Warning, /Geometry/TrackerCommonData/data/Materials/tid_struc.in is written in an unsupported language. File is not indexed.
0001 TID Structure (anything but modules)
0002 ====================================
0003 Input file for mixture.f
0004 Start new mixtures with a '#' in the first column
0005 Start the components with a '*' in the first column
0006 You can type any kind of comment in as long as you don't start it
0007 with '#' or '*' !
0008 .....................................................................
0009 For mixture declaration: Name of Mixture, Name of GMIX for title file,
0010 Monte Carlo Volume, MC Area
0011 For items in a compound: Item number, Comment, Material (has to be
0012 written exactly as in material.input file),
0013 Volume, Multiplicity, Type
0014 Type is one of the following: SUP for support
0015 SEN for sensitive volumes
0016 CAB for cables
0017 COL for cooling
0018 ELE for electronics
0019 .....................................................................
0020
0021 o TID support disks
0022
0023 -----------------
0024
0025 These are the disks that hold the sensor rings. They are 8 mm thick,
0026 Nomex core of 7 mm and 0.5 mm CF skin each side
0027
0028 20071019 EM
0029
0030 [WAS: "TID_Nomex" -> "Nomex" ]
0031
0032 20080125 EM
0033
0034 Add fixation inserts.
0035
0036 Values for 1 ring:
0037
0038 - Inserts for "distanziali": inner 4+4
0039 outer 5+5
0040 Each insert: Al 0.92 g (measured)
0041 Epoxy 1.07 g (from drawings and assuming a 0.15 mm clearance on the hole diameter)
0042
0043 - Inserts for DOHMs : 4x2 (from drawings)
0044 Inserts for Mother Cables : 8x8 (guess...)
0045
0046 Each insert: Al 0.16 g values obtained scaling those for "module inserts" times the ratio of the volumes (about 1/3)
0047 Epoxy 0.16 g
0048
0049
0050 Total per ring: Al 0.92 x 18 + 0.16 x (8+64) = 28 g -> volume per ring V_al = 10.37 cm^3
0051 Epoxy 1.07 x 18 + 0.16 x (8+64) = 31 g -> volume per ring V_epoxy = 23.85 cm^3
0052
0053
0054 MCVolume: 1.0x1.0x0.8 cm^3
0055
0056 XML surface of 1 ring: pi*(50.9**2-22.5**2)= 6549 cm^2
0057
0058 Al 10.37/6549 * 1/0.8 = 1.98E-3 cm^3 per MCVolume
0059 Epoxy 23.85/6549 * 1/0.8 = 4.55E-3 cm^3 per MCVolume
0060
0061 MCVolume w/o the inserts: 0.800-(0.0020+0.0045)=0.7935 cm^3
0062
0063 Nomex and CF skins rescaled according to their thickness (0.7 cm and 0.1 cm)
0064
0065 Nomex = 7/8 * 0.7395 = 0.6943 cm^3 per MCVolume
0066 CF = 1/8 * 0.7395 = 0.0992 cm^3 per MCVolume
0067
0068 Numbers per unit area
0069 .....................................................................
0070 # "TID support disk" "TID_Mech" 0.8 -1.
0071 * 1 "Nomex core" "Nomex" 694.3E-3 1 SUP
0072 * 2 "CF skins" "Carbon fibre str." 99.2E-3 1 SUP
0073 * 3 "Inserts (Al)" "Aluminium" 2.0E-3 1 SUP
0074 * 4 "Inserts (Glue)" "Epoxy" 4.5E-3 1 SUP
0075 ....................................................................
0076 =====================================================================
0077
0078 o Cooling pipes per cm (circular section)
0079 --------------------
0080
0081 20070919 EM
0082
0083 [WAS: mixture name="TID_Cool_ring"]
0084
0085 MC Volume: OD = 0.35 cm, dz = 1 cm => 0.0962 cm^3
0086
0087 (1) Cooling pipes: material Al 3.5 mm OD, 2.8 mm ID [WAS: 3mm OD, 2.7 mm ID]
0088 (2) Coolant: C6F14_F2_-30C
0089
0090 Volumes per cm
0091 .....................................................................
0092 # "TID Cooling Pipe per cm" "TID_CoolPipe" 0.0962 -1.
0093 * 1 "Al pipe" "Aluminium" 0.0346 1 COL
0094 * 2 "Coolant" "C6F14_F2_-30C" 0.0616 1 COL
0095 .....................................................................
0096 =====================================================================
0097
0098 o Cooling manifolds
0099 -----------------
0100 There are two of these per ring.
0101
0102
0103 20070924 EM
0104
0105 MC Volume: Value per 1 cm length
0106 1.0 x 0.8 x 1.0 cm^3 = 0.80 cm^3
0107 [WAS: r = 46-49 cm, dz = 0.7 cm, dphi = 18.5 deg ==> 32.2 cm^3]
0108
0109
0110 (2) Coolant : 0.6 x 0.8 x 1.0 = 0.48 cm^3
0111
0112 [WAS: 14 x 3 x 1.5 cm ==> 63 cm^3]
0113
0114 (1) Aluminium walls: 0.2 cm thick -> V_Al = 0.80 - 0.48 = 0.32 cm^3
0115
0116 [WAS: (0.05 cm thick): (16 x 1.6 x 0.05) x 2.5
0117 + 15 x 3 x 0.05 ==> 5.45 cm^3]
0118
0119 ......................................................................
0120 # "TID cooling manifolds per cm" "TID_CoolManifold" 0.80 -1.
0121 * 1 "Aluminium walls" "Aluminium" 0.32 1 COL
0122 * 2 "Coolant" "C6F14_F2_-30C" 0.48 1 COL
0123 ......................................................................
0124 ======================================================================
0125
0126 o TID support disk fixation
0127 -------------------------
0128
0129 20070926 EM
0130
0131 The central disk/wheel (carrying ring 1) is fixed with Aluminium
0132 fixations to the service cylinder in 3 points
0133
0134 MC Volume: 10.46 cm^3
0135 [WAS: r = 46.2 - 51.2 cm, dz = 0.7 cm, dphi = 6.25 ==> 18.6 cm^3]
0136
0137 Material: "L" shaped CF piece with inserts in Aluminium.
0138 Values estimated from sketch from M.Massa
0139
0140 (1) Carbon fiber structure: 22 g (V=13 cm^3)
0141 (2) Aluminium inserts: 30 g (V=11 cm^3)
0142
0143 [WAS: Aluminium, approx. volume: 5*4*0.4 (in wheel) +
0144 5*4*0.4 + 3.6*4*0.4 (on cyl.)
0145 ==> 21.76 cm^3]
0146 .......................................................................
0147 # "TID wheel fixations" "TID_WheelFixation" 10.46 -1
0148 * 1 "CF L-shaped piece" "Carbon fibre str." 13.1 1 SUP
0149 * 2 "Aluminium inserts" "Aluminium" 11.0 1 SUP
0150 .......................................................................
0151 =======================================================================
0152
0153
0154 o TID ICB1
0155 --------
0156
0157 1) Kapton:
0158
0159 2) Copper:
0160
0161 3) LVDSBUFF: 7 (r1a) + 6 (r1b) I.C. 8 pin SOIC 4x5x1.5 mm3
0162
0163 4) Connectors:
0164
0165
0166 ... but it is better to calculate the fraction of plastic/bronze per connector
0167 Module HV 6 x SAMTEC CLP-105 10 pin 0.041 g Plastic, 0.046 g Bronze = 0.246 g Plastic + 0.276 g Bronze
0168 Module LV 6 x SAMTEC CLP-110 20 pin 0.081 g Plastic, 0.092 g Bronze = 0.486 g Plastic + 0.552 g Bronze
0169 CCU socket 2 x SAMTEC 20 pin [0.56 g, 65% Plastic + 35% Bronze] 0.364 g Plastic, 0.196 g Bronze = 0.728 g Plastic + 0.392 g Bronze
0170 To DOHM 1 x ERNI 054595-26 26 pin [missing info on material] 0.273 g Plastic, 0.100 g Bronze = 0.273 g Plastic + 0.100 g Bronze
0171 MC LV 1 x MOLEX 87438-0432 3 pin missing info 0.105 g Bronze ??
0172 MC HV 1 x MOLEX 87438-1532 15 pin missing info 0.524 g Bronze ??
0173
0174 TOTAL Plastic: 1.733 g => 1.240 cm3 Kapton x2 (r1a+r1b)
0175 TOTAL Bronze: 1.320 g => 0.149 cm3 Bronze x2 (r1a+r1b)
0176
0177 6) Resistors: 13 (r1a) + 11 (r1b) x size 0805 [2x1.25x0.45 mm3, 4.8 mg] Volume=1.125E-3 cm3
0178
0179 7-8) Capacitors: 13 (r1a) + 12 (r1b) x size 0805 [2x1.25x0.94 mm3, 16.8 mg] Volume=2.35E-3 cm3
0180 Use values from Magazzu's page: Ni 0.7mg / BaTiO3 15.8 mg
0181
0182 9-10) Capacitors: 2 (r1a)0 + 2 (r1b) x size 1812 [4.5x3.2x2.5 mm3, 257 mg] Volume=36E-3 cm3
0183 Use values from Magazzu's page: Ni 89.5mg / BaTiO3 166.4 mg
0184
0185 Values for R1A+R1B (180 deg sector)
0186
0187 ......................................................................
0188 # "TID MotherCable R1" "TID_ICB1" 45.250 -1
0189 * 1 "Kapton" "T_Kapton" 17.131 2 ELE
0190 * 2 "Cu traces" "Copper" 2.455 2 ELE
0191 * 3 "IC Chips" "T_Kapton" 0.030 13 ELE
0192 * 4 "Connector" "T_Kapton" 1.240 2 ELE
0193 * 5 "Connector pins" "T_Bronze" 0.149 2 ELE
0194 * 6 "Resistors (0805)" "Ceramic" 1.125E-3 24 ELE
0195 * 7 "Capacitors (0805)" "Barium_Titanate" 1.86E-3 25 ELE
0196 * 8 "Capacitors (0805)" "Nickel" 0.54E-3 25 ELE
0197 * 9 "Capacitors (1812)" "Barium_Titanate" 27.6E-3 4 ELE
0198 * 10 "Capacitors (1812)" "Nickel" 10.1E-3 4 ELE
0199 ......................................................................
0200 ======================================================================
0201
0202 o TID ICB2
0203 --------
0204
0205 1) Kapton:
0206
0207 2) Copper:
0208
0209 3) LVDSBUFF: 7 (r2) + 7 (r2) I.C. 8 pin SOIC 4x5x1.5 mm3
0210
0211 4) Connectors:
0212
0213
0214 ... but it is better to calculate the fraction of plastic/bronze per connector
0215 Module HV 6 x SAMTEC CLP-105 10 pin 0.041 g Plastic, 0.046 g Bronze = 0.246 g Plastic + 0.276 g Bronze
0216 Module LV 6 x SAMTEC CLP-110 20 pin 0.081 g Plastic, 0.092 g Bronze = 0.486 g Plastic + 0.552 g Bronze
0217 CCU socket 2 x SAMTEC 20 pin [0.56 g, 65% Plastic + 35% Bronze] 0.364 g Plastic, 0.196 g Bronze = 0.728 g Plastic + 0.392 g Bronze
0218 To DOHM 1 x ERNI 054595-26 26 pin [missing info on material] 0.273 g Plastic, 0.100 g Bronze = 0.273 g Plastic + 0.100 g Bronze
0219 MC LV 1 x MOLEX 87438-0432 3 pin missing info 0.105 g Bronze ??
0220 MC HV 1 x MOLEX 87438-1532 15 pin missing info 0.524 g Bronze ??
0221
0222 TOTAL Plastic: 1.733 g => 1.240 cm3 Kapton x2 (r2+r2)
0223 TOTAL Bronze: 1.320 g => 0.149 cm3 Bronze x2 (r2+r2)
0224
0225 6) Resistors: 13 (r2) + 13 (r2) x size 0805 [2x1.25x0.45 mm3, 4.8 mg] Volume=1.125E-3 cm3
0226
0227 7-8) Capacitors: 13 (r2) + 13 (r2) x size 0805 [2x1.25x0.94 mm3, 16.8 mg] Volume=2.35E-3 cm3
0228 Use values from Magazzu's page: Ni 0.7mg / BaTiO3 15.8 mg
0229
0230 9-10) Capacitors: 2 (r2)0 + 2 (r2) x size 1812 [4.5x3.2x2.5 mm3, 257 mg] Volume=36E-3 cm3
0231 Use values from Magazzu's page: Ni 89.5mg / BaTiO3 166.4 mg
0232
0233 Values for R2+R2 (180 deg sector)
0234
0235 ......................................................................
0236 # "TID MotherCable R2" "TID_ICB2" 49.073 -1
0237 * 1 "Kapton" "T_Kapton" 18.391 2 ELE
0238 * 2 "Cu traces" "Copper" 2.636 2 ELE
0239 * 3 "IC Chips" "T_Kapton" 0.030 14 ELE
0240 * 4 "Connector" "T_Kapton" 1.240 2 ELE
0241 * 5 "Connector pins" "T_Bronze" 0.149 2 ELE
0242 * 6 "Resistors (0805)" "Ceramic" 1.125E-3 26 ELE
0243 * 7 "Capacitors (0805)" "Barium_Titanate" 1.86E-3 26 ELE
0244 * 8 "Capacitors (0805)" "Nickel" 0.54E-3 26 ELE
0245 * 9 "Capacitors (1812)" "Barium_Titanate" 27.6E-3 4 ELE
0246 * 10 "Capacitors (1812)" "Nickel" 10.1E-3 4 ELE
0247 ......................................................................
0248
0249 ======================================================================
0250
0251 o TID ICB3
0252 --------
0253
0254 1) Kapton:
0255
0256 2) Copper:
0257
0258 3) LVDSBUFF: 5 (r3a) + 6 (r3b) I.C. 8 pin SOIC 4x5x1.5 mm3
0259
0260 4) Connectors:
0261
0262 ... but it is better to calculate the fraction of plastic/bronze per connector
0263 Module HV 5 x SAMTEC CLP-105 10 pin 0.041 g Plastic, 0.046 g Bronze = 0.205 g Plastic + 0.230 g Bronze
0264 Module LV 5 x SAMTEC CLP-110 20 pin 0.081 g Plastic, 0.092 g Bronze = 0.405 g Plastic + 0.460 g Bronze
0265 CCU socket 2 x SAMTEC 20 pin [0.56 g, 65% Plastic + 35% Bronze] 0.364 g Plastic, 0.196 g Bronze = 0.728 g Plastic + 0.392 g Bronze
0266 To DOHM 1 x ERNI 054595-26 26 pin [missing info on material] 0.273 g Plastic, 0.100 g Bronze = 0.273 g Plastic + 0.100 g Bronze
0267 MC LV 1 x MOLEX 87438-0432 3 pin missing info 0.105 g Bronze ??
0268 MC HV 1 x MOLEX 87438-1532 15 pin missing info 0.524 g Bronze ??
0269
0270 TOTAL Plastic: 1.611 g => 1.153 cm3 Kapton
0271 TOTAL Bronze: 1.182 g => 0.133 cm3 Bronze
0272
0273 6) Resistors: 10 (r3a) + 11 (r3b) x size 0805 [2x1.25x0.45 mm3, 4.8 mg] Volume=1.125E-3 cm3
0274
0275 7-8) Capacitors: 15 (r3a) + 16 (r3b) x size 0805 [2x1.25x0.94 mm3, 16.8 mg] Volume=2.35E-3 cm3
0276 Use values from Magazzu's page: Ni 0.7mg / BaTiO3 15.8 mg
0277
0278 9-10) Capacitors: 1 (r3a) + 1 (r3b) x size 1812 [4.5x3.2x2.5 mm3, 257 mg] Volume=36E-3 cm3
0279 Use values from Magazzu's page: Ni 89.5mg / BaTiO3 166.4 mg
0280
0281 Values for R3A+R3B (180 deg sector)
0282
0283 ......................................................................
0284 # "TID MotherCable R3" "TID_ICB3" 44.146 -1
0285 * 1 "Kapton" "T_Kapton" 21.998 2 ELE
0286 * 2 "Cu traces" "Copper" 3.152 2 ELE
0287 * 3 "IC Chips" "T_Kapton" 0.030 11 ELE
0288 * 4 "Connector" "T_Kapton" 1.153 2 ELE
0289 * 5 "Connector pins" "T_Bronze" 0.133 2 ELE
0290 * 6 "Resistors (0805)" "Ceramic" 1.125E-3 21 ELE
0291 * 7 "Capacitors (0805)" "Barium_Titanate" 1.86E-3 31 ELE
0292 * 8 "Capacitors (0805)" "Nickel" 0.54E-3 31 ELE
0293 * 9 "Capacitors (1812)" "Barium_Titanate" 27.6E-3 2 ELE
0294 * 10 "Capacitors (1812)" "Nickel" 10.1E-3 2 ELE
0295 ......................................................................
0296
0297 ======================================================================
0298
0299 o TID DOHM (Ring1/Ring2)
0300 ----------------------
0301
0302 MC Volume (18 deg wedge): 1/2 x (18*deg2rad) x (50.5**2-44.5**2) x 0.22 cm (19.698 cm3)
0303
0304 Contains:
0305 1) DOHM PRIM Board: MC Volume - V_traces
0306
0307 2) traces: Cu Area Thickness Volume [mm3]
0308 Top sq.in = 958.0 mm2 35 um 33.53
0309 GND sq.in = 8953.6 mm2 35 um 313.38
0310 SIG1 sq.in = 385.0 mm2 35 um 13.48
0311 SIG2 sq.in = 993.8 mm2 35 um 34.78
0312 PWR sq.in = 8953.6 mm2 35 um 313.38
0313 Bot sq.in = 698.4 mm2 35 um 24.44
0314 TOTAL VOLUME = 732.99 mm3
0315
0316 Missing infos:
0317 - for GND and PWR layers assume 100% filled area
0318 - for the remaining layers assume the same fraction of surface coverd by traces as in the TIB DOHMs
0319
0320 3) LVDSBUFF: 6 I.C. 8 pin SOIC 4x5x1.5 mm3
0321
0322 4-5) Connectors:
0323
0324 ... but it is better to calculate the fraction of plastic/bronze per connector
0325 To MC 4 x ERNI 26 pin [missing info on material] 0.273 g Plastic, 0.1001 g Bronze = 1.092 g Plastic + 0.4004 g Bronze (actually 2 par + 2 perp)
0326 PTC 1 x ERNI 12 pin [missing info on material] 0.126 g Plastic, 0.0462 g Bronze = 0.126 g Plastic + 0.0462 g Bronze
0327 CCU socket 2 x SAMTEC 20 pin [0.56 g, 65% Plastic + 35% Bronze] 0.364 g Plastic, 0.196 g Bronze = 0.728 g Plastic + 0.392 g Bronze
0328 DOH 2 x NAIS 26 PIN 0.129 g Plastic, 0.075 g Bronze = 0.258 g Plastic + 0.150 g Bronze (actually Cu)
0329 PWR 1 x MOLEX 20 pin [measured] 1.72 g Plastic, 1.24 g Bronze = 1.72 g Plastic + 1.24 g Bronze
0330 [WAS: missing info on material 0.210 g Plastic, 0.077 g Bronze = 0.210 g Plastic + 0.077 g Bronze]
0331
0332
0333 TOTAL Plastic: 4.134 g => 2.953 cm3 Kapton [20080118 EM WAS: Plastic: 3.924 g => 2.807 cm3 Kapton]
0334 [WAS: Plastic: 2.414 g => 1.727 cm3 Kapton]
0335 TOTAL Bronze: 2.306 g => 0.259 cm3 Bronze [20080118 EM WAS: Bronze: 2.229 g => 0.251 cm3 Bronze]
0336 [WAS: Bronze: 1.066 g => 0.120 cm3 Bronze]
0337
0338
0339 6) Resistors: 14 x size 0805 [2x1.25x0.45 mm3, 4.8 mg] Volume=1.125E-3 cm3
0340
0341 7-8) Capacitors: 18 x size 0805 [2x1.25x0.94 mm3, 16.8 mg] Volume=2.35E-3 cm3
0342 Use values from Magazzu's page: Ni 0.7mg / BaTiO3 15.8 mg
0343
0344 9-10) Capacitors: 1 x size 1210 [3.2x2.5x1.5 mm3, 93.6 mg] Volume=12E-3 cm3
0345 Use values from Magazzu's page: Ni 4.6mg / BaTiO3 88.1 mg
0346
0347 11) CCU from tibtid_common.in: volume = 6.0 cm3, material = "TIBTID_CCUM"
0348 [WAS: from tibtid_common.in: volume = 4.949 cm3, material = "TIBTID_CCUM"]
0349
0350 12-18) Optohybrid (two copies per primary DOHM, taken from tib_module.in TIB_ICC1 and TIB_ICC2)
0351 FR4 22 x 30 mm, 400 um
0352 Cu: 35 um, 2 layer with 50 % occ, 2 layers with 30 % occ
0353 Capacitors (0603) 1.6 x .8 x .9 mm
0354 Resistors (0603) 1.6 x .8 x .9 mm
0355 Laser diode: 0.02 cm^3 Si (1 for 2 APVs)
0356 Laser driver: 0.0025 cm^3 Si (1 for 3 APVs ??)
0357 Fiber clamps: 1.4 x 0.3 x 0.15 cm Kapton
0358
0359 .......................................................................
0360 # "TID DOHM Ring0/1 Board" "TID_DOHM1" 19.698 -1.
0361 * 1 "DOHM PRIM Board" "T_FR4" 18.965 1 ELE
0362 * 2 "Copper traces" "Copper" 0.733 1 ELE
0363 * 3 "IC Chips" "T_Kapton" 0.030 6 ELE
0364 * 4 "Connector cases" "T_Kapton" 2.953 1 ELE
0365 * 5 "Connector pins" "T_Bronze" 0.259 1 ELE
0366 * 6 "Resistors (0805)" "Ceramic" 1.125E-3 14 ELE
0367 * 7 "Capacitors (0805)" "Barium_Titanate" 1.86E-3 18 ELE
0368 * 8 "Capacitors (0805)" "Nickel" 0.54E-3 18 ELE
0369 * 9 "Capacitors (1210)" "Barium_Titanate" 7.2E-3 1 ELE
0370 * 10 "Capacitors (1210)" "Nickel" 4.8E-3 1 ELE
0371 * 11 "CCU" "TIBTID_CCUM" 6.000 1 ELE
0372 * 12 "Optohybrid Substrate" "T_FR4" 0.264 2 ELE
0373 * 13 "Optohybrid copper" "Copper" 0.037 2 ELE
0374 * 14 "OH capacitors (0603)" "Alumina" 1.15E-3 34 ELE
0375 * 15 "OH resistors (0603)" "Carbon" 1.15E-3 16 ELE
0376 * 16 "OH C/R solder" "SMD_metal" 2.E-4 50 ELE
0377 * 17 "OH Laser diode" "Silicon" 0.02 6 ELE
0378 * 18 "OH Laser driver" "Silicon" 0.0025 4 ELE
0379 * 19 "OH fiber clamp" "T_Kapton" 0.063 2 ELE
0380 .......................................................................
0381 =======================================================================
0382
0383
0384 o TID DOHM (Ring3)
0385 ----------------
0386
0387 MC Volume (55 deg wedge ext+37 deg wedge int): 1/2 x (55*deg2rad) x (29.5**2-26.5**2) x 0.22 cm 80.6342 cm2 )
0388 1/2 x (37*deg2rad) x (26.5**2-22.8**2) x 0.22 cm 58.8976 cm2 )
0389
0390 Contains (same component as DOHM Ring1/Ring2):
0391 1) DOHM PRIM Board: FR4 (27.508x5.207+1.003x3.607) cm2 Area=22.2 sq.in. ==> 28.5 cm x 5.0 cm thickness=0.22 cm
0392
0393 2) traces: Cu Area Thickness Volume [mm3]
0394 Top sq.in = 1493.0 mm2 35 um
0395 GND sq.in = 13953.2 mm2 35 um
0396 SIG1 sq.in = 600.0 mm2 35 um
0397 SIG2 sq.in = 1534.9 mm2 35 um
0398 PWR sq.in = 13953.2 mm2 35 um
0399 Bot sq.in = 1088.3 mm2 35 um
0400 TOTAL VOLUME = 1141.79 mm3
0401
0402 Missing infos:
0403 - for GND and PWR layers assume 100% filled area
0404 - for the remaining layers assume the same fraction of surface coverd by traces as in the TIB DOHMs
0405
0406 3) LVDSBUFF: 6 I.C. 8 pin SOIC 4x5x1.5 mm3
0407
0408 4-5) Connectors:
0409
0410 ... but it is better to calculate the fraction of plastic/bronze per connector
0411 To MC 4 x ERNI 26 pin [missing info on material] 0.273 g Plastic, 0.1001 g Bronze = 1.092 g Plastic + 0.4004 g Bronze (actually 2 par + 2 perp)
0412 PTC 1 x ERNI 12 pin [missing info on material] 0.126 g Plastic, 0.0462 g Bronze = 0.126 g Plastic + 0.0462 g Bronze
0413 CCU 2 x SAMTEC 20 pin [0.56 g, 65% Plastic + 35% Bronze] 0.364 g Plastic, 0.196 g Bronze = 0.728 g Plastic + 0.392 g Bronze
0414 DOHs 2 x NAIS 26 PIN 0.129 g Plastic, 0.075 g Bronze = 0.258 g Plastic + 0.150 g Bronze (actually Cu)
0415 PWR 1 x MOLEX 20 pin [measured] 1.72 g Plastic, 1.24 g Bronze = 1.72 g Plastic + 1.24 g Bronze
0416 [WAS: missing info on material 0.210 g Plastic, 0.077 g Bronze = 0.210 g Plastic + 0.077 g Bronze]
0417
0418 TOTAL Plastic: 4.134 g => 2.953 cm3 Kapton [20080118 EM WAS: Plastic: 3.924 g => 2.807 cm3 Kapton]
0419 [WAS: Plastic: 2.414 g => 1.727 cm3 Kapton]
0420 TOTAL Bronze: 2.306 g => 0.259 cm3 Bronze [20080118 EM WAS: Bronze: 2.229 g => 0.251 cm3 Bronze]
0421 [WAS: Bronze: 1.066 g => 0.120 cm3 Bronze]
0422
0423 6) Resistors: 14 x size 0805 [2x1.25x0.45 mm3, 4.8 mg] Volume=1.125E-3 cm3
0424
0425 7-8) Capacitors: 18 x size 0805 [2x1.25x0.94 mm3, 16.8 mg] Volume=2.35E-3 cm3
0426 Use values from Magazzu's page: Ni 0.7mg / BaTiO3 15.8 mg
0427
0428 9-10) Capacitors: 1 x size 1210 [3.2x2.5x1.5 mm3, 93.6 mg] Volume=12E-3 cm3
0429 Use values from Magazzu's page: Ni 4.6mg / BaTiO3 88.1 mg
0430
0431 11) CCU from tibtid_common.in: volume = 6.0 cm3, material = "TIBTID_CCUM"]
0432 [WAS: from tibtid_common.in: volume = 4.949 cm3, material = "TIBTID_CCUM"]
0433
0434 12-17) Optohybrid (two copies per primary DOHM, taken from tib_module.in TIB_ICC1 and TIB_ICC2)
0435 FR4 22 x 30 mm, 400 um
0436 Cu: 35 um, 2 layer with 50 % occ, 2 layers with 30 % occ
0437 Capacitors (0603) 1.6 x .8 x .9 mm
0438 Resistors (0603) 1.6 x .8 x .9 mm
0439 Laser diode: 0.02 cm^3 Si (1 for 2 APVs)
0440 Laser driver: 0.0025 cm^3 Si (1 for 3 APVs ??)
0441 Fiber clamps: 1.4 x 0.3 x 0.15 cm Kapton
0442
0443 .......................................................................
0444 # "TID DOHM Ring2 Board" "TID_DOHM2" 30.697 -1
0445 * 1 "DOHM PRIM Board" "T_FR4" 29.555 1 ELE
0446 * 2 "Copper traces" "Copper" 1.142 1 ELE
0447 * 3 "IC Chips" "T_Kapton" 0.030 6 ELE
0448 * 4 "Connector cases" "T_Kapton" 2.953 1 ELE
0449 * 5 "Connector pins" "T_Bronze" 0.259 1 ELE
0450 * 6 "Resistors (0805)" "Ceramic" 1.125E-3 14 ELE
0451 * 7 "Capacitors (0805)" "Barium_Titanate" 1.86E-3 18 ELE
0452 * 8 "Capacitors (0805)" "Nickel" 0.54E-3 18 ELE
0453 * 9 "Capacitors (1210)" "Barium_Titanate" 7.2E-3 1 ELE
0454 * 10 "Capacitors (1210)" "Nickel" 4.8E-3 1 ELE
0455 * 11 "CCU" "TIBTID_CCUM" 6.000 1 ELE
0456 * 12 "Optohybrid Substrate" "T_FR4" 0.264 2 ELE
0457 * 13 "Optohybrid copper" "Copper" 0.037 2 ELE
0458 * 14 "OH capacitors (0603)" "Alumina" 1.15E-3 34 ELE
0459 * 15 "OH resistors (0603)" "Carbon" 1.15E-3 16 ELE
0460 * 16 "OH C/R solder" "SMD_metal" 2.E-4 50 ELE
0461 * 17 "OH Laser diode" "Silicon" 0.02 6 ELE
0462 * 18 "OH Laser driver" "Silicon" 0.0025 4 ELE
0463 * 19 "OH fiber clamp" "T_Kapton" 0.063 2 ELE
0464 .......................................................................
0465 =======================================================================
0466
0467
0468 o TID LAYER OF FIBER PIGTAILS
0469 ---------------------------
0470
0471 The logical volumes for the fiber pigtails just sit on top of those
0472 for the MotherCables arcs (ie. not the ICBTails).
0473
0474 (1) Fiber pigtails
0475 Total length of MotherC on 1 disk/front = 2*pi*(40.3+47.3+33.4) = 760 cm
0476 Total length of fiber pigtails on 1 disk/front = 0.5*(5760+6520+5000) = 8640 cm
0477
0478 -> 11.38 cm of pigtails per 1 cm of MC
0479
0480 MC width = 2.5 cm
0481
0482 20080118 EM
0483
0484 (2) Add the kapton "dime" used to hold fibers in position
0485 Measured surface density of the kapton holders: 0.058 g/cm^2
0486 Per 1 cm of MC: M(kapton)= 1 x 2.5 cm^2 x 0.058 g/cm^2 = 0.045 g
0487 V(kapton)=M(kapton)/rho(kapton)=0.045/1.4=3.2E-2 cm^3
0488
0489 MCVolume = 1.0 x 2.5 x 0.05 cm^3 = 0.125 cm^3
0490
0491 .......................................................................
0492 # "TID fiber layer" "TID_FiberLayer " 0.125 -1
0493 * 1 "Fiber pigtails" "T_FiberPigtail" 0.7854E-2 11.38 CAB
0494 * 2 "Dime kapton" "T_Kapton" 3.201E-2 1 CAB
0495 .......................................................................
0496 =======================================================================
0497
0498 o TID INSERTS FOR FIXATION OF THE MODULES
0499 ---------------------------------------
0500
0501 20080125 EM
0502
0503 MCVolume = 8.0*pi*(5.15**2 - 1.60**2)=602 mm^3
0504
0505 (1) Al insert: material Aluminium
0506 Volumes matched those from drawings 187 mm^3
0507 mass: computed 0.51 g
0508 (2) Glue (Epoxy?):
0509 Volume filling the cylindrical envelope of the inserts
0510 from drawings : 367 mm^3
0511 Extra volume from assuming a 0.15 mm clearance on the radius of the hole
0512 in which the insert fits
0513 : 12 mm^3
0514 .......................................................................
0515 # "TID module inserts" "TID_ModuleFix" 0.602 -1
0516 * 1 "Al insert" "Aluminium" 0.187 1 SUP
0517 * 2 "Glue" "Epoxy" 0.379 1 SUP
0518 .......................................................................
0519 =======================================================================
0520
0521
0522 # "END" "END" 0. 0.
0523 this has to be the last line !
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