Warning, /Geometry/TrackerCommonData/data/Materials/tibtid_common.in is written in an unsupported language. File is not indexed.
0001 TIB TID COMMON COMPONENTS
0002 =========================
0003
0004 $$ This includes all the volumes that make up the TIB modules
0005 $$ as well as the electronics on the module string !
0006
0007
0008 Input file for mixture.f
0009 Start new mixtures with a '#' in the first column
0010 Start the components with a '*' in the first column
0011 You can type any kind of comment in as long as you don't start it
0012 with '#' or '*' !
0013 .....................................................................
0014 For mixture declaration: Name of Mixture, Name of GMIX for title file,
0015 Monte Carlo Volume, MC Area
0016 For items in a compound: Item number, Comment, Material (has to be
0017 written exactly as in material.input file),
0018 Volume, Multiplicity, type
0019 Type is one of the following: SUP for support
0020 SEN for sensitive volumes
0021 CAB for cables
0022 COL for cooling
0023 ELE for electronics
0024 .....................................................................
0025
0026
0027 ... EM 18Jun07
0028
0029 ... This file should include materials common to TIB and TID
0030 ... By now only CCUM is actually commonly defined
0031 ... as MCvolume of TIB hybrids are twice those of TID hybrids
0032
0033
0034 o TIB/TID CCUM
0035 ------------
0036
0037 20071014 GSguazzoni
0038
0039 MCVolume: 3.2cm*2.3cm*0.8cm = 5.89cm^3 ~ 6.0cm^3
0040
0041 Composition mostly inferred from TOB
0042 SMD passive components neglected
0043
0044 ......................................................................
0045 # "CCUM" "TIBTID_CCUM" 6.00000 -1.
0046 * 1 "PCB Copper" "Copper" 1.17760 0.090 ELE
0047 * 2 "PCB FR4" "T_FR4" 1.17760 0.910 ELE
0048 * 3 "ASIC CCU Si" "Silicon" 0.01512 1 ELE
0049 * 4 "ASIC CCU SnPbAg" "SMD_metal" 0.01331 1 ELE
0050 * 5 "ASIC CCU EMC" "Epoxy" 0.31905 1 ELE
0051 * 6 "ASIC DCU Si" "Silicon" 0.00140 1 ELE
0052 * 7 "ASIC DCU Cu" "Copper" 0.00255 1 ELE
0053 * 8 "ASIC DCU EMC" "Epoxy" 0.01206 1 ELE
0054 * 9 "ASIC LVDSMux Si" "Silicon" 0.00140 1 ELE
0055 * 10 "ASIC LVDSMux Cu" "Copper" 0.00439 1 ELE
0056 * 11 "ASIC LVDSMux EMC" "Epoxy" 0.02084 1 ELE
0057 * 12 "Connectors case" "Polyethylene" 0.84211 1 ELE
0058 * 13 "Connectors pins" "T_Bronze" 0.06749 1 ELE
0059 ......................................................................
0060 ======================================================================
0061
0062 o TIB/TID DOH
0063 -----------
0064
0065 20071014 GSguazzoni
0066
0067 MCVolume: 0.5*2.2*3.5 cm^3
0068
0069 ......................................................................
0070 # "DOH" "TIBTID_DOH" 3.85000 -1.
0071 * 1 "PCB FR4" "T_FR4" 0.41059 1 ELE
0072 * 2 "PCB Copper traces" "Copper" 0.06384 1 ELE
0073 * 3 "NAIS Conn case" "Polyethylene" 0.14105 1 ELE
0074 * 4 "NAIS Conn pins" "T_Bronze" 0.00940 1 ELE
0075 * 5 "Resistors" "Ceramic" 0.00111 1 ELE
0076 * 6 "Capacitors" "Barium_Titanate" 0.00565 1 ELE
0077 * 7 "ASICs EMC" "Epoxy" 0.04154 1 ELE
0078 * 8 "ASICs Copper" "Copper" 0.00882 1 ELE
0079 * 9 "Laser" "Silicon" 0.02106 2 ELE
0080 * 10 "Optodiodes" "Ceramic" 0.03000 2 ELE
0081 * 11 "Optodiodes" "Brass" 0.01414 2 ELE
0082 * 12 "Fiber holder" "T_FR4" 0.38800 1 ELE
0083 * 13 "Plastic stuff" "Polyethylene" 0.15789 1 ELE
0084 ......................................................................
0085 ======================================================================
0086
0087 o TIB/TID Pitch Adapter and ceramic
0088 ---------------------------------
0089
0090 20071013 GSguazzoni
0091
0092 MCVolume: 1cm*1cm*1.13mm = 0.1130 cm^3
0093
0094 (1) Glass thickness: 550 micron
0095 (2) Ceramic thickness: 380 micron
0096 (3) Glue thickness: 170 micron
0097
0098 Volumes per square centimeter (1130 micron thickness)
0099
0100 ......................................................................
0101 # "PA per cm2" "TIBTID_PA" 0.11300 -1.
0102 * 1 "Glass" "Borosilicate_Glass" 0.05500 1 ELE
0103 * 2 "Ceramic" "Ceramic" 0.03800 1 ELE
0104 * 3 "Glue" "Epoxy" 0.01692 1 ELE
0105 ......................................................................
0106 ======================================================================
0107
0108 o TIB/TID AOH
0109 -----------
0110
0111 20071013 GSguazzoni
0112
0113 MCVolume: 0.5cm*2.3cm*3cm = 3.45 cm^3
0114
0115 (9) Number of laser transmitters is the TIB/TID weighted average
0116 between 2-fibers AOHs and 3-fiber AOHs
0117
0118 ......................................................................
0119 # "AOH" "TIBTID_AOH" 3.45000 -1.
0120 * 1 "PCB FR4" "T_FR4" 0.38224 1 ELE
0121 * 2 "PCB Copper traces" "Copper" 0.05500 1 ELE
0122 * 3 "NAIS Conn case" "Polyethylene" 0.31474 1 ELE
0123 * 4 "NAIS Conn pins" "T_Bronze" 0.02016 1 ELE
0124 * 5 "Resistors" "Ceramic" 0.00320 1 ELE
0125 * 6 "Capacitors" "Barium_Titanate" 0.01528 1 ELE
0126 * 7 "ASICs EMC" "Epoxy" 0.02080 1 ELE
0127 * 8 "ASICs Copper" "Copper" 0.00480 1 ELE
0128 * 9 "Laser" "Silicon" 0.02106 2.6 ELE
0129 * 10 "Plastic stuff" "Polyethylene" 0.15789 1 ELE
0130 ......................................................................
0131 ======================================================================
0132
0133 o TIB/TID Amphenol flat cable (26cond) DOHM<=>MC (CCUM)
0134 -----------------------------------------------------
0135
0136 20071014 GSguazzoni
0137
0138 MCVolume: 0.12 cm^3 ~ 0.1 cm^3
0139
0140 Volumes per cm
0141
0142 ......................................................................
0143 # "Amphenol cable 26cond per cm" "TIBTID_AmphCable" 0.10000 -1.
0144 * 1 "Conductors" "Copper" 0.00050 26 CAB
0145 * 2 "Insulation" "Polyethylene" 0.00191 26 CAB
0146 * 3 "Sheath" "Polyethylene" 0.04368 1 CAB
0147 ......................................................................
0148 ======================================================================
0149
0150 o Hybrid Board
0151 ------------
0152
0153 Total weight from measurement.
0154 Assume that for the TIB/TID most of the hybrids are the the type w/o the 25 um Kapton
0155 stiffner midplane
0156 For the thickness assume the nominal values described in
0157
0158 http://www.fynu.ucl.ac.be/he/cms/activities/tracker/FHITfiles/CCTPHybrides.pdf
0159
0160 and tune the thickness of the top layer (Cu-traces) to match the measured weight
0161
0162 Thickness of the layers given from top to bottom
0163
0164 (1) Cu 2+18+18+30 um
0165 For the top layer: 2 um/30 um -> 7% occupancy
0166 (2) Kapton 25+25 um
0167 (3) Glue 75+50 um
0168 (4) Ceramic 380 um
0169
0170 Values for 1 cm2 area
0171 MCVolume: (1*.0623) = 0.0623 cm^3
0172
0173 .................................................................
0174 # "TIB TID Hybrid Board" "TIBTID_HybridBoard" 0.0623 -1.
0175 * 1 "Hybrid Copper traces" "Copper" 0.0068 1 ELE
0176 * 2 "Hybrid Kapton layers" "T_Kapton" 0.0050 1 ELE
0177 * 3 "Glue" "Silicone_Gel" 0.0125 1 ELE
0178 * 4 "Ceramic" "Ceramic" 0.0380 1 ELE
0179 .......................................................................
0180 =======================================================================
0181
0182 o Hybrid Tails
0183 ------------
0184
0185 Total weight from measurement.
0186 Thickness of the layers from top to bottom
0187
0188 For the thickness assume the nominal values described in
0189
0190 http://www.fynu.ucl.ac.be/he/cms/activities/tracker/FHITfiles/CCTPHybrides.pdf
0191
0192
0193 (1) Cu 2+9 um
0194 Top layer: same thickness as in the hybrid board
0195 2nd layer: assume 50% of surface occupancy
0196 (2) Kapton 25+25+25 um
0197 Assume Kapton as Coverlay
0198 (3) Glue 25+75 um
0199
0200 Values for 1 cm2 area
0201 MCVolume: (1*.0186) = 0.0186 cm^3
0202
0203 .................................................................
0204 # "TIB TID Hybrid Tails" "TIBTID_HybridTails" 0.0186 -1.
0205 * 1 "Hybrid Copper traces" "Copper" 0.0011 1 CAB
0206 * 2 "Hybrid Kapton layers" "T_Kapton" 0.0075 1 CAB
0207 * 3 "Glue" "Silicone_Gel" 0.0100 1 CAB
0208 .......................................................................
0209 =======================================================================
0210
0211 o Hybrid
0212 ------
0213
0214 MCVolume: 47 (width) * 25.3 (height) * 1.130 (thickness) = 1343.7 mm^3
0215 Same PV for TIB and TID
0216
0217 We use avearge values for 4/6 APV modules in the TIB+TID
0218 4APVs modules: 1188 (TIB) + 240 (TID)
0219 6APVs modules: 1536 (TIB) + 576 (TID)
0220 Average number of APVs: n_APV = 5.2 per module
0221
0222 (1) Hybrid board
0223 Wedge shaped piece. Surface = 11.02 cm^2 (rounded to 11 cm^2 below)
0224 The ceramic extension in rPhi modules is accounted in the PitchAdapter material
0225
0226
0227 (2-11) Hybrid components (from tec_module.in and tob_module.in)
0228 APV25: 7.1 x 8.1 x 0.3 mm^3 n_APV per hybrid
0229 PLL: 4.0 x 4.0 x 0.3 mm^3 = 4.8 mm^3 = 0.0048 cm^3 1 per hybrid REVIEWED November 2006 OK
0230 (see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/PauloMoreira/PLL25%20User%20Manua2.1.pdf)
0231 MUX: 5.0 x 5.0 x 0.3 mm^3 = 7.5 mm^3 = 0.0075 cm^3 1 per hybrid REVIEWED November 2006 OK
0232 (see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/LVDSMUX3_datasheet.pdf)
0233 DCU : 2.0 x 2.0 x 0.3 mm^3 = 1.2 mm^3 = 0.0012 cm^3 1 per hybrid REVIEWED November 2006 OK
0234 (see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/Magazzu/DCUF_User_Manual_v3.0.pdf)
0235 R: 0402 size material: carbon 14 + n_APV -> 19.2 per hybrid
0236 C: 1206 size 2 2 per hybrid
0237 0402 size 5 + 2*n_APV -> 15.4 per hybrid
0238
0239 0402: 1 x 0.5 x 0.5 mm^3
0240 1206: 3 x 1.5 x 1.5 mm^3
0241
0242
0243 .................................................................
0244 # "TIB TID Hybrid" "TIBTID_Hybrid" 1.3437 -1.
0245 * 1 "Hybrid Board" "TIBTID_HybridBoard" 0.0623 11 ELE
0246 * 2 "APV25" "Silicon" 17.253E-3 5.2 ELE
0247 * 3 "PLL" "Silicon" 4.8E-3 1 ELE
0248 * 4 "MUX" "Silicon" 7.5E-3 1 ELE
0249 * 5 "DCU" "Silicon" 1.2E-3 1 ELE
0250 * 6 "Resistors" "Carbon" 2.5E-4 19.2 ELE
0251 * 7 "R metal" "SMD_metal" 1.E-4 19.2 ELE
0252 * 8 "Small caps" "Alumina" 2.5E-4 15.4 ELE
0253 * 9 "C metal" "SMD_metal" 1.E-4 15.4 ELE
0254 * 10 "Large caps" "Alumina" 0.00675 2 ELE
0255 * 11 "C metal large" "SMD_metal" 1.E-3 2 ELE
0256 .......................................................................
0257 =======================================================================
0258
0259 # "END" "END" 0. 0.
0260 this has to be the last line !
