175
0176 # "Volume 2 " "Pix_Fwd_End_Flange" 412 1
0177 * 1 "Aluminium for End Flange" "Aluminium" 187 1 SUP
0178 * 2 "Aluminium for cooling lines" "Aluminium" 4 1 COL
0179 * 3 "SnCu" "FPix_Cylind_SnCu" 11 1 CAB
0180 * 4 "Poliax" "FPix_Cylind_POLIAX" 35 1 CAB
0181 * 5 "C6F14" "FPix_Cylind_C6F14" 16 1 COL
0182
0183 # "Volume 3 " "Pix_Fwd_End_Electro_1" 1139 1
0184 * 1 "SnCu" "FPix_Cylind_SnCu" 13 1 CAB
0185 * 2 "G10" "FPix_Cylind_G10" 65 1 CAB
0186 * 3 "Poliax" "FPix_Cylind_POLIAX" 39 1 CAB
0187 * 4 "Carbon Fiber" "FPix_Cylind_CF" 23 1 SUP
0188 * 5 "Copper" "Copper" 2 1 ELE
0189 * 6 "Polyester" "FPix_Cylind_Polyester" 5 1 CAB
0190
0191 # "Volume 4 " "Pix_Fwd_End_Electro_2" 980 1
0192 * 1 "SnCu" "FPix_Cylind_SnCu" 11 1 CAB
0193 * 2 "G10" "FPix_Cylind_G10" 54 1 CAB
0194 * 3 "Poliax" "FPix_Cylind_POLIAX" 31 1 CAB
0195 * 4 "Carbon Fiber" "FPix_Cylind_CF" 19 1 SUP
0196 * 5 "Copper" "Copper" 1 1 ELE
0197 * 6 "Polyester" "FPix_Cylind_Polyester" 4 1 CAB
0198
0199 # "Volume 5 " "Pix_Fwd_End_Coil_Fiber" 2833 1
0200 * 1 "Polyester" "FPix_Cylind_Polyester" 225 1 CAB
0201 * 2 "Poliax" "FPix_Cylind_POLIAX" 122 1 CAB
0202 * 3 "G10" "FPix_Cylind_G10" 33 1 SUP
0203 * 4 "Noryl" "FPix_Cylind_Noryl" 26 1 SUP
0204 * 5 "PMMA" "FPix_Cylind_PMMA" 10 1 CAB
0205
0206 # "Volume 6 " "Pix_Fwd_Port_Cards" 332 1
0207 * 1 "G10" "FPix_Cylind_G10" 103 1 ELE
0208 * 2 "Copper" "Copper" 11 1 ELE
0209 * 3 "Polyimide (extension cable)" "FPix_Kapton" 33 1 CAB
0210 * 4 "Port card/ CCU connectors" "FPix_Cylind_Polyester" 12 1 CAB
0211 * 5 "Solder" "FPix_TinLeadSolder" 1 1 ELE
0212 * 6 "Resistors" "FPix_Alumina" 2 1 ELE
0213 * 7 "Capacitors" "Barium_Titanate" 1 1 ELE
0214 * 8 "Chips" "Silicon" 1 1 ELE
0215 * 9 "OH parts (mostly G10)" "FPix_Cylind_G10" 27 1 ELE
0216
0217 # "Volume 7: FRONT " "Pix_Fwd_End_Pipe_1" 477 1
0218 * 1 "SnCu" "FPix_Cylind_SnCu" 74 1 CAB
0219 * 2 "C6F14" "FPix_Cylind_C6F14" 214 1 COL
0220 * 3 "Aluminium (cooling tube)" "Aluminium" 81 1 COL
0221 * 4 "Poliax" "FPix_Cylind_POLIAX" 88 1 CAB
0222
0223 # "Volume 8: BACK " "Pix_Fwd_End_Pipe_2" 396 1
0224 * 1 "SnCu" "FPix_Cylind_SnCu" 66 1 CAB
0225 * 2 "C6F14" "FPix_Cylind_C6F14" 170 1 COL
0226 * 3 "Aluminium (cooling tube)" "Aluminium" 82 1 COL
0227 * 4 "Poliax" "FPix_Cylind_POLIAX" 78 1 CAB
0228
0229 # "Volume 9: " "Pix_Fwd_DCDC_Converter" 24.497 1
0230 * 1 "Copper" "Copper" 0.475 1 ELE
0231 * 2 "G10" "FPix_Cylind_G10" 16.454 1 ELE
0232 * 3 "Kapton" "FPix_Kapton" 0.107 1 CAB
0233 * 4 "Polyester" "FPix_Cylind_Polyester" 3.526 1 CAB
0234 * 5 "Solder" "FPix_TinLeadSolder" 0.009 1 ELE
0235 * 6 "Aluminium" "FPix_Alumina" 3.926 1 COL
0236
0237 # "Volume 10: " "Pix_Fwd_Port_Cards_Phase1" 2703 1
0238 * 1 "G10" "FPix_Cylind_G10" 419.09 1 ELE
0239 * 2 "Copper" "Copper" 44.75 1 ELE
0240 * 3 "Polyimide (extension cable)" "FPix_Kapton" 134.29 1 CAB
0241 * 4 "Port card/ CCU connectors" "FPix_Cylind_Polyester" 48.83 1 CAB
0242 * 5 "Solder" "FPix_TinLeadSolder" 4.08 1 ELE
0243 * 6 "Resistors" "FPix_Alumina" 8.11 1 ELE
0244 * 7 "Capacitors" "Barium_Titanate" 4.08 1 ELE
0245 * 8 "Chips" "Silicon" 4.08 1 ELE
0246 * 9 "OH parts (mostly G10)" "FPix_Cylind_G10" 109.85 1 ELE
0247 * 10 "DCDC Copper" "Copper" 15.08 1 ELE
0248 * 11 "DCDC G10" "FPix_Cylind_G10" 521.97 1 ELE
0249 * 12 "DCDC Kapton" "FPix_Kapton" 3.39 1 CAB
0250 * 13 "DCDC Polyester" "FPix_Cylind_Polyester" 111.82 1 CAB
0251 * 14 "DCDC Solder" "FPix_TinLeadSolder" 0.28 1 ELE
0252 * 15 "DCDC Aluminium" "FPix_Alumina" 124.52 1 COL
0253
0254 # "END" "END" 0. 0.
0255 this has to be the last line !
0256
0257
0258
0259
