Warning, /Geometry/TrackerCommonData/data/Materials/tob_module.in is written in an unsupported language. File is not indexed.
0001 TOB MODULES
0002 ============
0003
0004 $$ This includes all the volumes that make up the TOB modules
0005 $$ as well as the electronics on the rods !
0006
0007
0008 Input file for mixture.f
0009 Start new mixtures with a '#' in the first column
0010 Start the components with a '*' in the first column
0011 You can type any kind of comment in as long as you don't start it
0012 with '#' or '*' !
0013 .....................................................................
0014 For mixture declaration: Name of Mixture, Name of GMIX for title file,
0015 Monte Carlo Volume, MC Area
0016 For items in a compound: Item number, Comment, Material (has to be
0017 written exactly as in material.input file),
0018 Volume, Multiplicity, Type
0019 Type is one of the following: SUP for support
0020 SEN for sensitive volumes
0021 CAB for cables
0022 COL for cooling
0023 ELE for electronics
0024 .....................................................................
0025
0026
0027 o Pitch adapter, r-phi
0028 --------------------
0029 MCVolume: (8.6 x 1.25 x 0.11) cm^3
0030
0031 (1) Glass pitch adapter
0032 material is Schott D263 Borosilicate Glass, density = 2.51 g/cm^3
0033 properties taken from http://www.schott.com/fpd/english/products/fpd/d263t.html
0034 and http://www.osti.gov/bridge/servlets/purl/10117627-uo1lPX/webviewable/10117627.pdf
0035 (TIB: CORNING 1737F density = 2.54 g/cm^3)
0036 Borosilicate Glass chemical composition: http://www.qvf.com/en/Equipment_1/Borosilicate%20glass/Composition.shtml
0037 dimensions 9.64 x 1.25 x 0.0550 cm^3 = 0.66275 cm^3 (TIB: 300 um, TID/TOB/TEC: 550 um thickness)
0038 [WAS dimensions 9.64 x 1.25 x 0.03 cm^3 = 0.3615 cm^3]
0039 (2) Pitch adapter spacers
0040 dimensions 86x3x0.635 mm^3 + 60x3x0.635 mm^3 = 278.13 mm^3 = 0.27813 cm^3
0041 [WAS (NOMEX) 0.24 cm^3]
0042 [WAS (3) Carbon fibre support piece dimensions 8.6 x 1.18 x 0.06 cm^3]
0043 ......................................................................
0044 # "TOB Pitch Adapter r-phi" "TOB_PA_rphi" 1.1825 10.75
0045 * 1 "Glass pitch adapter" "Borosilicate_Glass" 0.66275 1 ELE
0046 * 2 "Spacer" "Ceramic" 0.27813 1 SUP
0047 ......................................................................
0048 ======================================================================
0049
0050 o Pitch adapter, stereo
0051 --------------------
0052 MCVolume: (0.78*8.6*0.11 + 0.5 * 0.863*8.6*0.11) cm^3 = 1.146 cm^3
0053
0054 (1) Glass pitch adapter
0055 material is Schott D263 Borosilicate Glass, density = 2.51 g/cm^3
0056 properties taken from http://www.schott.com/fpd/english/products/fpd/d263t.html
0057 and http://www.osti.gov/bridge/servlets/purl/10117627-uo1lPX/webviewable/10117627.pdf
0058 (TIB: CORNING 1737F density = 2.54 g/cm^3)
0059 Borosilicate Glass chemical composition: http://www.qvf.com/en/Equipment_1/Borosilicate%20glass/Composition.shtml
0060 dimensions: [ ( 0.9 x 9.6 x 0.0550 ) + 0.5 x ( 0.9 x 9.6 x 0.0550 ) ] cm^3 = 0.7128 cm^3 (TIB: 300 um, TID/TOB/TEC: 550 um thickness)
0061 [WAS dimensions 0.9*9.6*0.03 + 0.5 * 0.9*9.6*0.03 = 0.389 cm^3]
0062 (2) Pitch adapter spacers
0063 dimensions 86x3x0.635 mm^3 + 60x3x0.635 mm^3 = 278.13 mm^3 = 0.27813 cm^3
0064 [WAS (NOMEX) 0.24 cm^3]
0065 [WAS (3) Carbon fibre support piece dimensions 8.6 x 1.18 x 0.06 cm^3]
0066 [WAS (3) Carbon fibre frame piece
0067 0.8*8.0*1.5*0.06 = 0.576 cm^3 ]
0068 ........................................................................
0069 # "TOB Pitch Adapter stereo" "TOB_PA_ster" 1.146 10.42
0070 * 1 "Glass pitch adapter" "Borosilicate_Glass" 0.7128 1 ELE
0071 * 2 "Spacer" "Ceramic" 0.27813 1 SUP
0072 ........................................................................
0073 ========================================================================
0074
0075 o Module end plate
0076 ----------------
0077 Carbon fiber endplate where electronics sits on top
0078 MCVolume: (12 x 4.5 x 0.0625) cm^3
0079 (1) CF
0080 dimensions from EDM file CMSTKOBM0026 version AA
0081 { [ 39 x 119.7] + 2 x [ 6 x 29.9 ] - 2 x [ pi x (8.4 / 2)^2 ] - 2 x [ pi x (3.5 / 2)^2 ] - 4 x [ pi x (1.6 / 2)^2 ] } mm^2 x 0.625 mm =
0082 = 4888.98 mm^2 x 0.625 mm = 3055.61 mm^3
0083 [WAS dimensions: 12 x 4.7 x 0.06 cm = 3.384 cm^3]
0084
0085 (2) 3D Label
0086 Plastic (kapton): m = 0.020 g
0087 density = 1.40 g/cm^3
0088 --> volume = 0.0143 cm^3
0089
0090
0091 ...................................................................
0092 # "TOB module end plate" "TOB_frame_ele" 3.375 54.0
0093 * 1 "CF plate" "Carbon fibre str." 3.05561 1 SUP
0094 * 2 "Module 3D Label" "T_Kapton" 0.0143 1 ELE
0095 ...................................................................
0096 ===================================================================
0097
0098 o Ceramic Hybrid Support
0099 [WAS CF Hybrid Support]
0100 --------------
0101 MCVolume: (8.6 x 3.71 x 0.0380) cm^3 = 1.2124 cm^3
0102 [WAS MCVolume: 7 x 3.33 x 0.06 = 1.3986 cm^3]
0103 (1) Ceramic plate
0104 dimensions: [ (37.1-11.8)x72 + 11.8x86] mm^2 x 0.380 mm =
0105 = 2836.4 mm^2 x 0.380 mm = 1077.832 mm^3
0106 [WAS (1) CF dimensions: 7 x 3.4 x 0.06 = 1.428 cm^3]
0107 ....................................................................
0108 # "TOB hybrid support" "TOB_hybrid_supp" 1.3986 23.31
0109 * 1 "Hybrid support" "Ceramic" 1.077832 1 SUP
0110 ....................................................................
0111 ====================================================================
0112
0113 o Aluminium cooling I
0114 -------------------
0115 Al piece at sensor middle
0116 This one includes the screw !
0117 MCVolume: (1.6 x 2 x 0.03) cm^3
0118
0119 (1) Al heat spreader
0120 dimensions from EDM file CMSTKOBM0025 version 0
0121 { [ 16 x 20 ] - [ pi x (2/2)^2 ] } mm^2 x 0.300 mm
0122 = 316.8584 mm^2 x 0.300 mm = 95.0575 mm^3
0123 [WAS 0.096 cm^3]
0124 [THIS MATERIAL HAS BEEN CREATED APART
0125 (2) CF compensator
0126 dimensions from EDM file CMSTKOBM0035 version AA
0127 { [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm =
0128 = 337.46 mm^2 x 0.300 mm = 101.238 mm^3
0129 [WAS 0.15 cm^3]
0130 ]
0131 (2-3) Screw: 0.009 cm^3 Stainless Steel,
0132 0.02 cm^3 Al washer
0133 .....................................................................
0134 # "TOB Module Cooling 1" "TOB_mod_cool1" 0.096 3.2
0135 * 1 "Al heat spreader" "Aluminium" 0.0950575 1 COL
0136 * 2 "Steel screw" "Steel-008" 0.009 1 COL
0137 * 3 "Al washer" "Aluminium" 0.02 1 COL
0138 .....................................................................
0139 =====================================================================
0140
0141 [WAS
0142 o Aluminium cooling II
0143 --------------------
0144 Al piece at sensor middle
0145 No screw !
0146 MCVolume: (1.5 x 2.8 x 0.03) cm
0147
0148 (1) Al heat spreader
0149 dimensions from EDM file CMSTKOBM0025 version 0
0150 { [ 16 x 20 ] - [ pi x (2/2)^2 ] } mm^2 x 0.300 mm
0151 = 316.8584 mm^2 x 0.300 mm = 95.0575 mm^3
0152 [WAS 0.096 cm^3]
0153 [THIS MATERIAL HAS BEEN CREATED APART
0154 (2) CF compensator
0155 dimensions from EDM file CMSTKOBM0035 version AA
0156 { [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm =
0157 = 337.46 mm^2 x 0.300 mm = 101.238 mm^3
0158 [WAS 0.15 cm^3]
0159 ]
0160 ....................................................................
0161 # "TOB Module Cooling 2" "TOB_mod_cool2" 0.126 4.2
0162 * 1 "Al heat spreader" "Aluminium" 0.0950575 1 COL
0163 ....................................................................
0164 ====================================================================
0165 NO MORE NEEDED, ALL THE SPREADER ARE THE SAME
0166 ]
0167
0168 o Aluminium cooling III
0169 [WAS o Aluminium cooling III ]
0170 ---------------------
0171 Al and locator piece at hybrid sides
0172 This one includes the screw !
0173 MCVolume: (1.5 x 2.8 x 0.03) cm^3
0174
0175 (1) Al heat spreader
0176 dimensions from EDM file CMSTKOBM0024 version 0
0177 { [ 15 x 28 ] - (8 x 8 / 2) - [ pi x (2/2)^2 ] } mm^2 x 0.300 mm
0178 = 384.8584 mm^2 x 0.300 mm = 115.4575 mm^3
0179 [WAS 0.116 cm^3]
0180 [THIS MATERIAL HAS BEEN CREATED APART
0181 (2) CF compensator
0182 dimensions from EDM file CMSTKOBM0035 version AA
0183 { [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm =
0184 = 337.46 mm^2 x 0.300 mm = 101.238 mm^3
0185 [WAS 0.15 cm^3]
0186 ]
0187 (2-3) Screw: 0.009 cm^3 Stainless Steel,
0188 0.02 cm^3 Al washer
0189 (4) CuBe/brass -> take all Cu for now:
0190 (0.0044 * 3) cm^3
0191 ...................................................................
0192 # "TOB Module Cooling 2" "TOB_mod_cool2" 0.126 4.2
0193 * 1 "Al heat spreader" "Aluminium" 0.1154575 1 COL
0194 * 2 "Steel screw" "Steel-008" 0.009 1 COL
0195 * 3 "Al washer" "Aluminium" 0.02 1 COL
0196 * 4 "Cu locator" "Copper" 0.0044 3 SUP
0197 ...................................................................
0198 ===================================================================
0199
0200 o Carbon Fibre Compensator (cooling)
0201 --------------------
0202 MCVolume: (1.6 x 2.6 x 0.03) cm^3
0203
0204 (1) CF compensator
0205 dimensions from EDM file CMSTKOBM0035 version AA
0206 { [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm =
0207 = 337.46 mm^2 x 0.300 mm = 101.238 mm^3
0208 ............................................................................
0209 # "TOB Module Cooling Compensator" "TOB_mod_comp" 0.1248 4.16
0210 * 1 "CF Compensator" "Carbon fibre str." 0.101238 1 COL
0211 ............................................................................
0212 ============================================================================
0213
0214
0215
0216 o Module side rail I rphi (heavier side)
0217 ---------------------------------------
0218 Volumes from single-sided modules. Also used for double-sided modules
0219 MCVolume: (1.7 x 21 x 0.08) cm^3
0220
0221 (1) Carbon fiber leg
0222 dimensions from EDM file CMSTKOBM0026 version AA
0223 { [ 15.1 x 210 ] + [ 4.0 x 122 ] + 2 x [ 1.5 x 22.5 ] - [ pi x (8.4 / 2)^2 ] - [ pi x ( 2.5 / 2 )^2 ] } mm^2 x 0.625 mm =
0224 = 3666.17 x 0.625 mm^3 = 2291.36 mm^3
0225 [WAS 21 x 1.7 x 0.06 cm = 2.14 cm^3]
0226
0227 Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm
0228 EDMS Code EP 680-1174-080-A (ss) and EP 680-1174-060-D (ds)
0229 (2-3) DS or SS rphi Bias
0230 Kapton: m = 0.552 g
0231 density = 1.4 g/cm^3
0232 --> volume = 0.394 cm^3
0233 Copper: m = 0.088 g
0234 density = 8.96 g/cm^3
0235 --> volume = 0.010 cm^3
0236
0237 (4) HV wire (115 mm)
0238 Copper: m = (0.14+0.10) g = 0.24 g
0239 density = 8.96 g/cm^3
0240 --> volume = 0.027 cm^3
0241
0242 (5) Transparent Sleeve
0243 Polyethylene:
0244 m = 0.040 g
0245 density = 0.95 g/cm^3
0246 --> volume = 0.042 cm^3
0247
0248 (6) Soldering (Sn/Pb alloy)
0249 BGA196 (Ball Grid Array), Sn/Pb/Ag 62/36/2:
0250 m = 0.030 g
0251 density = 8.82 g/cm^3
0252 --> volume = 0.0034 cm^3
0253
0254 (7) Thermistor Caps
0255 Kapton: m = 0.010 g
0256 density = 1.4 g/cm^3
0257 --> volume = 0.0071 cm^3
0258
0259 (8) Thermistor Stiffeners
0260 FR4: m = 0.040 g
0261 density (T_G10) = 1.90 g/cm^3
0262 --> volume = 0.021 cm^3
0263
0264 (9) SMD Capacitors
0265 BaTiO3: m = 0.090 g
0266 density = 6.02 g/cm^3
0267 --> volume = 0.015 cm^3
0268
0269 (10) SMD Resistors
0270 Al2O3: m = 0.050 g
0271 density = 3.96525 g/cm^3
0272 --> volume = 0.0126 cm^3
0273
0274 [WAS:
0275 (2) Kapton
0276 from Bill's table: ~0.5 cm^3
0277 (3) Copper traces
0278 Robert: Cu is approx 15 um thick => 0.01 cm^3 (just a guess)
0279 (4) Components:
0280 Caps: 1 x 1206 3 x 1.5 x 1.5 mm^3
0281 1 x 1210 3.2 x 2.5 x 1.5 mm^3
0282 Rs: 2 x 1206
0283 3 x 0603 1.6 x 0.8 x 0.8 mm (thermistors)
0284 ]
0285
0286 ..........................................................................
0287 # "TOB side rail active rphi" "TOB_sid_rail1" 2.856 35.7
0288 * 1 "CF leg" "Carbon fibre str." 2.29136 1 SUP
0289 * 2 "Bias Kapton" "T_Kapton" 0.394 1 ELE
0290 * 3 "Bias Copper" "Copper" 0.010 1 ELE
0291 * 4 "HV Wire" "Copper" 0.027 1 ELE
0292 * 5 "Transparent Sleeve" "Polyethylene" 0.042 1 ELE
0293 * 6 "Soldering" "BGA" 0.0034 1 ELE
0294 * 7 "Thermistor Caps" "T_Kapton" 0.0071 1 ELE
0295 * 8 "Thermistor Stiffeners" "T_G10" 0.021 1 ELE
0296 * 9 "Capacitors" "Barium_Titanate" 0.015 1 ELE
0297 * 10 "Resistors" "Ceramic" 0.0126 1 ELE
0298 ..........................................................................
0299 ==========================================================================
0300
0301 o Module side rail II rphi (lighter side)
0302 ----------------------------------------
0303 Volumes from single-sided modules. Also used for double-sided modules
0304 MCVolume: (1.7 x 21 x 0.08) cm^3
0305
0306 (1) Carbon fiber leg
0307 dimensions from EDM file CMSTKOBM0026 version AA
0308 { [ 15.1 x 210 ] + [ 4.0 x 122 ] + 2 x [ 1.5 x 22.5 ] - [ pi x (8.4 / 2)^2 ] - [ pi x ( 2.5 / 2 )^2 ] } mm^2 x 0.625 mm =
0309 = 3666.17 x 0.625 mm^3 = 2291.36 mm^3
0310 [WAS 21 x 1.7 x 0.06 cm = 2.14 cm^3]
0311
0312 Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm
0313 EDMS Code EP 680-1174-090-A (ss) and EP 680-1174-050-C (ds)
0314 (2-3) DS or SS rphi Insulator
0315 Kapton: m = 0.402 g
0316 density = 1.4 g/cm^3
0317 --> volume = 0.287 cm^3
0318 Copper: m = 0.041 g
0319 density = 8.96 g/cm^3
0320 --> volume = 0.0046 cm^3
0321
0322 [WAS:
0323 (2) Kapton
0324 from Bill's table: ~0.45 cm^3
0325 (3) Copper: 2 x 20x8 mm^2 x 17 um = 0.00544 cm^3
0326 ]
0327
0328
0329 ........................................................................
0330 # "TOB side rail passive rphi" "TOB_sid_rail2" 2.856 35.7
0331 * 1 "CF leg" "Carbon fibre str." 2.29136 1 SUP
0332 * 2 "Insulator Kapton" "T_Kapton" 0.287 1 ELE
0333 * 3 "Insulator Copper" "Copper" 0.0046 1 ELE
0334 ........................................................................
0335 ========================================================================
0336
0337
0338 o Module side rail I stereo (heavier side)
0339 ---------------------------------------
0340 Volumes from single-sided modules. Also used for double-sided modules
0341 MCVolume: (1.7 x 21 x 0.08) cm^3
0342
0343 (1) Carbon fiber leg
0344 dimensions from EDM file CMSTKOBM0026 version AA
0345 { [ 15.1 x 210 ] + [ 4.0 x 122 ] + 2 x [ 1.5 x 22.5 ] - [ pi x (8.4 / 2)^2 ] - [ pi x ( 2.5 / 2 )^2 ] } mm^2 x 0.625 mm =
0346 = 3666.17 x 0.625 mm^3 = 2291.36 mm^3
0347 [WAS 21 x 1.7 x 0.06 cm = 2.14 cm^3]
0348
0349 Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm
0350 EDMS Code EP 680-1174-080-A
0351 (2-3) DS or SS rphi Bias (different with respect to rphi)
0352 Kapton: m = 0.514 g
0353 density = 1.4 g/cm^3
0354 --> volume = 0.367 cm^3
0355 Copper: m = 0.088 g
0356 density = 8.96 g/cm^3
0357 --> volume = 0.0098 cm^3
0358
0359 (4) HV wire (115 mm)
0360 Copper: m = (0.14+0.10) g = 0.24 g
0361 density = 8.96 g/cm^3
0362 --> volume = 0.027 cm^3
0363
0364 (5) Transparent Sleeve
0365 Polyethylene:
0366 m = 0.040 g
0367 density = 0.95 g/cm^3
0368 --> volume = 0.042 cm^3
0369
0370 (6) Soldering (Sn/Pb alloy)
0371 BGA196 (Ball Grid Array), Sn/Pb/Ag 62/36/2:
0372 m = 0.030 g
0373 density = 8.82 g/cm^3
0374 --> volume = 0.0034 cm^3
0375
0376 (7) Thermistor Caps
0377 Kapton: m = 0.010 g
0378 density = 1.4 g/cm^3
0379 --> volume = 0.0071 cm^3
0380
0381 (8) Thermistor Stiffeners
0382 FR4: m = 0.040 g
0383 density (T_G10) = 1.90 g/cm^3
0384 --> volume = 0.021 cm^3
0385
0386 (9) SMD Capacitors
0387 BaTiO3: m = 0.090 g
0388 density = 6.02 g/cm^3
0389 --> volume = 0.015 cm^3
0390
0391 (10) SMD Resistors
0392 Al2O3: m = 0.050 g
0393 density = 3.96525 g/cm^3
0394 --> volume = 0.0126 cm^3
0395
0396 [WAS:
0397 (2) Kapton
0398 from Bill's table: ~0.5 cm^3
0399 (3) Copper traces
0400 Robert: Cu is approx 15 um thick => 0.01 cm^3 (just a guess)
0401 (4) Components:
0402 Caps: 1 x 1206 3 x 1.5 x 1.5 mm^3
0403 1 x 1210 3.2 x 2.5 x 1.5 mm^3
0404 Rs: 2 x 1206
0405 3 x 0603 1.6 x 0.8 x 0.8 mm (thermistors)
0406 ]
0407
0408 ...........................................................................
0409 # "TOB side rail active stereo" "TOB_sid_rail1st" 2.856 35.7
0410 * 1 "CF leg" "Carbon fibre str." 2.29136 1 SUP
0411 * 2 "Bias Kapton" "T_Kapton" 0.367 1 ELE
0412 * 3 "Bias Copper" "Copper" 0.0098 1 ELE
0413 * 4 "HV Wire" "Copper" 0.027 1 ELE
0414 * 5 "Transparent Sleeve" "Polyethylene" 0.042 1 ELE
0415 * 6 "Soldering" "BGA" 0.0034 1 ELE
0416 * 7 "Thermistor Caps" "T_Kapton" 0.0071 1 ELE
0417 * 8 "Thermistor Stiffeners" "T_G10" 0.021 1 ELE
0418 * 9 "Capacitors" "Barium_Titanate" 0.015 1 ELE
0419 * 10 "Resistors" "Ceramic" 0.0126 1 ELE
0420 ...........................................................................
0421 ===========================================================================
0422
0423 o Module side rail II stereo (lighter side)
0424 ----------------------------------------
0425 Volumes from single-sided modules. Also used for double-sided modules
0426 MCVolume: (1.7 x 21 x 0.08) cm^3
0427
0428 (1) Carbon fiber leg
0429 dimensions from EDM file CMSTKOBM0026 version AA
0430 { [ 15.1 x 210 ] + [ 4.0 x 122 ] + 2 x [ 1.5 x 22.5 ] - [ pi x (8.4 / 2)^2 ] - [ pi x ( 2.5 / 2 )^2 ] } mm^2 x 0.625 mm =
0431 = 3666.17 x 0.625 mm^3 = 2291.36 mm^3
0432 [WAS 21 x 1.7 x 0.06 cm = 2.14 cm^3]
0433
0434 Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm
0435 EDMS Code EP 680-1174-100-A
0436 (2-3) DS or SS rphi Insulator (different with respect to rphi)
0437 Kapton: m = 0.389 g
0438 density = 1.4 g/cm^3
0439 --> volume = 0.278 cm^3
0440 Copper: m = 0.041 g
0441 density = 8.96 g/cm^3
0442 --> volume = 0.0046 cm^3
0443
0444 [WAS:
0445 (2) Kapton
0446 from Bill's table: ~0.45 cm^3
0447 (3) Copper: 2 x 20x8 mm^2 x 17 um = 0.00544 cm^3
0448 ]
0449
0450
0451 ........................................................................
0452 # "TOB side rail passive rphi" "TOB_sid_rail2st" 2.856 35.7
0453 * 1 "CF leg" "Carbon fibre str." 2.29136 1 SUP
0454 * 2 "Insulator Kapton" "T_Kapton" 0.278 1 ELE
0455 * 3 "Insulator Copper" "Copper" 0.0046 1 ELE
0456 ........................................................................
0457 ========================================================================
0458
0459 o Hybrid for TOB layers 1/2
0460 -------------------------
0461 [WAS o Hybrid for TOB layers 5/6
0462 ------------------------- ]
0463
0464 These are the hybrids of the double sided layers.
0465 Each of the hybrids carries 4 APVs (changed 15/03/02)
0466
0467 Hybrids have 4 APVs
0468
0469 MCVolume: (6 x 2.5 x 0.05) cm^3 = 0.75 cm^3
0470
0471 Dimensions (60 x 25) mm^2 = 15 cm^2
0472 (1) Hybrid reviewed November 2006 - Central Hybrid (no kapton tail, which is in ICC* material definition, see below)
0473 see http://www.fynu.ucl.ac.be/he/cms/activities/tracker/FHITfiles/CCTPHybrides.pdf
0474 - Kapton: (25+25) um = 50 um = 0.0050 cm --> 0.075 cm^3
0475 - Copper: (18+12+18+18+18+12) um = 96 um = 0.0096 cm --> 0.144 cm^3
0476 - Solder Mask: 20 um = 0.0020 cm --> 0.030 cm^3
0477 - Glue: (50+50) um = 100 um thickness = 0.0100 cm --> 0.150 cm^3
0478 [WAS (1) new FR4 hybrid
0479 Estimate: 300 mu FR4,
0480 3 x 25 mu Cu
0481 ~300 mu Kapton
0482 -Pt-Au layer: tbd ]
0483 (2) Hybrid components
0484 R: (14 + n_APV) 0402 size material: carbon -> 18
0485 C: 2 x 1206 large ones
0486 (5 + 2*n_APV) 0402 size -> 13
0487 0402: (1 x 0.5 x 0.5) mm^3 = 0.25 mm^3 = 0.25 x 10^-3 cm^3
0488 1206: (3 x 1.5 x 1.5) mm^3 = 6.75 mm^3 = 6.75 x 10^-3 cm^3
0489 APV25: (7.1 x 8.1 x 0.3) mm^3 = 17.253 mm^3 = 0.017253 cm^3 4 per hybrid REVIEWED November 2006 OK
0490 PLL: (4.0 x 4.0 x 0.3) mm^3 = 4.8 mm^3 = 0.0048 cm^3 1 per hybrid REVIEWED November 2006 OK
0491 (see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/PauloMoreira/PLL25%20User%20Manua2.1.pdf)
0492 MUX: (5.0 x 5.0 x 0.3) mm^3 = 7.5 mm^3 = 0.0075 cm^3 1 per hybrid REVIEWED November 2006 OK
0493 (see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/LVDSMUX3_datasheet.pdf)
0494 [WAS PLL+MUX : 2.0 x 7.1 x 0.3 mm^3 1 per hybrid ]
0495 http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/manuals.htm
0496 DCU : (2.0 x 2.0 x 0.3) mm^3 = 1.2 mm^3 = 0.0012 cm^3 1 per hybrid REVIEWED November 2006 OK
0497 (see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/Magazzu/DCUF_User_Manual_v3.0.pdf)
0498 (3) Wire bonds
0499 http://cms.ct.infn.it/bonding/bondspec.htm
0500 Al, 1% Si, 25 um diameter, medium hardness
0501 tail length visible but short < 50 um
0502 1 wire bond: average of 4 mm length diameter 25 um + 1 tail =
0503 = { [ pi x (0.025/2)^2 ] mm^2 x 4 mm } + { [ pi x (0.025/2)^2 ] mm^2 x 0.050 mm } =
0504 = [1.963x10^-3 mm^3] + [0.0245x10^-3 mm^3] = 2.0x10^-3 mm^3 = 2.0x10^-6 cm^3 [99% Aluminium + 1% Silicon]
0505 PA bias line to sensor bias ring: 5 bonds
0506 PA to hybrid: nAPV x 128 bonds
0507 PA to sensor: nAPV x 128 bonds
0508 TOTAL: 2x128xnAPV+5 bonds = 1029 bonds
0509 ......................................................................
0510 # "TOB Hybrid Layer 1/2" "TOB_ele12" 0.75 15.0
0511 Central Hybrid (no tail)
0512 * 1 "Central Hybrid Kapton" "T_Kapton" 0.075 1 ELE
0513 * 2 "Central Hybrid Copper" "Copper" 0.144 1 ELE
0514 * 3 "Central Hybrid Solder Mask" "T_Kapton" 0.030 1 ELE
0515 * 4 "Central Hybrid Glue" "Epoxy" 0.150 1 ELE
0516 Components: Resistors
0517 * 5 "Resistors" "Carbon" 0.25E-3 18 ELE
0518 * 6 "R metal" "SMD_metal" 1.E-4 18 ELE
0519 Capacitors
0520 * 7 "Small caps" "Alumina" 0.25E-3 13 ELE
0521 * 8 "C metal" "SMD_metal" 1.E-4 13 ELE
0522 * 9 "Large caps" "Alumina" 6.75E-3 2 ELE
0523 * 10 "C metal large" "SMD_metal" 1.E-3 2 ELE
0524 * 11 "APV25" "Silicon" 0.017253 4 ELE
0525 * 12 "PLL" "Silicon" 4.8E-3 1 ELE
0526 * 13 "MUX" "Silicon" 7.5E-3 1 ELE
0527 * 14 "DCU" "Silicon" 1.2E-3 1 ELE
0528 Wire bonds
0529 * 15 "Wire bonds" "Aluminium" 1.98E-6 1029 ELE
0530 * 16 "Wire bonds" "Silicon" 0.02E-6 1029 ELE
0531 ......................................................................
0532 ======================================================================
0533
0534 o Hybrid for TOB layers 3/4
0535 -------------------------
0536 [WAS o Hybrid for TOB layers 7/8
0537 ------------------------- ]
0538 Hybrids have 4 APVs
0539
0540 as above, except:
0541 (2) Hybrid components
0542 R: (14 + n_APV) 0402 size material: carbon -> 18
0543 C: 2 x 1206 large ones
0544 (5 + 2*n_APV) 0402 size -> 13
0545 (3) Wire bonds
0546 see above for details
0547 TOTAL: 2x128xnAPV+5 bonds = 1029 bonds
0548 ......................................................................
0549 # "TOB Hybrid Layer 3/4" "TOB_ele34" 0.75 15.0
0550 Central Hybrid (no tail)
0551 * 1 "Central Hybrid Kapton" "T_Kapton" 0.075 1 ELE
0552 * 2 "Central Hybrid Copper" "Copper" 0.144 1 ELE
0553 * 3 "Central Hybrid Solder Mask" "T_Kapton" 0.030 1 ELE
0554 * 4 "Central Hybrid Glue" "Epoxy" 0.150 1 ELE
0555 Components: Resistors
0556 * 5 "Resistors" "Carbon" 0.25E-3 18 ELE
0557 * 6 "R metal" "SMD_metal" 1.E-4 18 ELE
0558 Capacitors
0559 * 7 "Small caps" "Alumina" 0.25E-3 13 ELE
0560 * 8 "C metal" "SMD_metal" 1.E-4 13 ELE
0561 * 9 "Large caps" "Alumina" 6.75E-3 2 ELE
0562 * 10 "C metal large" "SMD_metal" 1.E-3 2 ELE
0563 * 11 "APV25" "Silicon" 0.017253 4 ELE
0564 * 12 "PLL" "Silicon" 4.8E-3 1 ELE
0565 * 13 "MUX" "Silicon" 7.5E-3 1 ELE
0566 * 14 "DCU" "Silicon" 1.2E-3 1 ELE
0567 Wire bonds
0568 * 15 "Wire bonds" "Aluminium" 1.98E-6 1029 ELE
0569 * 16 "Wire bonds" "Silicon" 0.02E-6 1029 ELE
0570 ......................................................................
0571 ======================================================================
0572
0573 o Hybrid for TOB layers 5/6
0574 --------------------------
0575 [WAS Hybrid for TOB layers 9/10
0576 -------------------------- ]
0577 Hybrids have 6 APVs
0578
0579 as above, except:
0580 (2) Hybrid components
0581 R: (14 + n_APV) 0402 size material: carbon -> 20
0582 C: 2 x 1206 large ones
0583 (5 + 2*n_APV) 0402 size -> 17
0584 (3) Wire bonds
0585 see above for details
0586 TOTAL: 2x128xnAPV+5 bonds = 1541 bonds
0587 ......................................................................
0588 # "TOB Hybrid Layer 5/6" "TOB_ele56" 0.75 15.0
0589 Central Hybrid (no tail)
0590 * 1 "Central Hybrid Kapton" "T_Kapton" 0.075 1 ELE
0591 * 2 "Central Hybrid Copper" "Copper" 0.144 1 ELE
0592 * 3 "Central Hybrid Solder Mask" "T_Kapton" 0.030 1 ELE
0593 * 4 "Central Hybrid Glue" "Epoxy" 0.150 1 ELE
0594 Components: Resistors
0595 * 5 "Resistors" "Carbon" 0.25E-3 20 ELE
0596 * 6 "R metal" "SMD_metal" 1.E-4 20 ELE
0597 Capacitors
0598 * 7 "Small caps" "Alumina" 0.25E-3 17 ELE
0599 * 8 "C metal" "SMD_metal" 1.E-4 17 ELE
0600 * 9 "Large caps" "Alumina" 6.75E-3 2 ELE
0601 * 10 "C metal large" "SMD_metal" 1.E-3 2 ELE
0602 * 11 "APV25" "Silicon" 0.017253 6 ELE
0603 * 12 "PLL" "Silicon" 4.8E-3 1 ELE
0604 * 13 "MUX" "Silicon" 7.5E-3 1 ELE
0605 * 14 "DCU" "Silicon" 1.2E-3 1 ELE
0606 Wire bonds
0607 * 15 "Wire bonds" "Aluminium" 1.98E-6 1541 ELE
0608 * 16 "Wire bonds" "Silicon" 0.02E-6 1541 ELE
0609 ......................................................................
0610 ======================================================================
0611
0612 o TOB Interface between two sensors and sensor-Pitch Adapter
0613 -----------------------------------------------------------
0614 The inactive part between the two sensors and between PA-sensor:
0615 Sylgard encapsulant (Silicone) + wire bonds
0616
0617 MCVolume: (9.3696 x 0.55 x 0.2) cm^3 = 1.030656 cm^3
0618 (1) Silicone encapsulant
0619 http://www.vestaweb.com/silicone/silicone_properties.htm
0620 http://www.answers.com/topic/silicone
0621 http://www.answers.com/topic/dimethyl-polysiloxane
0622 Must weight 0.83 g and dens=0.965 g/cm^3 --> volume = 0.80095 cm^3
0623 (2) Wire bonds
0624 see above for details
0625 sen-sen bias bonds: 5 bonds
0626 TOTAL: 2x128xnAPV+5 bonds = 1029-1541 bonds (average: 1285)
0627
0628 ................................................................................
0629 # "TOB Two-Sensor Interface" "TOB_Sens_Interface" 1.030656 7.49568
0630 * 1 "Glue" "Silicone_Gel" 0.80095 1 SUP
0631 Wire bonds
0632 * 2 "Wire bonds" "Aluminium" 1.98E-6 1285 ELE
0633 * 3 "Wire bonds" "Silicon" 0.02E-6 1285 ELE
0634 ................................................................................
0635 ================================================================================
0636
0637
0638 o TOB Electronics ICC1/2
0639 Inter Connect Cards
0640 ICC1 - serves 1 APV (smaller)
0641 ICC2 - serves 2 APVs (bigger)
0642 ICC1: MCVolume: (11.800 x 4.400 x 0.250) cm^3 = 12.98 cm^3
0643 ICC2: MCVolume: (11.800 x 6.800 x 0.250) cm^3 = 20.06 cm^3
0644 Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/ICCs_MB.htm
0645
0646
0647 Layer 1/2
0648 ---------
0649
0650 ICC1
0651 ----
0652 Same as Layer 3/4, except:
0653 Circuit ICC1 (DS_ICC1)
0654 EDMS Code EP 680-1174-200-C
0655
0656 (1-2) PCBs
0657 FR4: m = 8.179 g
0658 density (T_G10) = 1.90 g/cm^3
0659 --> volume = 4.305 cm^3
0660 copper: m = 1.575 g
0661 density = 8.96 g/cm^3
0662 --> volume = 0.176 cm^3
0663
0664 (3-4) Connectors NaiS
0665 socket + header
0666 2 x ICC-Kapton bias PCB 16 pins (AXN316038S + AXN416330S)
0667 THIS GOES IN AOH 2 x ICC-AOH 30 pins (AXN330038S + AXN430330S)
0668 2 x ICC-FEH 40 pins (AXN340038S + AXN440330S)
0669 1 x ICC-ICB 50 pins (AXN350038S + AXN450330S)
0670 copper: m = 2 x (0.0461 + 0.0515) g + NULL x { 2 x (0.0865 + 0.0965) g } + 2 x (0.1153 + 0.1287) g + 1 x (0.1442 + 0.1609) g = 0.9883 g
0671 density = 8.96 g/cm^3
0672 --> volume = 0.110 cm^3
0673 resin: m = 2 x (0.0882 + 0.1085) g + NULL x { 2 x (0.1445 + 0.1547) g } + 2 x (0.1768 + 0.2013) g + 1 x (0.2329 + 0.2764) g = 1.6589 g
0674 density (epoxy) = 1.3 g/cm^3
0675 --> volume = 1.276 cm^3
0676
0677 (5) HV stiffener (2 copies)
0678 FR4: m = 0.060 g
0679 density (T_G10) = 1.90 g/cm^3
0680 --> volume = 0.032 cm^3
0681
0682 (6) ICC SMD Resistors, 23 x (0603) + 2 x (0805) + 4 x (1206) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed
0683 m = 0.0983 g
0684 density = 3.96525 g/cm^3
0685 --> volume = 0.025 cm^3
0686
0687 (7) ICC SMD Capacitors, 10 x (0805) + 6 x (1812), mostly BaTiO3, the total mass is computed
0688 m = 1.5300 g
0689 density = 6.02 g/cm^3
0690 --> volume = 0.254 cm^3
0691
0692 (8-9) ICC ASICs: 1 x ("CRT245" 24 pin) + 2 x ("LVDSBUF" 16 pin)
0693 epoxy: m = [ ( 1 x 0.015675 ) + ( 2 x 0.038519 ) ] g = 0.092713 g
0694 density = 1.3 g/cm^3
0695 --> volume = 0.071 cm^3
0696 copper: m = [ ( 1 x 0.040 + 2 x 0.076 ) - 0.092713 ] g = 0.099287 g
0697 density = 8.96 g/cm^3
0698 --> volume = 0.011 cm^3
0699
0700 (10-13) Hybrid tail (2 copies)
0701
0702 (14) HV pin (2 copies)
0703
0704 .......................................................................
0705 # "TOB ICC Layer 1/2 (1 APV)" "TOB_L12_ICC1" 12.98 51.92
0706 * 1 "PCB board" "T_G10" 4.305 1 ELE
0707 * 2 "PCB copper traces" "Copper" 0.176 1 ELE
0708 * 3 "NAiS connectors" "Copper" 0.110 1 ELE
0709 * 4 "NAiS connectors" "Epoxy" 1.276 1 ELE
0710 * 5 "HV Stiffener" "T_G10" 0.032 2 CAB
0711 * 6 "ICC Resistors" "Ceramic" 0.025 1 ELE
0712 * 7 "ICC Capacitors" "Barium_Titanate" 0.254 1 ELE
0713 * 8 "ICC ASICs EMC" "Epoxy" 0.071 1 ELE
0714 * 9 "ICC ASICs copper" "Copper" 0.011 1 ELE
0715 * 10 "Hybrid Tail Kapton" "T_Kapton" 0.028 2 ELE
0716 * 11 "Hybrid Tail Copper" "Copper" 0.055 2 ELE
0717 * 12 "Hybrid Tail Solder Mask" "T_Kapton" 0.011 2 ELE
0718 * 13 "Hybrid Tail Glue" "Epoxy" 0.057 2 ELE
0719 * 14 "HV pin (module)" "Brass" 0.011 2 ELE
0720 .......................................................................
0721 =======================================================================
0722
0723 ICC2
0724 ----
0725 Same as Layer 3/4, except:
0726 Circuit ICC2 (DS_ICC2)
0727 EDMS Code EP 680-1174-210-D
0728
0729 (1-2) PCBs
0730 FR4: m = 12.508 g
0731 density (T_G10) = 1.90 g/cm^3
0732 --> volume = 6.583 cm^3
0733 copper: m = 2.452 g
0734 density = 8.96 g/cm^3
0735 --> volume = 0.274 cm^3
0736
0737 (3-4) Connectors NaiS
0738 socket + header
0739 4 x ICC-Kapton bias PCB 16 pins (AXN316038S + AXN416330S)
0740 THIS GOES IN AOH 4 x ICC-AOH 30 pins (AXN330038S + AXN430330S)
0741 4 x ICC-FEH 40 pins (AXN340038S + AXN440330S)
0742 1 x ICC-ICB 50 pins (AXN350038S + AXN450330S)
0743 copper: m = 4 x (0.0461 + 0.0515) g + NULL x { 4 x (0.0865 + 0.0965) g } + 4 x (0.1153 + 0.1287) g + 1 x (0.1442 + 0.1609) g = 1.6715 g
0744 density = 8.96 g/cm^3
0745 --> volume = 0.187 cm^3
0746 resin: m = 4 x (0.0882 + 0.1085) g + NULL x { 4 x (0.1445 + 0.1547) g } + 4 x (0.1768 + 0.2013) g + 1 x (0.2329 + 0.2764) g = 2.8085 g
0747 density (epoxy) = 1.3 g/cm^3
0748 --> volume = 2.160 cm^3
0749
0750 (5) HV stiffener (4 copies)
0751 FR4: m = 0.060 g
0752 density (T_G10) = 1.90 g/cm^3
0753 --> volume = 0.032 cm^3
0754
0755 (6) ICC SMD Resistors, 46 x (0603) + 4 x (0805) + 4 x (1206) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed
0756 m = 0.1575 g
0757 density = 3.96525 g/cm^3
0758 --> volume = 0.040 cm^3
0759
0760 (7) ICC SMD Capacitors, 18 x (0805) + 12 x (1812), mostly BaTiO3, the total mass is computed
0761 m = 3.030 g
0762 density = 6.02 g/cm^3
0763 --> volume = 0.503 cm^3
0764
0765 (8-9) ICC ASICs: 1 x ("CRT245" 24 pin) + 4 x ("LVDSBUF" 16 pin)
0766 epoxy: m = ( 1 x 0.015675 + 4 x 0.038519 ) g = 0.169751 g
0767 density = 1.3 g/cm^3
0768 --> volume = 0.131 cm^3
0769 copper: m = [ ( 1 x 0.040 + 4 x 0.076 ) - 0.169751 ) g = 0.274249 g
0770 density = 8.96 g/cm^3
0771 --> volume = 0.031 cm^3
0772
0773 (10-13) Hybrid tail (4 copies)
0774
0775 (14) HV pin (4 copies)
0776
0777 .......................................................................
0778 # "TOB ICC Layer 1/2 (2 APVs)" "TOB_L12_ICC2" 20.06 80.24
0779 * 1 "PCB board" "T_G10" 6.583 1 ELE
0780 * 2 "PCB copper traces" "Copper" 0.274 1 ELE
0781 * 3 "NAiS connectors" "Copper" 0.187 1 ELE
0782 * 4 "NAiS connectors" "Epoxy" 2.160 1 ELE
0783 * 5 "HV Stiffener" "T_G10" 0.032 4 CAB
0784 * 6 "ICC Resistors" "Ceramic" 0.040 1 ELE
0785 * 7 "ICC Capacitors" "Barium_Titanate" 0.503 1 ELE
0786 * 8 "ICC ASICs EMC" "Epoxy" 0.131 1 ELE
0787 * 9 "ICC ASICs copper" "Copper" 0.031 1 ELE
0788 * 10 "Hybrid Tail Kapton" "T_Kapton" 0.028 4 ELE
0789 * 11 "Hybrid Tail Copper" "Copper" 0.055 4 ELE
0790 * 12 "Hybrid Tail Solder Mask" "T_Kapton" 0.011 4 ELE
0791 * 13 "Hybrid Tail Glue" "Epoxy" 0.057 4 ELE
0792 * 14 "HV pin (module)" "Brass" 0.011 4 ELE
0793 .......................................................................
0794 =======================================================================
0795
0796 Layer 3/4
0797 ---------
0798
0799 ICC1
0800 ----
0801 Circuit ICC3 (SS_ICC1)
0802 EDMS Code EP 680-1174-220-B
0803
0804 MCVolume: ( 11.8 x 4.4 x 0.25 ) cm^3 = 12.98 cm^3
0805
0806 (1-2) PCBs
0807 FR4: m = 5.754 g
0808 density (T_G10) = 1.90 g/cm^3
0809 --> volume = 3.028 cm^3
0810 copper: m = 1.289 g
0811 density = 8.96 g/cm^3
0812 --> volume = 0.144 cm^3
0813
0814 (3-4) Connectors NaiS
0815 socket + header
0816 1 x ICC-Kapton bias PCB 16 pins (AXN316038S + AXN416330S)
0817 THIS GOES IN AOH 1 x ICC-AOH 30 pins (AXN330038S + AXN430330S)
0818 1 x ICC-FEH 40 pins (AXN340038S + AXN440330S)
0819 1 x ICC-ICB 50 pins (AXN350038S + AXN450330S)
0820 copper: m = 1 x (0.0461 + 0.0515) g + NULL x { 1 x (0.0865 + 0.0965) g } + 1 x (0.1153 + 0.1287) g + 1 x (0.1442 + 0.1609) g = 0.6467 g
0821 density = 8.96 g/cm^3
0822 --> volume = 0.0722 cm^3
0823 resin: m = 1 x (0.0882 + 0.1085) g + NULL x { 1 x (0.1445 + 0.1547) g } + 1 x (0.1768 + 0.2013) g + 1 x (0.2329 + 0.2764) g = 1.0841 g
0824 density (epoxy) = 1.3 g/cm^3
0825 --> volume = 0.834 cm^3
0826
0827 (5) HV stiffener
0828 FR4: m = 0.060 g
0829 density (T_G10) = 1.90 g/cm^3
0830 --> volume = 0.032 cm^3
0831
0832 (6) ICC SMD Resistors, 14 x (0603) + 1 x (0805) + 4 x (1206) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed
0833 m = 0.0741 g
0834 density = 3.96525 g/cm^3
0835 --> volume = 0.019 cm^3
0836
0837 (7) ICC SMD Capacitors, 7 x (0805) + 4 x (1812), mostly BaTiO3, the total mass is computed
0838 m = 1.025 g
0839 density = 6.02 g/cm^3
0840 --> volume = 0.170 cm^3
0841
0842 (8-9) ICC ASICs: 1 x ("CRT245" 24 pin) + 1 x ("LVDSBUF" 16 pin)
0843 epoxy: m = [ ( 1 x 0.015675 ) + ( 1 x 0.038519 ) ] g = 0.054194 g
0844 density = 1.3 g/cm^3
0845 --> volume = 0.042 cm^3
0846 copper: m = [ ( 1 x 0.040 + 1 x 0.076 ) - 0.054194 ] g = 0.061806 g
0847 density = 8.96 g/cm^3
0848 --> volume = 0.007 cm^3
0849
0850 (10-13) Hybrid tail
0851 see http://www.fynu.ucl.ac.be/he/cms/activities/tracker/FHITfiles/CCTPHybrides.pdf
0852 surface: (19 x 30) mm^2 = 570 mm^2 = 5.70 cm^2
0853 - Kapton: (25+25) um = 50 um = 0.0050 cm --> 0.0285 cm^3
0854 - Copper: (18+12+18+18+18+12) um = 96 um = 0.0096 cm --> 0.05472 cm^3
0855 - Solder Mask: 20 um = 0.0020 cm --> 0.0114 cm^3
0856 - Glue: (50+50) um = 100 um thickness = 0.0100 cm --> 0.057 cm^3
0857
0858 (14) HV pin
0859 module side:
0860 http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm
0861 m = 0.04 g per module
0862 ICB side:
0863 http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/ICB_MB.htm
0864 m = 0.330 g (6 HV wires) --> 0.330 g / 6 = 0.055 g per module
0865 HV pin (brass CuZn36Pb3 Sn plated):
0866 m = ( 0.04 + 0.055 ) g = 0.095 g
0867 density (brass) = 8.5 g/cm^3
0868 --> volume = 0.011 cm^3
0869
0870 .......................................................................
0871 # "TOB ICC Layer 3/4 (1 APV)" "TOB_L34_ICC1" 12.98 51.92
0872 * 1 "PCB board" "T_G10" 3.028 1 ELE
0873 * 2 "PCB copper traces" "Copper" 0.144 1 ELE
0874 * 3 "NAiS connectors" "Copper" 0.0722 1 ELE
0875 * 4 "NAiS connectors" "Epoxy" 0.834 1 ELE
0876 * 5 "HV Stiffener" "T_G10" 0.032 1 CAB
0877 * 6 "ICC Resistors" "Ceramic" 0.019 1 ELE
0878 * 7 "ICC Capacitors" "Barium_Titanate" 0.170 1 ELE
0879 * 8 "ICC ASICs EMC" "Epoxy" 0.042 1 ELE
0880 * 9 "ICC ASICs copper" "Copper" 0.007 1 ELE
0881 * 10 "Hybrid Tail Kapton" "T_Kapton" 0.028 1 ELE
0882 * 11 "Hybrid Tail Copper" "Copper" 0.055 1 ELE
0883 * 12 "Hybrid Tail Solder Mask" "T_Kapton" 0.011 1 ELE
0884 * 13 "Hybrid Tail Glue" "Epoxy" 0.057 1 ELE
0885 * 14 "HV pin (module)" "Brass" 0.011 1 ELE
0886 .......................................................................
0887 =======================================================================
0888
0889 ICC2
0890 ----
0891 Circuit ICC4 (SS_ICC2)
0892 EDMS Code EP 680-1174-230-B
0893
0894 MCVolume: ( 11.8 x 6.8 x 0.25 ) cm^3 = 20.06 cm^3
0895
0896 (1-2) PCBs
0897 FR4: m = 8.175 g
0898 density (T_G10) = 1.90 g/cm^3
0899 --> volume = 4.302 cm^3
0900 copper: m = 1.617 g
0901 density = 8.96 g/cm^3
0902 --> volume = 0.180 cm^3
0903
0904 (3-4) Connectors NaiS
0905 socket + header
0906 2 x ICC-Kapton bias PCB 16 pins (AXN316038S + AXN416330S)
0907 THIS GOES IN AOH 2 x ICC-AOH 30 pins (AXN330038S + AXN430330S)
0908 2 x ICC-FEH 40 pins (AXN340038S + AXN440330S)
0909 1 x ICC-ICB 50 pins (AXN350038S + AXN450330S)
0910 copper: m = 2 x (0.0461 + 0.0515) g + NULL x { 2 x (0.0865 + 0.0965) g } + 2 x (0.1153 + 0.1287) g + 1 x (0.1442 + 0.1609) g = 0.9883 g
0911 density = 8.96 g/cm^3
0912 --> volume = 0.110 cm^3
0913 resin: m = 2 x (0.0882 + 0.1085) g + NULL x { 2 x (0.1445 + 0.1547) g } + 2 x (0.1768 + 0.2013) g + 1 x (0.2329 + 0.2764) g = 1.6589 g
0914 density (epoxy) = 1.3 g/cm^3
0915 --> volume = 1.276 cm^3
0916
0917 (5) HV stiffener (2 copies)
0918 FR4: m = 0.060 g
0919 density (T_G10) = 1.90 g/cm^3
0920 --> volume = 0.032 cm^3
0921
0922 (6) ICC SMD Resistors, 28 x (0603) + 2 x (0805) + 4 x (1206) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed
0923 m = 0.1090 g
0924 density = 3.96525 g/cm^3
0925 --> volume = 0.027 cm^3
0926
0927 (7) ICC SMD Capacitors, 12 x (0805) + 8 x (1812), mostly BaTiO3, the total mass is computed
0928 m = 2.020 g
0929 density = 6.02 g/cm^3
0930 --> volume = 0.336 cm^3
0931
0932 (8-9) ICC ASICs: 1 x ("CRT245" 24 pin) + 2 x ("LVDSBUF" 16 pin)
0933 epoxy: m = ( 1 x 0.015675 + 2 x 0.038519 ) g = 0.092713 g
0934 density = 1.3 g/cm^3
0935 --> volume = 0.0713 cm^3
0936 copper: m = [ ( 1 x 0.040 + 2 x 0.076 ) - 0.092713 ) g = 0.099287 g
0937 density = 8.96 g/cm^3
0938 --> volume = 0.011 cm^3
0939
0940 (10-13) Hybrid tail (2 copies)
0941 see http://www.fynu.ucl.ac.be/he/cms/activities/tracker/FHITfiles/CCTPHybrides.pdf
0942 surface: (19 x 30) mm^2 = 570 mm^2 = 5.70 cm^2
0943 - Kapton: (25+25) um = 50 um = 0.0050 cm --> 0.0285 cm^3
0944 - Copper: (18+12+18+18+18+12) um = 96 um = 0.0096 cm --> 0.05472 cm^3
0945 - Solder Mask: 20 um = 0.0020 cm --> 0.0114 cm^3
0946 - Glue: (50+50) um = 100 um thickness = 0.0100 cm --> 0.057 cm^3
0947
0948 (14) HV pin (2 copies)
0949 module side:
0950 http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm
0951 m = 0.04 g per module
0952 ICB side:
0953 http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/ICB_MB.htm
0954 m = 0.330 g (6 HV wires) --> 0.330 g / 6 = 0.055 per module
0955 HV pin (brass CuZn36Pb3 Sn plated):
0956 m = ( 0.04 + 0.055 ) g = 0.095 g
0957 density (brass) = 8.5 g/cm^3
0958 --> volume = 0.011 cm^3
0959
0960 .......................................................................
0961 # "TOB ICC Layer 3/4 (2 APVs)" "TOB_L34_ICC2" 20.06 80.24
0962 * 1 "PCB board" "T_G10" 4.302 1 ELE
0963 * 2 "PCB copper traces" "Copper" 0.180 1 ELE
0964 * 3 "NAiS connectors" "Copper" 0.110 1 ELE
0965 * 4 "NAiS connectors" "Epoxy" 1.276 1 ELE
0966 * 5 "HV Stiffener" "T_G10" 0.032 2 CAB
0967 * 6 "ICC Resistors" "Ceramic" 0.027 1 ELE
0968 * 7 "ICC Capacitors" "Barium_Titanate" 0.336 1 ELE
0969 * 8 "ICC ASICs EMC" "Epoxy" 0.0713 1 ELE
0970 * 9 "ICC ASICs copper" "Copper" 0.011 1 ELE
0971 * 10 "Hybrid Tail Kapton" "T_Kapton" 0.028 2 ELE
0972 * 11 "Hybrid Tail Copper" "Copper" 0.055 2 ELE
0973 * 12 "Hybrid Tail Solder Mask" "T_Kapton" 0.011 2 ELE
0974 * 13 "Hybrid Tail Glue" "Epoxy" 0.057 2 ELE
0975 * 14 "HV pin (module)" "Brass" 0.011 2 ELE
0976 .......................................................................
0977 =======================================================================
0978
0979 Layer 5/6
0980 ---------
0981
0982 ICC1
0983 ----
0984 Same as Layer 3/4.
0985
0986 (15-16) Laser Diodes (1 additional copy for the L56 AOH, AOHs have only 2 copies)
0987 MISSING:m = xxx g
0988 density = xxx g/cm^3
0989 --> volume = xxx cm^3
0990 Covers (Al2O3 Aluminiumoxid, ceramic): m = 0.347 g
0991 density = 3.96525 g/cm^3
0992 --> volume = 0.0875 cm^3
0993
0994 .......................................................................
0995 # "TOB ICC Layer 5/6 (1 APV)" "TOB_L56_ICC1" 12.98 51.92
0996 * 1 "PCB board" "T_G10" 3.028 1 ELE
0997 * 2 "PCB copper traces" "Copper" 0.144 1 ELE
0998 * 3 "NAiS connectors" "Copper" 0.0722 1 ELE
0999 * 4 "NAiS connectors" "Epoxy" 0.834 1 ELE
1000 * 5 "HV Stiffener" "T_G10" 0.032 1 CAB
1001 * 6 "ICC Resistors" "Ceramic" 0.019 1 ELE
1002 * 7 "ICC Capacitors" "Barium_Titanate" 0.170 1 ELE
1003 * 8 "ICC ASICs EMC" "Epoxy" 0.042 1 ELE
1004 * 9 "ICC ASICs copper" "Copper" 0.007 1 ELE
1005 * 10 "Hybrid Tail Kapton" "T_Kapton" 0.028 1 ELE
1006 * 11 "Hybrid Tail Copper" "Copper" 0.055 1 ELE
1007 * 12 "Hybrid Tail Solder Mask" "T_Kapton" 0.011 1 ELE
1008 * 13 "Hybrid Tail Glue" "Epoxy" 0.057 1 ELE
1009 * 14 "HV pin (module)" "Brass" 0.011 1 ELE
1010 * 15 "Laser Diode" "Air" 0.0000 1 ELE
1011 * 16 "Laser Cover" "Ceramic" 0.0875 1 ELE
1012 .......................................................................
1013 =======================================================================
1014
1015 ICC2
1016 ----
1017 Same as Layer 3/4.
1018
1019 (14-15) Laser Diodes (2 additional copies for the L56 AOH, AOHs have only 2 copies)
1020 MISSING:m = xxx g
1021 density = xxx g/cm^3
1022 --> volume = xxx cm^3
1023 Covers (Al2O3 Aluminiumoxid, ceramic): m = 0.347 g
1024 density = 3.96525 g/cm^3
1025 --> volume = 0.0875 cm^3
1026
1027 .......................................................................
1028 # "TOB ICC Layer 5/6 (2 APVs)" "TOB_L56_ICC2" 20.06 80.24
1029 * 1 "PCB board" "T_G10" 4.302 1 ELE
1030 * 2 "PCB copper traces" "Copper" 0.180 1 ELE
1031 * 3 "NAiS connectors" "Copper" 0.151 1 ELE
1032 * 4 "NAiS connectors" "Epoxy" 1.736 1 ELE
1033 * 5 "HV Stiffener" "T_G10" 0.032 2 CAB
1034 * 6 "ICC Resistors" "Ceramic" 0.027 1 ELE
1035 * 7 "ICC Capacitors" "Barium_Titanate" 0.336 1 ELE
1036 * 8 "ICC ASICs EMC" "Epoxy" 0.0713 1 ELE
1037 * 9 "ICC ASICs copper" "Copper" 0.011 1 ELE
1038 * 10 "Hybrid Tail Kapton" "T_Kapton" 0.028 2 ELE
1039 * 11 "Hybrid Tail Copper" "Copper" 0.055 2 ELE
1040 * 12 "Hybrid Tail Solder Mask" "T_Kapton" 0.011 2 ELE
1041 * 13 "Hybrid Tail Glue" "Epoxy" 0.057 2 ELE
1042 * 14 "Laser Diode" "Air" 0.0000 2 ELE
1043 * 15 "Laser Cover" "Ceramic" 0.0875 2 ELE
1044 .......................................................................
1045 =======================================================================
1046
1047
1048 o AOH
1049 ---
1050
1051 MCVolume: ( 2.3 x 3.0 x 0.2 ) cm^3 = 1.38 cm^3
1052
1053 (1-2) PCBs
1054 FR4: m = 0.65 g
1055 density (T_G10) = 1.90 g/cm^3
1056 --> volume = 0.342 cm^3
1057 copper: m = 0.497 g
1058 density = 8.96 g/cm^3
1059 --> volume = 0.055 cm^3
1060
1061 (3-4) Connectors NaiS
1062 socket + header
1063 1 x ICC-AOH 30 pins (AXN330038S + AXN430330S)
1064 copper: m = 1 x (0.0865 + 0.0965) g = 0.183 g
1065 density = 8.96 g/cm^3
1066 --> volume = 0.020 cm^3
1067 resin: m = 1 x (0.1445 + 0.1547) g = 0.2992 g
1068 density (epoxy) = 1.3 g/cm^3
1069 --> volume = 0.230 cm^3
1070
1071 (5) AOH SMD Resistors, 6 x (0603) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed
1072 m = 0.0127 g
1073 density = 3.96525 g/cm^3
1074 --> volume = 0.0032 cm^3
1075
1076 (6) AOH SMD Capacitors, 3 x (0603) + 3 x (0805) mostly BaTiO3, the total mass is computed
1077 m = 0.0687 g
1078 density = 6.02 g/cm^3
1079 --> volume = 0.0114 cm^3
1080
1081 (7-8) AOH ASICs: 1 x ("LLD" 32 pin)
1082 epoxy: m = ( 1 x 0.027098 ) g = 0.027098 g
1083 density = 1.3 g/cm^3
1084 --> volume = 0.0208 cm^3
1085 copper: m = [ ( 1 x 0.070 ) - 0.027098 ) ] g = 0.042902 g
1086 density = 8.96 g/cm^3
1087 --> volume = 0.0048 cm^3
1088
1089 (9-10) Laser Diodes (2 copies per each AOH + 2 additional copies for the L56 AOH directly in TOB_L56_ICC1/2)
1090 MISSING:m = xxx g
1091 density = xxx g/cm^3
1092 --> volume = xxx cm^3
1093 Covers (Al2O3 Aluminiumoxid, ceramic): m = 0.347 g
1094 density = 3.96525 g/cm^3
1095 --> volume = 0.0875 cm^3
1096
1097 (11) 3D Label
1098 Plastic (kapton): m = 0.020 g
1099 density = 1.40 g/cm^3
1100 --> volume = 0.0143 cm^3
1101
1102
1103 .......................................................................
1104 # "TOB AOH" "TOB_AOH" 1.38 6.90
1105 * 1 "PCB board" "T_G10" 0.342 1 ELE
1106 * 2 "PCB copper traces" "Copper" 0.055 1 ELE
1107 * 3 "NAiS connectors" "Copper" 0.020 1 ELE
1108 * 4 "NAiS connectors" "Epoxy" 0.230 1 ELE
1109 * 5 "AOH Resistors" "Ceramic" 0.0032 1 ELE
1110 * 6 "AOH Capacitors" "Barium_Titanate" 0.0114 1 ELE
1111 * 7 "AOH ASICs EMC" "Epoxy" 0.0208 1 ELE
1112 * 8 "AOH ASICs copper" "Copper" 0.0048 1 ELE
1113 * 9 "Laser Diode" "Air" 0.0000 2 ELE
1114 * 10 "Laser Cover" "Ceramic" 0.0875 2 ELE
1115 * 11 "AOH 3D Label" "T_Kapton" 0.0143 1 ELE
1116 .......................................................................
1117 =======================================================================
1118
1119
1120
1121 o TOB_CCUM
1122 ---------
1123 The TOB CCUM board.
1124 Composition taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/CCUM_MB.htm
1125 MCVolume: (11.8 x 7.0 x 0.25) cm^3 = 20.65 cm^3
1126
1127 CCUM
1128 -----
1129 (1) CCUM FR4 (G10) EDMS Code EDA-00036-V1
1130 m = 13.190 g
1131 density = 1.90 g/cm^3
1132 --> volume = 6.942 cm^3
1133
1134 (2) CCUM copper traces EDMS Code EDA-00036-V1
1135 m = 2.787 g
1136 density = 8.96 g/cm^3
1137 --> volume = 0.311 cm^3
1138
1139 (3-4) CCUM NAiS connector EDMS Code EDA-00036-V1, details from http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Connectors_MB.htm
1140 socket + header CCUM-ICB 80 pins (AXN350038S + AXN480330S)
1141 copper: m = (0.2306 + 0.2574) g = 0.488 g
1142 density = 8.96 g/cm^3
1143 --> volume = 0.054 cm^3
1144 resin: m = (0.337 + 0.3882) g = 0.7259 g
1145 density (epoxy) = 1.3 g/cm^3
1146 --> volume = 0.558 cm^3
1147
1148 (5) CCUM SMD Resistors EDMS Code EDA-00036-V1, 28 x (0603), mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed
1149 m = 0.060 g
1150 density = 3.96525 g/cm^3
1151 --> volume = 0.015 cm^3
1152
1153 (6) CCUM SMD Capacitors EDMS Code EDA-00036-V1, 20 x (0805) + 3 x (1210), mostly BaTiO3, the total mass is computed
1154 m = 0.570 g
1155 density = 6.02 g/cm^3
1156 --> volume = 0.095 cm^3
1157
1158 (7-9) CCUM ASICs EDMS Code EDA-00036-V1 IC "CCU" 196 pin
1159 BGA196 (Ball Grid Array), Sn/Pb/Ag 62/36/2:
1160 m = 0.1131 g
1161 density = 8.82 g/cm^3
1162 --> volume = 0.013 cm^3
1163 epoxy: m = 0.4269 g
1164 density = 1.3 g/cm^3
1165 volume = 0.328 cm^3
1166 copper: m = (0.678 - 0.1131 - 0.4269) g = 0.138 g
1167 density = 8.96 g/cm^3
1168 --> volume = 0.015 cm^3
1169
1170 (10) Other components: araldite glue (take epoxy): 1/2 CCUM, (1/4 SCLAC), (1/4 SCACC)
1171 m = 1.05 g / 2 = 0.525 g
1172 density = 1.3 g/cm^3
1173 volume = 0.404 cm^3
1174
1175 The wires are in TOB_Conn[12/34/56]
1176
1177 ............................................................................
1178 # "TOB CCUM board" "TOB_CCUM" 20.65 82.6
1179 * 1 "CCUM board" "T_G10" 6.942 1 ELE
1180 * 2 "CCUM copper traces" "Copper" 0.311 1 ELE
1181 * 3 "CCUM-ICB NAiS connector" "Copper" 0.054 1 ELE
1182 * 4 "CCUM-ICB NAiS connector" "Epoxy" 0.558 1 ELE
1183 * 5 "CCUM Resistors" "Ceramic" 0.015 1 ELE
1184 * 6 "CCUM Capacitors" "Barium_Titanate" 0.095 1 ELE
1185 * 7 "CCUM ASICs BGA" "BGA" 0.013 1 ELE
1186 * 8 "CCUM ASICs EMC" "Epoxy" 0.328 1 ELE
1187 * 9 "CCUM ASICs copper" "Copper" 0.015 1 ELE
1188 * 10 "CCUM glue" "Epoxy" 0.404 1 ELE
1189 ............................................................................
1190 ============================================================================
1191
1192
1193 o TOB Rod Connectors (inside)
1194 ---------------------------
1195 MCVolume: (11.800 x 7.500 x 0.500) cm^3 = 44.25 cm^3
1196 All the TOB Connectors are the same (Layers 12/34/56) except the optical part.
1197
1198 Layer 1/2
1199 ----------
1200 As Layer 3/4, except optical components.
1201
1202 Optical components
1203 ------------------
1204 Different for different layers
1205 (22-24) Optical fibers
1206 masses are per AOH, multiplicity will be given by the number of AOHs
1207 AOH x ( #fibers x type ) x length_fraction
1208 length_fraction: (total_length-5) cm per each fiber is in TOB_optfib_L12
1209 2 x ( TOB_2_088 ) x 5/88 = 2 x 2 x 88 cm x 5/88 = 20 cm
1210 2 x ( TOB_2_070 ) x 5/70 = 2 x 2 x 70 cm x 5/70 = 20 cm
1211 4 x ( TOB_2_056 ) x 5/56 = 4 x 2 x 56 cm x 5/56 = 40 cm
1212 4 x ( TOB_2_035 ) x 5/35 = 4 x 2 x 35 c mx 5/35 = 40 cm
1213 Total optical fibers length: 120 cm
1214
1215 All here:
1216 3D label tags (kapton): m = [ (2 x 2) + (2 x 2) + (4 x 2) + (4 x 2) ] x 0.110 g = 24 x 0.110 g = 2.64 g
1217 density = 1.40 g/cm^3
1218 --> volume = 1.714 cm^3
1219 MU connectors (kapton): m = [ (2 x 2) + (2 x 2) + (4 x 2) + (4 x 2) ] x 0.822 g = 24 x 0.822 g = 19.728 g
1220 density = 1.40 g/cm^3
1221 --> volume = 14.091 cm^3
1222
1223 (25) Ribbon connectors (2 copies)
1224
1225 (26) Ruggedized ribbon: total length 80 mm
1226
1227 .....................................................................................
1228 # "TOB Rod Connections Layer 1/2" "TOB_CONN12" 44.25 88.5
1229 * 1 "SCLAC board" "T_G10" 0.211 1 ELE
1230 * 2 "SCLAC copper traces" "Copper" 0.007 1 ELE
1231 * 3 "CCUM wires Cu" "Copper" 0.191 2 CAB
1232 * 4 "CCUM wires Al" "Aluminium" 0.123 2 CAB
1233 * 5 "CCUM wires PEI" "Silicone_Gel" 0.203 2 CAB
1234 * 6 "CCUM wires SILTEM" "Polyethylene" 0.788 2 CAB
1235 * 7 "BUS wires Cu" "Copper" 0.740 1 CAB
1236 * 8 "BUS wires Al" "Aluminium" 0.0877 1 CAB
1237 * 9 "BUS wires PEI" "Silicone_Gel" 0.144 1 CAB
1238 * 10 "BUS wires SILTEM" "Polyethylene" 2.365 1 CAB
1239 * 11 "SCLAC glue" "Epoxy" 0.202 1 SUP
1240 * 12 "Output cable Shield" "Aluminium" 0.089 1 CAB
1241 * 13 "Output cable Sleeve" "Polyethylene" 0.642 1 CAB
1242 * 14 "Input and Output cable Tie" "T_Kapton" 0.195 1 CAB
1243 * 15 "Input and Output cable Solder Paste" "BGA" 0.038 1 CAB
1244 * 16 "ICB,LVLAC,HVLAC glue" "Epoxy" 0.181 1 SUP
1245 * 17 "ICB Solder Paste" "BGA" 0.005 1 CAB
1246 * 18 "LVLAC substrate" "T_G10" 0.242 1 ELE
1247 * 19 "LVLAC copper traces" "Copper" 0.0126 1 ELE
1248 * 20 "HVLAC substrate" "T_G10" 0.174 1 ELE
1249 * 21 "HVLAC copper traces" "Copper" 0.0036 1 ELE
1250 * 22 "Optical fibers" "Optical_Fiber" 6.362E-3 120 CAB
1251 * 23 "Optical fibers 3D label tag" "T_Kapton" 1.714 1 CAB
1252 * 24 "Optical fibers MU connectors" "T_Kapton" 14.091 1 CAB
1253 * 25 "Ribbon Connectors" "T_Ribbon12xMUConn" 12.0 2 CAB
1254 * 26 "Ruggedized ribbons" "T_RuggRibbon" 0.086 8 CAB
1255 .....................................................................................
1256 =====================================================================================
1257
1258
1259 Layer 3/4
1260 ----------
1261
1262 SCLAC
1263 -----
1264 Ladder Adapter Card
1265 Composition taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/CCUM_MB.htm
1266 EDMS Code EP 680-1174-510
1267
1268 (1) SCLAC FR4
1269 m = 0.400 g
1270 density = 1.90 g/cm^3
1271 --> volume = 0.211 cm^3
1272
1273 (2) SCLAC copper traces
1274 m = 0.061 g
1275 density = 8.96 g/cm^3
1276 --> volume = 0.007 cm^3
1277
1278
1279 Wires
1280 -----
1281
1282 Short tail (to be multiplied by 2, the difference 'long tail'-1x'short tail' will be included outside)
1283
1284 (3-6) - Connected to CCUM
1285 Shielded Twisted pair (112 mm), 9 pairs, total mass of a single wire (number of components to be multiplied by 2)
1286 + shielded twisted pair + 0.5 mm^2 Copper wire, 2 pieces 106 mm 1 piece 100 mm.
1287 Tinned copper wire 100% outside the rod.
1288 total mass; 2 copies in the mixture
1289 Copper: m = ( 0.3417 + 0.9328 + 0.4400 ) g = 1.7145 g
1290 density = 8.96 g/cm^3
1291 --> volume = 0.191 cm^3
1292 Aluminium:
1293 m = ( 0.3326 + 0 + 0 ) = 0.3326 g
1294 density = 2.7 g/cm^3
1295 --> volume = 0.123 cm^3
1296 PEI: m = ( 0.1956 + 0 + 0 ) = 0.1956 g
1297 density (silicone gel) = 0.965 g/cm^3
1298 --> volume = 0.203 cm^3
1299 SILTEM: m = ( 0 + 0.5088 + 0.240 ) g = 0.7488 g
1300 density (polyethylene) = 0.95 g/cm^3
1301 --> volume = 0.788 cm^3
1302
1303 (7-10) - Connected to BUS
1304 Shielded Twisted pair (112 mm), 4 pieces
1305 + Shielded Twisted pair (135 mm), 2 pieces
1306 + 1.0 mm^2 Copper wire, 4 pieces 112 mm
1307 + 0.5 mm^2 Copper wire, 1 piece 112 mm, 1 piece 147 mm, 1 piece 149 mm
1308 + 1.0 mm^2 Copper wire, 1 piece 290 mm, only 80 mm here, the rest outside the rod
1309 total mass; 1 only copy in the mixture
1310 Copper: m = ( 0.1519 + 0.0915 + 3.8976 + 0.4928 + 0.6468 + 0.6556 + 80/290 x 2.5230 ) g = 6.6322 g
1311 density = 8.96 g/cm^3
1312 --> volume = 0.740 cm^3
1313 Aluminium:
1314 m = ( 0.1478 + 0.0891 + 0 + 0 + 0 + 0 + 80/290 x 0 ) = 0.2369 g
1315 density = 2.7 g/cm^3
1316 --> volume = 0.0877 cm^3
1317 PEI: m = ( 0.0869 + 0.0524 + 0 + 0 + 0 + 0 + 80/290 x 0 ) = 0.1393 g
1318 density (silicone gel) = 0.965 g/cm^3
1319 --> volume = 0.144 cm^3
1320 SILTEM: m = ( 0 + 0 + 1.0752 + 0.2688 + 0.3528 + 0.3576 + 80/290 x 0.6960 ) g = 2.2464 g
1321 density (polyethylene) = 0.95 g/cm^3
1322 --> volume = 2.365 cm^3
1323
1324
1325 Other components
1326 ----------------
1327
1328 (11) Araldite glue (take epoxy): (1/2 CCUM), 1/4 SCLAC, (1/4 SCACC)
1329 m = 1.05 g / 4 = 0.2625 g
1330 density = 1.3 g/cm^3
1331 volume = 0.202 cm^3
1332
1333 (12) Output cable shield Aluminium: 1/2 here, (1/2 outside)
1334 m = 0.480 g / 2 = 0.240 g
1335 density = 2.7 g/cm^3
1336 volume = 0.089 cm^3
1337
1338 (13) Output cable sleeve (l=55 mm, ext diameter=9.5 mm, 1 piece) + (l=10 mm, ext diameter=3.0 mm, 4 pieces) Polyolefin (take polyethylene):
1339 total mass, 1/2 here, (1/2 outside)
1340 m = ( 0.90 + 0.32 ) g / 2 = 0.61 g
1341 density = 0.95 g/cm^3
1342 volume = 0.642 cm^3
1343
1344 (14) Input & Output cable tie Kapton: 2/3 here, (1/3 outside)
1345 m = 0.41 g * (2/3) = 0.273 g
1346 density = 1.40 g/cm^3
1347 volume = 0.195 cm^3
1348
1349 (15) Input & Output cable solder paste (BGA): 1/2 here, (1/2 outside)
1350 m = 0.67 g / 2 = 0.335 g
1351 density = 8.82 g/cm^3
1352 volume = 0.038 cm^3
1353
1354 (16) ICB Araldite glue (take epoxy): 1/2 CONN, (1/2 ICB)
1355 m = 0.47 g / 2 = 0.235 g
1356 density = 1.3 g/cm^3
1357 volume = 0.181 cm^3
1358
1359 (17) ICB Solder paste (BGA): (1/2 ICB), 1/2 CONN
1360 m = 0.09 g / 2 = 0.045 g
1361 density = 8.82 g/cm^3
1362 volume = 0.005 cm^3
1363
1364 LVLAC
1365 -----
1366 (18-19) LVLAC From the ICB
1367 FR4: m = 0.46 g
1368 density (T_G10) = 1.90 g/cm^3
1369 --> volume = 0.242 cm^3
1370 Copper: m = 0.113 g
1371 density = 8.96 g/cm^3
1372 --> volume = 0.0126 cm^3
1373
1374 HVLAC
1375 -----
1376 (20-21) HVLAC From the ICB
1377 FR4: m = 0.33 g
1378 density (T_G10) = 1.90 g/cm^3
1379 --> volume = 0.174 cm^3
1380 Copper: m = 0.032 g
1381 density = 8.96 g/cm^3
1382 --> volume = 0.0036 cm^3
1383
1384
1385 SCCAC
1386 -----
1387 Slow Control Cable Adapter Card
1388 Composition taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/CCUM_MB.htm
1389 2 x short tail
1390 It will go 100% outside
1391
1392 Optical components
1393 ------------------
1394 Different for different layers
1395 (22-24) Optical fibers
1396 masses are per AOH, multiplicity will be given by the number of AOHs
1397 AOH x ( #fibers x type ) x length_fraction
1398 length_fraction: (total_length-5) cm per each fiber is in TOB_optfib_L34
1399 1 x ( TOB_2_088 ) x 5/88 = 1 x 2 x 88 cm x 5/88 = 10 cm
1400 1 x ( TOB_2_070 ) x 5/70 = 1 x 2 x 70 cm x 5/70 = 10 cm
1401 2 x ( TOB_2_056 ) x 5/56 = 2 x 2 x 56 cm x 5/56 = 20 cm
1402 2 x ( TOB_2_035 ) x 5/35 = 2 x 2 x 35 c mx 5/35 = 20 cm
1403 Total optical fibers length: 60 cm
1404
1405 All here:
1406 3D label tags (kapton): m = [ (1 x 2) + (1 x 2) + (2 x 2) + (2 x 2) ] x 0.110 g = 12 x 0.110 g = 1.32 g
1407 density = 1.40 g/cm^3
1408 --> volume = 0.943 cm^3
1409 MU connectors (kapton): m = [ (1 x 2) + (1 x 2) + (2 x 2) + (2 x 2) ] x 0.822 g = 12 x 0.822 g = 9.864 g
1410 density = 1.40 g/cm^3
1411 --> volume = 7.046 cm^3
1412
1413 (25) Ribbon connectors (1 copy)
1414
1415 (26) Ruggedized ribbon: total length 40 mm
1416
1417 .....................................................................................
1418 # "TOB Rod Connections Layer 3/4" "TOB_CONN34" 44.25 88.5
1419 * 1 "SCLAC board" "T_G10" 0.211 1 ELE
1420 * 2 "SCLAC copper traces" "Copper" 0.007 1 ELE
1421 * 3 "CCUM wires Cu" "Copper" 0.191 2 CAB
1422 * 4 "CCUM wires Al" "Aluminium" 0.123 2 CAB
1423 * 5 "CCUM wires PEI" "Silicone_Gel" 0.203 2 CAB
1424 * 6 "CCUM wires SILTEM" "Polyethylene" 0.788 2 CAB
1425 * 7 "BUS wires Cu" "Copper" 0.740 1 CAB
1426 * 8 "BUS wires Al" "Aluminium" 0.0877 1 CAB
1427 * 9 "BUS wires PEI" "Silicone_Gel" 0.144 1 CAB
1428 * 10 "BUS wires SILTEM" "Polyethylene" 2.365 1 CAB
1429 * 11 "SCLAC glue" "Epoxy" 0.202 1 SUP
1430 * 12 "Output cable Shield" "Aluminium" 0.089 1 CAB
1431 * 13 "Output cable Sleeve" "Polyethylene" 0.642 1 CAB
1432 * 14 "Input and Output cable Tie" "T_Kapton" 0.195 1 CAB
1433 * 15 "Input and Output cable Solder Paste" "BGA" 0.038 1 CAB
1434 * 16 "ICB,LVLAC,HVLAC glue" "Epoxy" 0.181 1 SUP
1435 * 17 "ICB Solder Paste" "BGA" 0.005 1 CAB
1436 * 18 "LVLAC substrate" "T_G10" 0.242 1 ELE
1437 * 19 "LVLAC copper traces" "Copper" 0.0126 1 ELE
1438 * 20 "HVLAC substrate" "T_G10" 0.174 1 ELE
1439 * 21 "HVLAC copper traces" "Copper" 0.0036 1 ELE
1440 * 22 "Optical fibers" "Optical_Fiber" 6.362E-3 60 CAB
1441 * 23 "Optical fibers 3D label tag" "T_Kapton" 0.943 1 CAB
1442 * 24 "Optical fibers MU connectors" "T_Kapton" 7.046 1 CAB
1443 * 25 "Ribbon Connectors" "T_Ribbon12xMUConn" 12.0 1 CAB
1444 * 26 "Ruggedized ribbons" "T_RuggRibbon" 0.086 4 CAB
1445 .....................................................................................
1446 =====================================================================================
1447
1448
1449 Layer 5/6
1450 ----------
1451 As Layer 3/4, except optical components.
1452
1453 Optical components
1454 ------------------
1455 Different for different layers
1456 (22-24) Optical fibers
1457 masses are per AOH, multiplicity will be given by the number of AOHs
1458 AOH x ( #fibers x type ) x length_fraction
1459 length_fraction: (total_length-5) cm per each fiber is in TOB_optfib_L56
1460 1 x ( TOB_3_088 ) x 5/88 = 1 x 3 x 88 cm x 5/88 = 15 cm
1461 1 x ( TOB_3_070 ) x 5/70 = 1 x 3 x 70 cm x 5/70 = 15 cm
1462 2 x ( TOB_3_056 ) x 5/56 = 2 x 3 x 56 cm x 5/56 = 30 cm
1463 2 x ( TOB_3_035 ) x 5/35 = 2 x 3 x 35 c mx 5/35 = 30 cm
1464 Total optical fibers length: 90 cm
1465
1466 All here:
1467 3D label tags (kapton): m = [ (1 x 3) + (1 x 3) + (2 x 3) + (2 x 3) ] x 0.110 g = 18 x 0.110 g = 1.98 g
1468 density = 1.40 g/cm^3
1469 --> volume = 1.414 cm^3
1470 MU connectors (kapton): m = [ (1 x 3) + (1 x 3) + (2 x 3) + (2 x 3) ] x 0.822 g = 18 x 0.822 g = 14.796 g
1471 density = 1.40 g/cm^3
1472 --> volume = 10.569 cm^3
1473
1474 (25) Ribbon connectors (2 copies)
1475
1476 (26) Ruggedized ribbon: total length 60 mm
1477
1478 .....................................................................................
1479 # "TOB Rod Connections Layer 5/6" "TOB_CONN56" 44.25 88.5
1480 * 1 "SCLAC board" "T_G10" 0.211 1 ELE
1481 * 2 "SCLAC copper traces" "Copper" 0.007 1 ELE
1482 * 3 "CCUM wires Cu" "Copper" 0.191 2 CAB
1483 * 4 "CCUM wires Al" "Aluminium" 0.123 2 CAB
1484 * 5 "CCUM wires PEI" "Silicone_Gel" 0.203 2 CAB
1485 * 6 "CCUM wires SILTEM" "Polyethylene" 0.788 2 CAB
1486 * 7 "BUS wires Cu" "Copper" 0.740 1 CAB
1487 * 8 "BUS wires Al" "Aluminium" 0.0877 1 CAB
1488 * 9 "BUS wires PEI" "Silicone_Gel" 0.144 1 CAB
1489 * 10 "BUS wires SILTEM" "Polyethylene" 2.365 1 CAB
1490 * 11 "SCLAC glue" "Epoxy" 0.202 1 SUP
1491 * 12 "Output cable Shield" "Aluminium" 0.089 1 CAB
1492 * 13 "Output cable Sleeve" "Polyethylene" 0.642 1 CAB
1493 * 14 "Input and Output cable Tie" "T_Kapton" 0.195 1 CAB
1494 * 15 "Input and Output cable Solder Paste" "BGA" 0.038 1 CAB
1495 * 16 "ICB,LVLAC,HVLAC glue" "Epoxy" 0.181 1 SUP
1496 * 17 "ICB Solder Paste" "BGA" 0.005 1 CAB
1497 * 18 "LVLAC substrate" "T_G10" 0.242 1 ELE
1498 * 19 "LVLAC copper traces" "Copper" 0.0126 1 ELE
1499 * 20 "HVLAC substrate" "T_G10" 0.174 1 ELE
1500 * 21 "HVLAC copper traces" "Copper" 0.0036 1 ELE
1501 * 22 "Optical fibers" "Optical_Fiber" 6.362E-3 90 CAB
1502 * 23 "Optical fibers 3D label tag" "T_Kapton" 1.414 1 CAB
1503 * 24 "Optical fibers MU connectors" "T_Kapton" 10.569 1 CAB
1504 * 25 "Ribbon Connectors" "T_Ribbon12xMUConn" 12.0 2 CAB
1505 * 26 "Ruggedized ribbons" "T_RuggRibbon" 0.086 6 CAB
1506 .....................................................................................
1507 =====================================================================================
1508
1509
1510
1511 # "END" "END" 0. 0.
1512 this has to be the last line !
1513
1514
1515 [WAS
1516 o Aluminium cooling IV
1517 --------------------
1518 Al and locator piece at hybrid sides
1519 No screw !
1520 MCVolume: 1.5 x 2.8 x 0.03 cm
1521
1522 (1) Al heat spreader
1523 dimensions from EDM file CMSTKOBM0024 version 0
1524 { [ 15 x 28 ] - (8 x 8 / 2) - [ pi x (2/2)^2 ] } mm^2 x 0.300 mm
1525 = 384.8584 mm^2 x 0.300 mm = 115.4575 mm^3
1526 [WAS 0.116 cm^3]
1527 [THIS MATERIAL HAS BEEN CREATED APART
1528 (2) CF compensator
1529 dimensions from EDM file CMSTKOBM0035 version AA
1530 { [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm =
1531 = 337.46 mm^2 x 0.300 mm = 101.238 mm^3
1532 [WAS 0.15 cm^3]
1533 ]
1534 (2) CuBe/brass -> take all Cu for now:
1535 0.0044 cm^3 x 3
1536 ..................................................................
1537 # "TOB Module Cooling 4" "TOB_mod_cool4" 0.126 4.2
1538 * 1 "Al heat spreader" "Aluminium" 0.115475 1 COL
1539 * 2 "Cu locator" "Copper" 0.0044 3 SUP
1540 ..................................................................
1541 ==================================================================
1542 NO MORE NEEDED, ALL THE SPREADER ARE THE SAME
1543 ]
1544
1545
1546
1547 [WAS: o TOB_CCUM
1548 ---------
1549 Not much know at this stage, so here comes some SciFi !
1550
1551 MCVolume: 11.8 x 7 x 0.25 cm
1552
1553 Take the proposal from Marchioro with 3 instead of 2 connectors !
1554
1555 G10 32 x 32 x 1 mm -> 1.02 cm^3
1556 4 layer Cu 17 um, 50 % occ
1557 CCU in plastic housing, 15 x 15 x 1mm
1558 196 solder "balls" diameter 0.5 mm
1559 2 more plastic ship carriers, 7 x 7 x 0.3 mm
1560 4 caps, half size of 0402
1561 8 R "
1562 For connectors: take Robert's proposal NAIS 80 pin connector.
1563
1564 ......................................................................
1565 "TOB CCUM board" "TOB_CCUM" 20.65 82.6
1566 1 "CCUM board" "G10" 1.02 1 ELE
1567 2 "Copper traces" "Copper" 0.035 1 ELE
1568 3 "CCU in housing" "T_Kapton" 0.225 1 ELE
1569 4 "Solder balls" "SMD_metal" 0.01 1 ELE
1570 5 "Other chips" "T_Kapton" 0.015 2 ELE
1571 6 "Capacitors" "Alumina" 1.E-4 4 ELE
1572 7 "Resistors" "Carbon" 1.E-4 8 ELE
1573 8 "Solder" "SMD_metal" 1.E-4 12 ELE
1574 9 "Connector" "T_Kapton" 9.107E-3 80 ELE
1575 10 "Connector pins" "Copper" 8.092E-4 80 ELE
1576 .....................................................................
1577 ===================================================================== ]
1578
1579
1580
1581 [WAS: o TOB Electronics ICC1/2
1582 -----------------------
1583 Need 6 different mixtures here !
1584
1585 Don't know about cooling !! Left out for the moment
1586
1587 $$ Per ICC:
1588 (1) CF support piece: 12.5 x 3 x 0.09 cm
1589 (2-3) ICC1 card: 11.8 x 4.4 - 2*0.25*2 = 50.92 cm^2 x 0.1 cm = 5.09 cm^3 G10
1590 Cu : 4 layers a 25 um, 50 % occ => 0.26 cm^3
1591 ICC2 card: 11.8 x 6.8 - 2*0.25*2 = 79.24 cm^2 x 0.1 cm = 7.92 cm^3 G10
1592 Cu : 0.4 cm^3
1593 (4-5) Connector pairs: all NAIS
1594 per pin : Plastic: 0.01275 g -> 9.107E-3 cm^3 Kapton
1595 Cu : 7.25E-3 g -> 8.092E-4 cm^3 Cu
1596 Pins: 50 + (40+16+30)*OH
1597
1598 (6-10) Optohybrid: dimensions: 23 x 30 mm, 0.5 mm thick FR4
1599 For the rest: take information from TIB OH !!
1600 Cu : 4 layers 50 % occ, 35 um
1601
1602 Laser driver: 0.0025 cm^3 Si (1/OH)
1603 Laser diode: 0.02 cm^3 Si (1 for 2 APVs)
1604 Fiber clamps: 1.4 x 0.3 x 0.15 cm Kapton (1/OH)
1605
1606 Additional components:
1607 Kapton from hybrid to ICC: 4 x 3 x 0.01 cm -> 0.12 cm^3
1608 Cu: 2 layers 50 um 50 % occ -> 0.06 cm^3
1609 Buffers on ICC & ICB: 0.02 cm^3 Kapton, 3.1E-3 Cu
1610 1 + 1*OH
1611
1612 Capacitors large 4x7x2 mm = 0.056 cm^3
1613 2+3*OH
1614 Capacitors (0805) 2x1.25x1.25 = 3.1E-3 cm^3
1615 19*OH+3
1616 Resistors (0603) 1.15E-3 cm^3
1617 12.5*OH+3
1618 Solder: 1.E-3*(large caps) + 2.E-4*(small caps+R)
1619
1620 Layer 5/6 ICC1 (serves 1 double sided module)
1621 => 2 Optohybrids
1622 2 Kapton pigtails, 3 buffers
1623 8 large caps, 41 small caps, 28 R's
1624
1625 .................................................................
1626 "TOB electronics lay 5/6 ICC1" "TOB_ICC1" 25.96 51.92
1627 1 "CF support" "Carbon fibre str." 3.375 1 SUP
1628 2 "ICC card" "G10" 5.09 1 ELE
1629 3 "ICC traces" "Copper" 0.254 1 ELE
1630 4 "Connectors" "T_Kapton" 9.107E-3 222 ELE
1631 5 "Connectors pins" "Copper" 8.092E-4 222 ELE
1632 6 "Optohybrid" "T_FR4" 0.345 2 ELE
1633 7 "Optohybrid traces" "Copper" 0.048 2 ELE
1634 8 "Laser drivers" "Silicon" 0.0025 2 ELE
1635 9 "Laser diode" "Silicon" 0.02 4 ELE
1636 10 "Fiber clamp" "T_Kapton" 0.063 2 ELE
1637 11 "Pigtail and buffers" "T_Kapton" 0.3 1 ELE
1638 12 "Pigtail and buffers" "Copper" 0.129 1 ELE
1639 13 "Capacitors" "Alumina" 0.5751 1 ELE
1640 14 "Resistors" "Carbon" 1.15E-3 28 ELE
1641 15 "Solder" "SMD_metal" 0.022 1 ELE
1642 ................................................................
1643
1644
1645 Layer 5/6 ICC2 (serves 2 double sided module)
1646 => 4 Optohybrids
1647 4 Kapton pigtails, 5 buffers
1648 14 large caps, 79 small caps, 53 R's
1649 .................................................................
1650 "TOB electronics lay 5/6 ICC2" "TOB_ICC2" 40.12 80.24
1651 1 "CF support" "Carbon fibre str." 3.375 1 SUP
1652 2 "ICC card" "G10" 7.92 1 ELE
1653 3 "ICC traces" "Copper" 0.4 1 ELE
1654 4 "Connectors" "T_Kapton" 9.107E-3 394 ELE
1655 5 "Connectors pins" "Copper" 8.092E-4 394 ELE
1656 6 "Optohybrid G10" "T_FR4" 0.345 4 ELE
1657 7 "Optohybrid traces" "Copper" 0.048 4 ELE
1658 8 "Laser drivers" "Silicon" 0.0025 4 ELE
1659 9 "Laser diode" "Silicon" 0.02 8 ELE
1660 10 "Fiber clamp" "T_Kapton" 0.063 4 ELE
1661 11 "Pigtail and buffers" "T_Kapton" 0.58 1 ELE
1662 12 "Pigtail and buffers" "Copper" 0.256 1 ELE
1663 13 "Capacitors" "Alumina" 1.029 1 ELE
1664 14 "Resistors" "Carbon" 1.15E-3 53 ELE
1665 15 "Solder" "SMD_metal" 0.04 1 ELE
1666 .................................................................
1667
1668 Layer 7/8 ICC1 (serves 1 single sided module with 4 APVs)
1669 => 1 Optohybrids
1670 1 Kapton pigtails, 2 buffers
1671 5 large caps, 22 small caps, 16 R's
1672 .................................................................
1673 "TOB electronics lay 7/8 ICC1" "TOB_ICC3" 25.96 51.92
1674 1 "CF support" "Carbon fibre str." 3.375 1 SUP
1675 2 "ICC card" "G10" 5.09 1 ELE
1676 3 "ICC traces" "Copper" 0.254 1 ELE
1677 4 "Connectors" "T_Kapton" 9.107E-3 136 ELE
1678 5 "Connectors pins" "Copper" 8.092E-4 136 ELE
1679 6 "Optohybrid" "T_FR4" 0.345 1 ELE
1680 7 "Optohybrid traces" "Copper" 0.048 1 ELE
1681 8 "Laser drivers" "Silicon" 0.0025 1 ELE
1682 9 "Laser diode" "Silicon" 0.02 2 ELE
1683 10 "Fiber clamp" "T_Kapton" 0.063 1 ELE
1684 11 "Pigtail and buffers" "T_Kapton" 0.16 1 ELE
1685 12 "Pigtail and buffers" "Copper" 0.0662 1 ELE
1686 13 "Capacitors" "Alumina" 0.348 1 ELE
1687 14 "Resistors" "Carbon" 1.15E-3 16 ELE
1688 15 "Solder" "SMD_metal" 0.0126 1 ELE
1689 .................................................................
1690
1691 Layer 7/8 ICC2 (serves 2 single sided module with 4 APVs)
1692 => 2 Optohybrids
1693 2 Kapton pigtails, 3 buffers
1694 8 large caps, 41 small caps, 28 R's
1695 .................................................................
1696 "TOB electronics lay 7/8 ICC2" "TOB_ICC4" 40.12 80.24
1697 1 "CF support" "Carbon fibre str." 3.375 1 SUP
1698 2 "ICC card" "G10" 7.92 1 ELE
1699 3 "ICC traces" "Copper" 0.4 1 ELE
1700 4 "Connectors" "T_Kapton" 9.107E-3 222 ELE
1701 5 "Connectors pins" "Copper" 8.092E-4 222 ELE
1702 6 "Optohybrid" "T_FR4" 0.345 2 ELE
1703 7 "Optohybrid traces" "Copper" 0.048 2 ELE
1704 8 "Laser drivers" "Silicon" 0.0025 2 ELE
1705 9 "Laser diode" "Silicon" 0.02 4 ELE
1706 10 "Fiber clamp" "T_Kapton" 0.063 2 ELE
1707 11 "Pigtail and buffers" "T_Kapton" 0.3 1 ELE
1708 12 "Pigtail and buffers" "Copper" 0.129 1 ELE
1709 13 "Capacitors" "Alumina" 0.5751 1 ELE
1710 14 "Resistors" "Carbon" 1.15E-3 28 ELE
1711 15 "Solder" "SMD_metal" 0.022 1 ELE
1712 .................................................................
1713
1714 Layer 9/10 ICC1 (serves 1 single sided module with 6 APVs)
1715 => 1 Optohybrids
1716 1 Kapton pigtails, 2 buffers
1717 5 large caps, 22 small caps, 16 R's
1718 .................................................................
1719 "TOB electronics lay 9/10 ICC1" "TOB_ICC5" 25.96 51.92
1720 1 "CF support" "Carbon fibre str." 3.375 1 SUP
1721 2 "ICC card" "G10" 5.09 1 ELE
1722 3 "ICC traces" "Copper" 0.254 1 ELE
1723 4 "Connectors" "T_Kapton" 9.107E-3 136 ELE
1724 5 "Connectors pins" "Copper" 8.092E-4 136 ELE
1725 6 "Optohybrid" "T_FR4" 0.345 1 ELE
1726 7 "Optohybrid traces" "Copper" 0.048 1 ELE
1727 8 "Laser drivers" "Silicon" 0.0025 1 ELE
1728 9 "Laser diode" "Silicon" 0.02 3 ELE
1729 10 "Fiber clamp" "T_Kapton" 0.063 1 ELE
1730 11 "Pigtail and buffers" "T_Kapton" 0.16 1 ELE
1731 12 "Pigtail and buffers" "Copper" 0.0662 1 ELE
1732 13 "Capacitors" "Alumina" 0.348 1 ELE
1733 14 "Resistors" "Carbon" 1.15E-3 16 ELE
1734 15 "Solder" "SMD_metal" 0.0126 1 ELE
1735 .................................................................
1736
1737 Layer 9/10 ICC2 (serves 2 single sided module with 6 APVs)
1738 => 2 Optohybrids
1739 2 Kapton pigtails, 3 buffers
1740 8 large caps, 41 small caps, 28 R's
1741 .................................................................
1742 "TOB electronics lay 9/10 ICC2" "TOB_ICC6" 40.12 80.24
1743 1 "CF support" "Carbon fibre str." 3.375 1 SUP
1744 2 "ICC card" "G10" 7.92 1 ELE
1745 3 "ICC traces" "Copper" 0.4 1 ELE
1746 4 "Connectors" "T_Kapton" 9.107E-3 222 ELE
1747 5 "Connectors pins" "Copper" 8.092E-4 222 ELE
1748 6 "Optohybrid" "T_FR4" 0.345 2 ELE
1749 7 "Optohybrid traces" "Copper" 0.048 2 ELE
1750 8 "Laser drivers" "Silicon" 0.0025 2 ELE
1751 9 "Laser diode" "Silicon" 0.02 6 ELE
1752 10 "Fiber clamp" "T_Kapton" 0.063 2 ELE
1753 11 "Pigtail and buffers" "T_Kapton" 0.3 1 ELE
1754 12 "Pigtail and buffers" "Copper" 0.129 1 ELE
1755 13 "Capacitors" "Alumina" 0.5751 1 ELE
1756 14 "Resistors" "Carbon" 1.15E-3 28 ELE
1757 15 "Solder" "SMD_metal" 0.022 1 ELE
1758 .................................................................
1759 ================================================================= ]
1760
1761 [WAS:
1762 o TOB rod connectors (inside)
1763 ---------------------------
1764 MCVolume 11.8 x 7.5 x 0.5 cm
1765
1766 (1) CF support plate: 12.5 x 12.5 x 0.09 cm = 14.06 cm^3
1767 (2) Loose wires (Robert)
1768 Al xsection 1 mm^2
1769 For control: 10 cables with l=22cm, 10 with l=12 cm
1770 LV : 8 " l=12 cm
1771 Forget about the Polyethylene shielding, absorbed in
1772 optical connector uncertainty !
1773 (3) Optical connectors: 2 for layer 5/6, 1 for 7-10
1774 Info from Francois: 46.8 g Plastic, 8.4 g Cu
1775 OVERESTIMATE, don't believe ! take 15 cm^3 plastic
1776 .....................................................................
1777 "TOB rod connections 5/6" "TOB_CONN1" 44.25 88.5
1778 1 "Support plate" "Carbon fibre str." 14.06 1 SUP
1779 2 "Al wires" "Aluminium" 0.12 37 CAB
1780 3 "Optoconnector" "T_Kapton" 15.0 2 CAB
1781 4 "Optoconnector" "Copper" 0.446 2 CAB
1782 ....................................................................
1783 ....................................................................
1784 "TOB rod connections 7-10" "TOB_CONN2/3" 44.25 88.5
1785 1 "Support plate" "Carbon fibre str." 14.06 1 SUP
1786 2 "Al wires" "Aluminium" 0.12 37 CAB
1787 3 "Optoconnector" "T_Kapton" 15.0 1 CAB
1788 4 "Optoconnector" "Copper" 0.446 1 CAB
1789 ....................................................................
1790 ==================================================================== ]
1791
1792
1793
1794
1795
1796
1797
1798
1799
1800
1801
1802
1803
1804
1805
